Method for forming a silicided gate
First Claim
Patent Images
1. A method comprising:
- forming a gate layer over a semiconductor substrate;
forming a blocking layer to cover a top of the gate layer;
exposing sidewalls of the gate layer; and
siliciding the gate layer through the sidewalls of the gate layer;
where the gate layer is substantially fully silicided by a single layer of metal; and
where the blocking layer comprises silicon nitride.
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Abstract
A gate is silicided through its sides while limiting silicidation through the top of the gate. A blocking layer may be formed over the gate layer, and the sidewalls of the gate layer are exposed. A layer of metal is formed on the sidewalls of the gate and thermally treated to silicide the gate layer. The sidewalls of the gate maybe exposed through an etching process in which a silicide layer formed over the blocking layer is used as an etch mask.
7 Citations
23 Claims
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1. A method comprising:
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forming a gate layer over a semiconductor substrate; forming a blocking layer to cover a top of the gate layer; exposing sidewalls of the gate layer; and siliciding the gate layer through the sidewalls of the gate layer; where the gate layer is substantially fully silicided by a single layer of metal; and where the blocking layer comprises silicon nitride. - View Dependent Claims (2, 3)
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4. A method comprising:
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forming a gate layer over a semiconductor substrate; forming a blocking layer to cover a top of the gate layer; exposing sidewalls of the gate layer; and siliciding the gate layer through the sidewalls of the gate layer; where exposing the sidewalls comprises; forming a suicide layer over the blocking layer; and using the silicide layer as an etching mask. - View Dependent Claims (5, 6)
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7. A method comprising:
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forming a gate layer over a semiconductor substrate; forming a blocking layer to cover a top of the gate layer; exposing sidewalls of the gate layer; siliciding the gate layer through the sidewalls of the gate layer; forming active regions in the semiconductor substrate at either side of the gate structure; and forming a second blocking layer over the active regions; where the gate layer is substantially fully silicided by a single layer of metal. - View Dependent Claims (8)
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9. A method comprising:
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forming a gate layer over a semiconductor substrate; forming a blocking layer to cover a top of the gate layer; exposing sidewalls of the gate layer; and siliciding the gate layer through the sidewalls of the gate layer; where the gate layer is substantially fully silicided by a single layer of metal; and where siliciding the gate layer through the sidewalls of the gate layer comprises; forming a metal layer over the blocking layer and exposed sidewalls of the gate layer; and thermally treating the gate layer and the metal layer. - View Dependent Claims (10)
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11. A method comprising:
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forming a gate layer over a channel region for a transistor; siliciding the gate layer through sidewalls of the gate layer; and preventing silicidation through a top of the gate layer; where the gate layer is substantially fully silicided by a single layer of metal. - View Dependent Claims (12, 13, 14)
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15. A method comprising:
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forming a gate layer over a channel region for a transistor; siliciding the gate layer through sidewalls of the gate layer; limiting silicidation through a top of the gate layer, including forming a blocking layer over the gate layer; and forming a silicide layer over the blocking layer. - View Dependent Claims (16, 17)
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18. A method for forming a gate structure comprising:
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a step for forming a gate layer over a semiconductor substrate; a step for siliciding the gate layer; and a step for preventing siliciding at the top of the gate layer; where the gate layer is substantially fully silicided by a single layer of metal. - View Dependent Claims (19, 20, 21)
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22. A method for forming a gate structure comprising:
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a step for forming a gate layer over a semiconductor substrate; a step for siliciding the gate layer; a step for preventing siliciding at the top of the gate layer, including forming a blocking layer over the gate layer; and a step for forming a silicide layer over the blocking layer. - View Dependent Claims (23)
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Specification