Strained Si on multiple materials for bulk or SOI substrates
First Claim
1. A method of forming a semiconducting substrate comprising:
- providing a Si-containing substrate;
forming a first pad stack atop a first portion of said Si-containing substrate, said first pad stack comprising a compressive layer positioned atop said first portion of said Si-containing substrate, a first semiconducting layer atop said compressive layer and a first etch barrier atop said first semiconducting layer;
forming a second pad stack atop a second portion of said Si-containing substrate, said second pad stack comprising a tensile layer positioned atop said second portion of said Si-containing substrate, a second semiconducting layer atop said tensile layer, and a second etch baffler atop said second semiconducting layer;
etching said Si-containing substrate selective to said first etch barrier and said second etch baffler, wherein said compressive layer elastically transfers a tensile strain to said first semiconducting layer and said tensile layer elastically transfers a compressive strain to said second semiconducting layer;
removing said first etch baffler and said second etch barrier; and
forming an isolation region between said first pad stack and said second pad stack, said isolation region having an upper surface that is substantially coplanar to an upper surface of said first semiconducting layer and to an upper surface of said second semiconducting layer.
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Abstract
The present invention provides a strained-Si structure, in which the nFET regions of the structure are strained in tension and the pFET regions of the structure are strained in compression. Broadly the strained-Si structure comprises a substrate, a first layered stack atop the substrate, the first layered stack comprising a first Si-containing portion of the substrates a compressive layer atop the Si-containing portion of the substrate, and a semiconducting silicon layer atop the compressive layer; and a second layered stack atop the substrate, the second layered stack comprising a second-silicon containing layer portion of the substrate, a tensile layer atop the second Si-containing portion of the substrate, and a second semiconducting silicon-layer atop the tensile layer.
133 Citations
11 Claims
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1. A method of forming a semiconducting substrate comprising:
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providing a Si-containing substrate; forming a first pad stack atop a first portion of said Si-containing substrate, said first pad stack comprising a compressive layer positioned atop said first portion of said Si-containing substrate, a first semiconducting layer atop said compressive layer and a first etch barrier atop said first semiconducting layer; forming a second pad stack atop a second portion of said Si-containing substrate, said second pad stack comprising a tensile layer positioned atop said second portion of said Si-containing substrate, a second semiconducting layer atop said tensile layer, and a second etch baffler atop said second semiconducting layer; etching said Si-containing substrate selective to said first etch barrier and said second etch baffler, wherein said compressive layer elastically transfers a tensile strain to said first semiconducting layer and said tensile layer elastically transfers a compressive strain to said second semiconducting layer; removing said first etch baffler and said second etch barrier; and forming an isolation region between said first pad stack and said second pad stack, said isolation region having an upper surface that is substantially coplanar to an upper surface of said first semiconducting layer and to an upper surface of said second semiconducting layer. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11)
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Specification