Electronic equipment
First Claim
1. Electronic equipment comprising:
- a dielectric antenna having a surface formed with a conductor pattern having a predetermined shape;
a substrate having a first surface and a second surface,said dielectric antenna being mounted on said first surface; and
a coaxial connector mounted on said second surface of said substrate;
said substrate having a ground pattern between said dielectric antenna and said coaxial connector, wherein;
said ground pattern comprises first and second ground patterns formed on said first and second surfaces of said substrate, respectively;
said first and second ground patterns being connected by a via extending through said substrate.
0 Assignments
0 Petitions
Accused Products
Abstract
The electronic equipment includes a housing accommodating an electronic circuit used in the operation of the device and a high-frequency circuit for wireless communication related to the operation of the device. A dielectric antenna is mounted on the rear surface of the housing near a lateral end thereof. Since the electronic circuit for operation and the high-frequency circuit for wireless communication are provided in the housing, it is not necessary to connect a personal computer and a mobile telephone by a cable thus making the device mobile. Further, since the dielectric antenna connected to the high-frequency circuit is mounted on the rear surface of the housing, the antenna characteristics can be improved and stabilized.
-
Citations
3 Claims
-
1. Electronic equipment comprising:
-
a dielectric antenna having a surface formed with a conductor pattern having a predetermined shape; a substrate having a first surface and a second surface, said dielectric antenna being mounted on said first surface; and a coaxial connector mounted on said second surface of said substrate; said substrate having a ground pattern between said dielectric antenna and said coaxial connector, wherein; said ground pattern comprises first and second ground patterns formed on said first and second surfaces of said substrate, respectively;
said first and second ground patterns being connected by a via extending through said substrate. - View Dependent Claims (2, 3)
-
Specification