Switches for shorting during MEMS etch release
First Claim
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1. A method of manufacturing a MEMS (microelectromechanical system) device, the method comprising:
- forming a first layer on a substrate;
forming a sacrificial layer on or over the first layer, the sacrificial layer configured to be removed in a removal procedure;
forming a second layer on or over the first sacrificial layer, wherein the second layer is spaced apart from the first layer; and
forming a shorting element electrically connecting the first and second layers, wherein at least a portion of the shorting element is configured to electrically connect the first and second layers after the sacrificial layer has been removed during the removal procedure, and wherein the shorting element is configured to be removed during the removal procedure.
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Abstract
A MEMS (Microelectromechanical system) device is described. The device includes a first layer on a substrate, and a sacrificial layer on or over the first layer, the first sacrificial layer being configured to be removed in a removal procedure. The device also includes a second layer on or over the first sacrificial layer, where the second layer is spaced apart from the first layer, and a shorting element electrically connecting the first and second layers, where at least a portion of the shorting element is removable in the removal procedure.
42 Citations
16 Claims
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1. A method of manufacturing a MEMS (microelectromechanical system) device, the method comprising:
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forming a first layer on a substrate; forming a sacrificial layer on or over the first layer, the sacrificial layer configured to be removed in a removal procedure; forming a second layer on or over the first sacrificial layer, wherein the second layer is spaced apart from the first layer; and forming a shorting element electrically connecting the first and second layers, wherein at least a portion of the shorting element is configured to electrically connect the first and second layers after the sacrificial layer has been removed during the removal procedure, and wherein the shorting element is configured to be removed during the removal procedure. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14)
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15. A method of manufacturing a MEMS (microelectromechanical system) device, the method comprising:
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forming a first layer on a substrate; forming a sacrificial layer on or over the first layer, the sacrificial layer configured to be removed in a removal procedure; forming a second layer on or over the first sacrificial layer, wherein the second layer is spaced apart from the first layer; forming a shorting element electrically connecting the first and second layers, wherein at least a portion of the shorting element is removable in the removal procedure; forming an array of MEMS elements, the array comprising a plurality of addressing lines; forming at least one connection pad; and forming a plurality of switches configured to selectively connect two or more of the addressing lines to the connection pad. - View Dependent Claims (16)
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Specification