Micro-electromechanical integrated circuit device with laminated actuators

• US 7,556,358 B2
• Filed: 08/12/2005
• Issued: 07/07/2009
• Est. Priority Date: 10/16/1998
• Status: Expired due to Fees

• Current Assignee: Memjet Technology Ltd. (Memjet Limited)
• Original Assignee: Silverbrook Research Pty Limited
• Inventors: Silverbrook, Kia
• Primary Examiner(s): Luu; Matthew
• Assistant Examiner(s): LEGESSE, HENOK D
• Application Number:
  US11/202,217
• Publication Number:
  US 20050279090A1
• Time in Patent Office: 1,425 Days
• Field of Search: 347/20, 347/54, 347 56- 59, 347/61, 347/63
• US Class Current: 347/61
• CPC Class Codes: B41J 2/04505 aiming at correcting alignment
• CPC Class Codes: B41J 2/04516 preventing formation of satellite drops
• CPC Class Codes: B41J 2/04518 reducing costs
• CPC Class Codes: B41J 2/0452 reducing demand in current or voltage
• CPC Class Codes: B41J 2/04528 aiming at warming up the head
• CPC Class Codes: B41J 2/04541 Specific driving circuit
• CPC Class Codes: B41J 2/04543 Block driving
• CPC Class Codes: B41J 2/04553 detecting ambient temperature
• CPC Class Codes: B41J 2/04563 detecting head temperature; Ink temperature
• CPC Class Codes: B41J 2/04565 detecting heater resistance
• CPC Class Codes: B41J 2/0457 Power supply level being detected or varied
• CPC Class Codes: B41J 2/04571 detecting viscosity
• CPC Class Codes: B41J 2/04585 controlling heads based on thermal bent actuators
• CPC Class Codes: B41J 2/04588 using a specific waveform
• CPC Class Codes: B41J 2/0459 Height of the driving signal being adjusted
• CPC Class Codes: B41J 2/04591 Width of the driving signal being adjusted
• CPC Class Codes: B41J 2/04593 Dot-size modulation by changing the size of the drop
• CPC Class Codes: B41J 2/04596 Non-ejecting pulses
• CPC Class Codes: B41J 2/04598 Pre-pulse
• CPC Class Codes: B41J 2/14427 Structure of ink jet print heads with thermal bend detached actuators
• CPC Class Codes: B41J 2/1623 : bonding and adhesion
• CPC Class Codes: B41J 2/1628 : dry etching
• CPC Class Codes: B41J 2/1629 : wet etching
• CPC Class Codes: B41J 2/1631 : photolithography
• CPC Class Codes: B41J 2/1632 : machining
• CPC Class Codes: B41J 2/1635 : dividing the wafer into individual chips
• CPC Class Codes: B41J 2/1639 : sacrificial molding
• CPC Class Codes: B41J 2/1642 : thin film formation by CVD [chemical vapor deposition]
• CPC Class Codes: B41J 2/1646 : thin film formation by sputtering
• CPC Class Codes: B41J 2/1648 : Production of print heads with thermal bend detached actuators
• CPC Class Codes: B41J 2002/14491 : Electrical connection
• CPC Class Codes: B41J 25/005 : for serial printing movements superimposed to character- or line-spacing movements

Abstract

A micro-electromechanical integrated circuit includes a substrate. Drive circuitry is positioned on the substrate. The device includes a plurality of elongate actuators. Each actuator includes a fixed end portion fast with the substrate. A free end portion is spaced from the substrate. A heating circuit is connected to the drive circuitry to heat the actuator. At least a portion of the actuator is of a material having a coefficient of thermal expansion which is such that the material is capable of thermal expansion to do work. The heating circuit is positioned to generate differential thermal expansion and contraction when heated and subsequently cooled to cause reciprocal displacement of the free end portion of the actuator. Each actuator is a laminated structure having a first metal layer and a dielectric layer. The first metal layer is interposed between the dielectric layer and the substrate and defines the heating circuit.

Claims

1. A micro-electromechanical integrated circuit device that comprises

a substrate;

drive circuitry positioned on the substrate; and

a plurality of elongate actuators, each actuator comprising

a fixed end portion fast with the substrate;

a free end portion that is spaced from the substrate; and

a heating circuit that is connected to the drive circuitry to heat the actuator,

at least a portion of the actuator being of a material having a coefficient of thermal expansion which is such that the material is capable of thermal expansion to do work, the heating circuit being positioned to generate differential thermal expansion and contraction when heated and subsequently cooled to cause reciprocal displacement of the free end portion of the actuator, wherein

each actuator is a laminated structure having a first metal layer and a dielectric layer, the first metal layer being interposed between the dielectric layer and the substrate and defining the heating circuit.

2. A micro-electromechanical integrated circuit device as claimed in claim 1, in which the drive circuitry includes control logic and drive transistor circuitry portions positioned on the substrate along respective elongate regions defined on the substrate and interposed between respective actuators and the substrate.

3. A micro-electromechanical integrated circuit device as claimed in claim 2, in which each actuator has a second metal layer that is positioned so that the dielectric layer is interposed between the metal layers, said second metal layer being substantially the same as the first metal layer.

4. A micro-electromechanical integrated circuit device as claimed in claim 2, in which the metal layers and the dielectric layer project from the free end portion of each actuator to define a working member and a discontinuity is defined in the first metal layer between the heating circuit and the working member electrically to isolate the working member.

5. A micro-electromechanical integrated circuit device as claimed in claim 2, in which the control logic circuitry defines transfer register circuitry to receive control signals and drive transistor circuitry connected to the transfer register circuitry, the drive transistor circuitry being interposed between the heating circuits and the substrate and being defined by a plurality of traces that are positioned to extend transversely with respect to longitudinal axes of the actuators.

6. A micro-electromechanical integrated circuit device as claimed in claim 4, which includes a plurality of nozzle chamber structures positioned on the substrate and defining nozzle chambers and fluid ejection ports in fluid communication with respective nozzle chambers, the substrate defining a plurality of ink inlet channels in fluid communication with respective nozzle chambers, the working members being in the form of fluid ejection members positioned in respective nozzle chambers such that displacement of the actuators results in the ejection of fluid from the fluid ejection ports.

7. A micro-electromechanical integrated circuit device as claimed in claim 5, in which the first metal layer of each actuator defines a series of corrugations that extend transversely with respect to the longitudinal axis of the actuator to correspond with the traces associated with that actuator.