Power electronic package having two substrates with multiple electronic components
First Claim
Patent Images
1. A power electronic package comprising:
- first and second high thermal conductivity insulating non-planar substrates; and
a plurality of electronic components mounted on each of the first and second high thermal conductivity insulating non-planar substrates, whereinthe first and second high thermal conductivity insulating non-planar substrates are coupled to each other at a plurality of bonding regions so that mechanical separation between the first and second high thermal conductivity insulating non-planar substrates is controlled by the number of the bonding regions, an arrangement of the bonding regions, a shape of each bonding region, and a material of the bonding regions,the mechanical separation provides a net axially-directed compressive force in the electronic components,the bonding regions include electrically inactive bonding regions,the mechanical separation of the first and second high thermal conductivity insulating non-planar substrates is controlled by the number of the electrically inactive bonding regions, an arrangement of the electrically inactive bonding regions, and a shape of each inactive bonding region,the plurality of electronic components is sandwiched between the first and second high thermal conductivity insulating non-planar substrates so that the net axially-directed compressive force is applied to each electronic component,each of the first and second high thermal conductivity insulating non-planar substrates includes a metal layer, which is disposed on the high thermal conductivity insulating non-planar substrate and opposite to the plurality of electronic components,the metal layer is made of a material that is the same as a material of the electrically inactive bonding regions,each of the bonding regions has the same height from the high thermal conductivity insulating non-planar substrate,the number of the electrically inactive bonding regions is equal to or larger than four,the electrically inactive bonding regions are arranged symmetrically with respect to a center of the high thermal conductivity insulating non-planar substrate, andeach of the electrically inactive bonding regions has a planar shape of a square with a rounded corner, the radius of which is equal to or larger than 0.6 mm, or a planar shape of a circle, the radius of which is equal to or greater than 0.6 mm.
2 Assignments
0 Petitions
Accused Products
Abstract
A power electronic package includes: first and second high thermal conductivity insulating non-planar substrates; and a plurality of electronic components mounted on each of the substrates. The substrates are coupled each other at a plurality of bonding regions so that mechanical separation between the substrates is controlled by the number of the bonding regions, an arrangement of the bonding regions, a shape of each bonding region, and a material of the bonding regions. The mechanical separation provides a net axially-directed compressive force in the electronic components.
28 Citations
36 Claims
-
1. A power electronic package comprising:
-
first and second high thermal conductivity insulating non-planar substrates; and a plurality of electronic components mounted on each of the first and second high thermal conductivity insulating non-planar substrates, wherein the first and second high thermal conductivity insulating non-planar substrates are coupled to each other at a plurality of bonding regions so that mechanical separation between the first and second high thermal conductivity insulating non-planar substrates is controlled by the number of the bonding regions, an arrangement of the bonding regions, a shape of each bonding region, and a material of the bonding regions, the mechanical separation provides a net axially-directed compressive force in the electronic components, the bonding regions include electrically inactive bonding regions, the mechanical separation of the first and second high thermal conductivity insulating non-planar substrates is controlled by the number of the electrically inactive bonding regions, an arrangement of the electrically inactive bonding regions, and a shape of each inactive bonding region, the plurality of electronic components is sandwiched between the first and second high thermal conductivity insulating non-planar substrates so that the net axially-directed compressive force is applied to each electronic component, each of the first and second high thermal conductivity insulating non-planar substrates includes a metal layer, which is disposed on the high thermal conductivity insulating non-planar substrate and opposite to the plurality of electronic components, the metal layer is made of a material that is the same as a material of the electrically inactive bonding regions, each of the bonding regions has the same height from the high thermal conductivity insulating non-planar substrate, the number of the electrically inactive bonding regions is equal to or larger than four, the electrically inactive bonding regions are arranged symmetrically with respect to a center of the high thermal conductivity insulating non-planar substrate, and each of the electrically inactive bonding regions has a planar shape of a square with a rounded corner, the radius of which is equal to or larger than 0.6 mm, or a planar shape of a circle, the radius of which is equal to or greater than 0.6 mm. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20, 21, 22, 23, 24, 25, 26, 27, 28, 29, 30, 31, 32, 33, 34, 35, 36)
-
Specification