Cantilever microprobes for contacting electronic components and methods for making such probes

• US 7,557,595 B2
• Filed: 10/30/2007
• Issued: 07/07/2009
• Est. Priority Date: 02/04/2003
• Status: Active Grant

• Current Assignee: Microfabrica Incorporated (Technoprobe S.P.A.)
• Original Assignee: Microfabrica Incorporated (Technoprobe S.P.A.)
• Inventors: Kruglick, Ezekiel J., Smalley, Dennis R., Bang, Christopher A., Chen, Richard T., Lembrikov, Pavel B.
• Primary Examiner(s): TANG, MINH NHUT
• Application Number:
  US11/929,666
• Publication Number:
  US 20080100326A1
• Time in Patent Office: 616 Days
• Field of Search: None
• US Class Current: 324/755.07
• CPC Class Codes: C25D 5/02 Electroplating of selected surface areas
• CPC Class Codes: G01R 1/0483 Sockets for un-leaded IC's having matrix type contact fields, e.g. BGA or PGA devices; Sockets for unpackaged, naked chips for IC's with connecting points around the edges only G01R1/0433
• CPC Class Codes: G01R 1/06711 Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
• CPC Class Codes: G01R 1/06716 Elastic
• CPC Class Codes: G01R 1/06727 Cantilever beams
• CPC Class Codes: G01R 1/06738 related to tip portion
• CPC Class Codes: G01R 1/06744 Microprobes, i.e. having dimensions as IC details
• CPC Class Codes: G01R 1/06755 Material aspects
• CPC Class Codes: G01R 1/07342 the body of the probe being at an angle other than perpendicular to test object, e.g. probe card
• CPC Class Codes: G01R 1/07357 with flexible bodies, e.g. buckling beams
• CPC Class Codes: G01R 3/00 Apparatus or processes specially adapted for the manufacture or maintenance of measuring instruments , e.g. of probe tips
• CPC Class Codes: G01R 31/2886 Features relating to contacting the IC under test, e.g. probe heads; chucks G01R31/2865 takes precedence, test connections, e.g. test sockets, or probes per se, G01R1/04 or G01R1/06

Abstract

Embodiments disclosed herein are directed to compliant probe structures for making temporary or permanent contact with electronic circuits and the like. In particular, embodiments are directed to various designs of cantilever-like probe structures. Some embodiments are directed to methods for fabricating such cantilever structures. In some embodiments, for example, cantilever probes have extended base structures, slide in mounting structures, multi-beam configurations, offset bonding locations to allow closer positioning of adjacent probes, compliant elements with tensional configurations, improved over travel, improved compliance, improved scrubbing capability, and/or the like.

Claims

1. A probe device for contacting an electronic component, comprising:

at least one elongated base element for mounting to a surface of a substrate;

at least one post element having a proximal end attached to the elongated base element and having a distal end, wherein the post element only partially covers the elongated base element;

a composite beam element, comprising at least three vertically spaced laterally extending beams, each beam having a distal end and a proximal end, wherein the proximal end of each beam is attached to the at least one post element, and wherein the distal end of each beam is attached to a bridge element; and

a contact element attached to the bridge element or to one of the beams of the composite beam element,

wherein a portion of the elongated base element that is uncovered by the at least one post element extends at least partially under the composite beam element.

2. The probe of claim 1 wherein the at least one post element is a single post element.

3. The probe of claim 1 wherein at least one bridging element connects at least two of the beams to one another at a position along each beam that is intermediate to the proximal end and the distal end of each beam.

4. The probe of claim 1 wherein the composite beam element comprises at least four independent beams.

5. The probe device of claim 1 additionally comprising a base connected to the at least one post element, wherein the base is configured to be slid into a mount located on the substrate.

6. The probe device of claim 1 wherein at least one of the laterally extending beams becomes narrower or becomes thinner toward its distal end.

7. A probe device for contacting an electronic component, comprising:

a base element for mounting to a surface of a substrate;

at least one post element having a proximal end attached to the base element and having a distal end;

a composite beam element, comprising at least two vertically spaced laterally extending beams, each beam having a distal end and a proximal end, wherein the proximal end of each beam is attached to the at least one post element, and wherein the distal end of each beam is attached to a bridge element; and

a contact element attached to the bridge element or to one of the beams of the composite beam element; and

an intermediate bridging element that connects at least two of the beams to one another at a position along each beam that is intermediate to the proximal end and the distal end of each beam.

8. The probe of claim 7 wherein the composite beam element comprises at least three beams and wherein the the intermediate bridging element connects the at least three beams to one another at positions along each beam that are intermediate to the proximal end and the distal end of each beam and wherein the intermediate bridging element is positioned with an orientation that is not perpendicular to an undeflected orientation of each beam.

9. The probe of claim 7 wherein a positioning and orientation of the intermediate bridging element is selected based on an analysis of an actual or theoretical stress distribution of the composite beam element when the composite beam element is deflected.

10. The probe of claim 8 wherein the positioning and orientation of the intermediate bridging element is selected to coincide with minimum stress regions in an actual or theoretical stress distribution of the composite beam element.

11. The probe of claim 8 wherein the positioning and orientation of the intermediate bridging element is selected to lower the peak stress concentrations when the composite beam element is deflected.