Method of manufacture of an identification wristband construction
First Claim
Patent Images
1. A method of manufacture of a wristband comprising the steps of:
- providing a bottom substrate;
depositing first circuit elements on the bottom substrate;
curing the first circuit elements;
depositing a dielectric material on at least one predetermined area on the bottom substrate and of the cured first circuit elements;
depositing a remainder of the circuit on the bottom substrate and dielectric material;
securing an RFID integrated circuit chip to the bottom substrate to form a transponder with the first circuit elements and the remainder of the circuit; and
affixing a top substrate to the bottom substrate such that the dielectric material and transponder are disposed between the bottom substrate and top substrate.
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Abstract
A method of manufacture of a wristband includes the steps of providing a bottom substrate. First circuit elements are deposited on the bottom substrate. A dielectric material is deposited at predetermined areas on the bottom substrate. A remainder of the circuit is deposited on the bottom substrate and dielectric materials. A transponder chip is secured to the bottom substrate to form a transponder. A second substrate is affixed to the bottom substrate such that the dielectric material and transponder are disposed between the bottom substrate and second substrate.
135 Citations
12 Claims
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1. A method of manufacture of a wristband comprising the steps of:
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providing a bottom substrate; depositing first circuit elements on the bottom substrate; curing the first circuit elements; depositing a dielectric material on at least one predetermined area on the bottom substrate and of the cured first circuit elements; depositing a remainder of the circuit on the bottom substrate and dielectric material; securing an RFID integrated circuit chip to the bottom substrate to form a transponder with the first circuit elements and the remainder of the circuit; and affixing a top substrate to the bottom substrate such that the dielectric material and transponder are disposed between the bottom substrate and top substrate. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12)
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Specification