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Electronic device and wiring with a current induced cooling effect, and an electronic device capable of converting a temperature difference into voltage

  • US 7,556,869 B2
  • Filed: 09/09/2005
  • Issued: 07/07/2009
  • Est. Priority Date: 09/13/2004
  • Status: Expired due to Fees
First Claim
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1. A semiconductor integrated circuit having a multilayered structure, comprising:

  • a heat-generating element; and

    a CPP-CIC wiring for electrically connecting between a ground and said heat-generating element and/or between a power supply and said heat-generating element,wherein said CPP-CIC wiring comprises a columnar portion comprising thin films or layers layered in a direction perpendicular to planes of the films or layers,wherein a current flows along said columnar portion, and said CPP-CIC wiring functioning solely as a lead wire to a power supply and/or to the ground provides no electrically active function,wherein said CPP-CIC wiring includes a heat-generating interface and a heat-absorbing interface, the heat-absorbing interface being between different kinds of materials,wherein said different kinds of materials are selected from materials which produce a Peltier cooling effect at said heat-absorbing interface when a current flows therethrough, and a Peltier heating effect at said heat-generating interface when a current flows therethrough, andwherein said heat-absorbing interface is disposed such that the heat generated by said heat-generating element can be absorbed by said heat-absorbing interface.

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