Configurable integrated circuit with different connection schemes

• US 7,557,609 B2
• Filed: 11/10/2006
• Issued: 07/07/2009
• Est. Priority Date: 06/30/2004
• Status: Active Grant

• Current Assignee: Altera Corporation (Intel Corporation)
• Original Assignee: Tabula Incorporated
• Inventors: Rohe, Andre, Teig, Steven
• Primary Examiner(s): Barnie, Rexford
• Assistant Examiner(s): WHITE, DYLAN C
• Application Number:
  US11/558,870
• Publication Number:
  US 20070241786A1
• Time in Patent Office: 970 Days
• Field of Search: 326 37- 41, 326/47, 716/16
• US Class Current: 326/41
• CPC Class Codes: H01L 27/0207 Geometrical layout of the components, e.g. computer aided design; custom LSI, semi-custom LSI, standard cell technique
• CPC Class Codes: H01L 27/11807 CMOS gate arrays
• CPC Class Codes: H03K 19/17736 Structural details of routing resources

Abstract

Some embodiments provide an IC with a configurable node array that has (1) two similar nodes within the interior of the array, and (2) two different connection schemes. The first connection scheme specifies a set of connections between the first node and a set of nodes in the array, while the second connection scheme specifies a second set of connections between the second node and a set of nodes in the array. The two nodes cannot connect to any nodes on the boundary of the array with any connection that is specified in any connection scheme.

Claims

1. An integrated circuit (“

IC”

) comprising;

a plurality of configurable nodes arranged in an array; and

a plurality of direct connection schemes for the plurality of said nodes, wherein each direct connection scheme for a particular node specifies a set of direct connections between the particular node and a set of nodes, wherein at least two similar nodes have two different direct connection schemes, wherein two direct connection schemes are different if they have different arrangements of direct connections, and the difference in the arrangements of direct connections is not necessitated by an absence of nodes in the array of configurable nodes that would otherwise allow the direct connection schemes to be the same.

2. The IC of claim 1, wherein a first set of direct connections in the first direct connection scheme has a symmetrical relationship with a second set of direct connections in the second direct connection scheme.

3. The IC of claim 2, wherein each particular direct connection in the first direct connection scheme has a symmetrical relationship with a particular direct connection in the second direct connection scheme.

4. The IC of claim 2, wherein a first direct connection is symmetrically related to a second direct connection when the first direct connection'"'"'s orientation is rotated by a particular angle with respect to the second direct connection.

5. The IC of claim 1, wherein said array comprises a plurality of rows and a plurality of columns, wherein at least one direct connection scheme specifies a long offset direct connection, wherein a long offset direct connection is a direct connection between two nodes that are not in the same row and column and that are separated by at least three rows or three columns.

6. The IC of claim 1, wherein the two different connection schemes comprise a first direct connection scheme and a second direct connection scheme, wherein said first direct connection scheme comprises:

a) a same set of direct connections as said second direct connection scheme; and

b) at least one additional direct connection not in the second direct connection scheme.

7. The IC of claim 1, wherein at least one of said plurality of nodes comprises a configurable logic circuit.

8. The IC of claim 1, wherein at least one of said plurality of nodes comprises a configurable interconnect circuit.

9. The IC of claim 1, wherein at least one of said plurality of nodes comprises a configurable logic circuit and a configurable interconnect circuit.

10. The IC of claim 1, wherein a direct connection comprises a set of wire segments.

11. The IC of claim 10, wherein a direct connection further comprises a buffer circuit.

12. The IC of claim 10, wherein at least one set of wire segments of a direct connection comprises at least two wire segments on at least two different wiring layers of the IC.

13. The IC of claim 12, wherein the direct connection further comprises a set of vias that connect the wire segments.

14. The IC of claim 1, wherein two nodes are similar when they have the same circuit elements in approximately the same arrangement.

15. The IC of claim 14, wherein two nodes are similar when they further have the same wiring between said corresponding circuit elements.

16. The IC of claim 1, wherein the two different direct connection schemes do not have a symmetrical relationship with each other.

17. The IC of claim 1, wherein a first direct connection scheme for a first node comprises a direct connection from the first node to a second node displaced by (i) a first distance in a first direction and (ii) a second distance in a second direction from said first node,

wherein a different second direct connection for a third node scheme does not comprise a direct connection from the third node to a fourth node that is displaced by (i) said first distance in said first direction and (ii) said second distance in said second direction from said third node, but wherein said fourth node is part of said plurality of nodes.

18. An electronic device comprising:

an integrated circuit (“

IC”

) comprising;

a) a plurality of configurable nodes arranged in an array comprising first and second nodes that are similar to each other;

b) a first direct connection scheme that specifies a first set of direct connections between the first node and a first set of nodes; and

c) a second direct connection scheme that specifies a second set of direct connections between the second node and a second set of nodes, wherein the first and second sets of direct connections are different, wherein two direct connection schemes are different if they have different arrangements of direct connections, and the difference in the arrangements is not necessitated by an absence of nodes in the array that would otherwise allow the direct connection schemes to be the same.

19. The electronic device of claim 18, wherein the first set of direct connections in the first direct connection scheme has a symmetrical relationship with the second set of direct connections in the second direct connection scheme.

20. The electronic device of claim 19, wherein each particular direct connection in the first direct connection scheme has a symmetrical relationship with a particular direct connection in the second direct connection scheme.

21. The electronic device of claim 18, wherein said first set of nodes comprises at least one node that is not aligned vertically or horizontally with said first node.

22. The electronic device of claim 21, wherein said first set of nodes comprises at least one node that is aligned vertically or horizontally with said first node.

23. An integrated circuit (“

IC”

) comprising;

a plurality of sets of circuit elements in an arrangement, wherein each of said sets comprises at least one configurable circuit;

a plurality of different direct connection schemes for said sets of circuit elements, wherein each direct connection scheme for a particular set of circuit elements specifies a set of direct connections between the particular set of circuit elements and a particular group of sets of circuit elements, wherein a direct connection scheme is an arrangement of direct connections between sets of circuit elements, and wherein different direct connection schemes have different arrangements of direct connections, wherein a direct connection does not include intervening interconnect circuits,

wherein a first direct connection scheme has a symmetrical relationship with a second direct connection scheme but is not identical to said second direct connection scheme.

24. The IC of claim 23, wherein a first particular direct connection scheme is symmetrically related to a second particular direct connection scheme when said first particular direct connection scheme has the same arrangement of direct connections as said second particular direct connection scheme, except that the arrangement has an angular offset with respect to the second particular direct connection scheme.

25. The IC of claim 23, wherein a first particular direct connection scheme is symmetrically related to a second particular direct connection scheme when said first particular direct connection scheme has the same arrangement of direct connections as said second particular direct connection scheme, except that the arrangement is reversed about an axis with respect to the second particular direct connection scheme.

26. An integrated circuit (“

IC”

) comprising;

a plurality of groups of configurable circuits;

a plurality of direct connection schemes for the plurality of the groups of configurable circuits, each direct connection scheme comprising a set of direct connections between a particular group of configurable circuits and a set of groups of configurable circuits, wherein a direct connection does not include intervening interconnect circuits, wherein the plurality of direct connection schemes comprises a first direct connection scheme for a first group of configurable circuits and a second direct connection scheme for a second group of configurable circuits,

wherein the first direct connection scheme comprises a direct connection from the first group of configurable circuits to a third group of configurable circuits displaced by (i) a first distance in a first direction and (ii) a second distance in a second direction from said first group of configurable circuits,

wherein the second direct connection scheme does not comprise a direct connection from the second group of configurable circuits to a fourth group of configurable circuits that is displaced by (i) said first distance in said first direction and (ii) said second distance in said second direction from said second group of configurable circuits, but wherein said fourth group of configurable circuits is part of said plurality of groups of configurable circuits.

27. An integrated circuit (“

IC”

) comprising;

an arrangement of configurable nodes comprising a plurality of rows and a plurality of columns; and

a plurality of direct connection schemes for the plurality of said nodes, wherein each direct connection scheme for a particular node specifies a set of direct connections between the particular node and a set of nodes, wherein at least two similar nodes have two different direct connection schemes, wherein two direct connection schemes are different if they have different arrangements of direct connections, and the difference in the arrangements of direct connections is not necessitated by an absence of nodes in the arrangement of configurable nodes that would otherwise allow the direct connection schemes to be the same.