Pick and place machine with improved component placement inspection

• US 7,559,134 B2
• Filed: 10/21/2004
• Issued: 07/14/2009
• Est. Priority Date: 11/04/2003
• Status: Expired due to Fees

• Current Assignee: CyberOptics Corporation (Nordson Corporation)
• Original Assignee: CyberOptics Corporation (Nordson Corporation)
• Inventors: Gaida, John D.
• Primary Examiner(s): TRINH, MINH N
• Application Number:
  US10/970,355
• Publication Number:
  US 20050117797A1
• Time in Patent Office: 1,727 Days
• Field of Search: 297/29, 29739-743, 29757-759, 29719-721, 29832-834, 297/05, 414/737, 414/752.1, 901/40, 294/64.1, 382146-151, 716/4, 356373-375, 356/396, 356/601, 356/602, 356/605, 356/608, 356/614, 356/369
• US Class Current: 29/720
• CPC Class Codes: H05K 13/0815 Controlling of component placement on the substrate during or after manufacturing
• CPC Class Codes: Y10T 29/4913 Assembling to base an electrical component, e.g., capacitor, etc.
• CPC Class Codes: Y10T 29/53087 with signal, scale, illuminator, or optical viewer
• CPC Class Codes: Y10T 29/53091 for work-holder for assembly or disassembly
• CPC Class Codes: Y10T 29/53178 Chip component

Abstract

Embodiments of the present invention improve upon component level inspection performed by pick and place machines. Such improvements include using a position sensitive device that measures the position of the placement head relative to the workpiece as the placement head travels towards and away from the workpiece during a placement cycle. The output of this sensor is used to selectably trigger the acquisition of the images used to measure a placement characteristic of the component placement machine.

Claims

1. A pick and place machine for placing a component upon a workpiece, the machine comprising:

a placement head configured to undergo relative motion with respect to the workpiece having at least one nozzle for releasably holding the component;

an image acquisition device coupled to the placement head disposed to acquire at least one image of a placement location on the workpiece of the component, wherein the image acquisition device employs an optical axis that is inclined relative to a plane of the workpiece; and

a position sensing device disposed to provide an output indicative of the position of the placement head relative to the workpiece;

wherein the position sensing device is a rotary encoder coupled to a shaft of the pick and place machine that rotates 360 degrees per placement and wherein the position sensing device output is used to determine the timing of at least one image acquisition.

2. The machine of claim 1, wherein the rotary encoder is a semi-circle shape.

3. The machine of claim 1, wherein the rotary encoder further comprises of an index sensor.

4. A pick and place for placing a component upon a workpiece, the machine comprising:

a placement head configured to undergo relative motion with respect to the workpiece having at least one nozzle for releasably holding the component;

an image acquisition device coupled to the placement head disposed to acquire at least one image of a placement location on the workpiece of the component, wherein the image acquisition device employs an optical axis that is inclined relative to a plane of the workpiece; and

a position sensing device disposed to provide an output indicative of the position of the placement head relative to the workpiece;

wherein the position sensing device output is used to determine the timing of at least one image acquisition and wherein the position sensing device is attached to a nozzle of the placement head to determine a vertical position of the nozzle.