Ion implanter with etch prevention member(s)
First Claim
1. An apparatus for doping ions into a substrate, comprising:
- a process chamber having an inner space in which an ion implantation process is performed;
a support unit positioned in the process chamber, supporting a substrate and being electrically connected to a first power source for generating a high frequency pulse;
a conductive unit separated from the support unit in such a manner that plasma associated with the ion implantation process is generated between the support unit and the conductive unit, wherein the conductive unit comprises a first etch prevention member preventing the conductive unit from being etched by a source gas used to generate the plasma; and
a power port electrically connected to a second power source and generating radio frequency (RF) power applied to the conductive unit.
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Abstract
An apparatus and method of doping ions into a substrate are disclosed and include a process chamber having an inner space in which an ion implantation process is performed, a support unit positioned in the process chamber, supporting a substrate and being electrically connected to a first power source for generating a high frequency pulse, a conductive unit separated from the support unit in such a manner that plasma associated with the ion implantation process is generated between the support unit and the conductive unit, wherein the conductive unit comprises a first etch prevention member preventing the conductive unit from being etched by a source gas used to generate the plasma, and a power port electrically connected to a second power source and generating radio frequency (RF) power applied to the conductive unit.
15 Citations
31 Claims
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1. An apparatus for doping ions into a substrate, comprising:
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a process chamber having an inner space in which an ion implantation process is performed; a support unit positioned in the process chamber, supporting a substrate and being electrically connected to a first power source for generating a high frequency pulse; a conductive unit separated from the support unit in such a manner that plasma associated with the ion implantation process is generated between the support unit and the conductive unit, wherein the conductive unit comprises a first etch prevention member preventing the conductive unit from being etched by a source gas used to generate the plasma; and a power port electrically connected to a second power source and generating radio frequency (RF) power applied to the conductive unit. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18)
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19. An apparatus for doping ions into a substrate, comprising:
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a process chamber having an inner space in which an ion implantation process is performed and comprising a first etch prevention member preventing the process chamber from being etched by a source gas associated with the ion implantation process; a support unit positioned in the process chamber, supporting a substrate, and being electrically connected to a first power source for generating a high frequency pulse; a conductive unit separated from the support unit across the inner space and comprising a second etch prevention member preventing the conductive unit from being etched by the source gas; and a power port electrically connected to a second power source generating RF power applied to the conductive unit and comprising a third etch prevention member preventing the power port from being etched by the source gas. - View Dependent Claims (20, 21, 22, 23, 24, 25, 26, 27, 28)
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29. A method of doping ions into a substrate, comprising:
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preparing a process chamber having an inner space in which a doping process is performed, the process chamber including a conductive unit having a first etch prevention member and electrically connected to a first power source for generating radio frequency (RF) power, and a support unit having a second etch prevention member at a peripheral portion thereof and electrically connected to a second power source for generating a high frequency pulse, the process chamber having a third etch prevention member along a body wall that defines the inner space therein; loading the substrate onto the support unit; introducing a source gas into the inner space of the process chamber; applying the RF power to the conductive unit and the high frequency pulse to the support unit, so that the source gas is transformed into plasma and doped into the substrate without an etching against the body wall of the process chamber, the conductive unit and the support unit. - View Dependent Claims (30, 31)
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Specification