Inkjet printhead integrated circuit with ink spread prevention

• US 7,556,356 B1
• Filed: 06/20/2007
• Issued: 07/07/2009
• Est. Priority Date: 07/15/1997
• Status: Expired due to Fees

• Current Assignee: Memjet Technology Ltd. (Memjet Limited)
• Original Assignee: Silverbrook Research Pty Limited
• Inventors: Silverbrook, Kia
• Primary Examiner(s): JACKSON, JUANITA DIONNE
• Application Number:
  US11/766,025
• Time in Patent Office: 748 Days
• Field of Search: 347/20, 347/44, 347/47, 347/54, 347 56- 59, 347 61- 65, 347/67, 60527-529
• US Class Current: 347/54
• CPC Class Codes: B41J 2/14427 Structure of ink jet print heads with thermal bend detached actuators

Abstract

An inkjet printhead integrated circuit includes a silicon wafer substrate that defines a plurality of ink inlet channels. An electrical drive circuitry layer is positioned on the silicon wafer substrate for connection to a suitable microprocessor. A plurality of replicated nozzle arrangements is positioned on the substrate to receive an enabling signal from the microprocessor. Each nozzle arrangement has nozzle chamber walls and a roof positioned on the nozzle chamber walls to define a nozzle chamber in fluid communication with a respective ink inlet channel with the roof defining an ink ejection port in fluid communication with the nozzle chamber and a recess about the ink ejection port to inhibit ink spread.

Claims

1. An inkjet printhead integrated circuit which comprises

a silicon wafer substrate that defines a plurality of ink inlet channels;

an electrical drive circuitry layer positioned on the silicon wafer substrate for connection to a suitable microprocessor; and

a plurality of replicated nozzle arrangements positioned on the substrate to receive an enabling signal from the microprocessor, each nozzle arrangement having nozzle chamber walls

and a roof positioned on the nozzle chamber walls to define a nozzle chamber in fluid communication with a respective ink inlet channel with the roof defining an ink ejection port in fluid communication with the nozzle chamber and a recess about the ink ejection port to inhibit ink spread.

2. An inkjet printhead as claimed in claim 1, in which the nozzle arrangements are the product of a MEMS-based fabrication technique.

3. An inkjet printhead integrated circuit as claimed in claim 1, in which the electrical drive circuitry layer incorporates an ink passivation layer.

4. An inkjet printhead integrated circuit as claimed in claim 3, in which the nozzle chamber walls and the roof of each nozzle arrangement are configured so that the nozzle chamber is rectangular in plan.

5. An inkjet printhead integrated circuit as claimed in claim 4, in which the nozzle chamber walls of each nozzle chamber include a distal end wall, a proximal end wall and a pair of opposed sidewalls.

6. An inkjet printhead integrated circuit as claimed in claim 5, in which each nozzle arrangement includes a work-transmitting structure in the form of a lever mechanism, the lever mechanism including an effort formation, a fulcrum formation and a load formation, the fulcrum formation interposed between the effort formation and the load formation, an ink ejecting member being fast with the load formation.

7. An inkjet printhead integrated circuit as claimed in claim 6, in which each nozzle arrangement includes a thermal bend actuator that defines the effort formation and which is connected to the drive circuitry to bend on receipt of an electrical drive signal and thus displace the ink ejecting member.