ID label, ID tag, and ID card
First Claim
1. An article comprising:
- an antenna;
a thin film integrated circuit device including a thin film transistor and operationally connected to the antenna; and
a filling layer provided around the antenna,wherein a resin is used as the filling layer, andwherein a filler is included in the filling layer.
1 Assignment
0 Petitions
Accused Products
Abstract
In commercial products to which a non-contact type or contact type ID label or ID tag is attached and ID cards, there is fear that, due to a difference between coefficients of thermal expansion between an antenna for communication and a resin provided around the antenna, stress is applied to the resin with the larger coefficient of thermal expansion to break the resin. This contributes to decrease in manufacturing yield, lifetime, and reliability of an ID label or the like. In an article such as an ID label, an ID tag, and an ID card according to the present invention, a filler is included in a filling layer provided around an antenna forming an ID label, an ID tag, and an ID card so that the difference in coefficient of thermal expansion between the antenna and the filling layer can be reduced. This makes it possible to ease generation of stress due to the difference in coefficient of thermal expansion and prevent peeling and cracks of the filling layer.
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Citations
22 Claims
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1. An article comprising:
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an antenna; a thin film integrated circuit device including a thin film transistor and operationally connected to the antenna; and a filling layer provided around the antenna, wherein a resin is used as the filling layer, and wherein a filler is included in the filling layer. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16)
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17. An article comprising:
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a substrate; an antenna over the substrate; a thin film integrated circuit device including a thin film transistor and operationally connected to the antenna; a connecting pad operationally connecting the antenna and the thin film integrated circuit; a filling layer provided around the antenna; a wiring operationally connecting the thin film integrated circuit device and the antenna, wherein a resin is used as the filling layer, and wherein a filler is included in the filling layer. - View Dependent Claims (18)
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19. A method of manufacturing an article comprising the steps of:
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forming a thin film integrated circuit device over a substrate; operationally connecting the thin film integrated circuit device to an antenna with a filling layer interposed therebetween, wherein the thin film integrated circuit device is operationally connected to the antenna through a connecting pad, wherein a resin is used as the filling layer, and wherein a filler is included in the filling layer. - View Dependent Claims (20)
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21. A method of manufacturing an article comprising the steps of:
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forming an antenna over a first substrate; operationally connecting a thin film integrated circuit device to the antenna; attaching the first substrate to a second substrate with a first filling layer including a first filler interposed therebetween; and attaching the first substrate to a third substrate with a second filling layer including a second filler interposed therebetween, wherein the first substrate is interposed between the second and third substrates, and wherein a resin is used as either the first filling layer or the second filling layer. - View Dependent Claims (22)
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Specification