Self-aligned contacts for transistors
First Claim
1. A method comprising:
- patterning an etch-resistant material to create an opening that resides above a transistor gate structure and above areas adjacent to the transistor gate structure, wherein the transistor gate structure comprises a metal transistor gate and spacers adjacent to the metal transistor gate, wherein a top, metal portion of the transistor gate is exposed by the opening;
performing a selective etch through the opening that does not etch the transistor gate structure but does etch material that resides laterally with respect to the transistor gate structure in order to expose tops, immediately adjacent to the transistor gate structure, of drain and source regions of a diffusion layer of the transistor;
depositing conductive material that covers respective tops of the drain and source regions of the diffusion layer of the transistor to a depth that does not short the drain and source regions of the diffusion layer of the transistor;
forming a layer above the conductive material;
forming, through the layer above the conductive material, contacts to respective portions of the conductive material that cover respective tops of the drain and source regions of the diffusion layer of the transistor.
4 Assignments
0 Petitions
Accused Products
Abstract
Self-aligned contacts for transistors and methods for fabricating the contacts are described. An etch resistant material is patterned to create an opening that resides above a transistor gate structure. A selective etch is performed through the opening that does not etch the transistor gate structure but does etch material that resides laterally with respect to the transistor gate structure in order to expose tops, immediately adjacent to the transistor gate structure, of drain and source regions of a diffusion layer of the transistor. Conductive material is deposited that covers respective tops of the drain and source regions of the diffusion layer of the transistor to a depth that does not short the drain and source region of the diffusion layer of the transistor. A layer above the conductive material is formed. Contacts are formed through the layer above the conductive material to respective portions of the conductive material that cover respective tops of the drain and source regions of the diffusion layer of the transistor.
-
Citations
17 Claims
-
1. A method comprising:
-
patterning an etch-resistant material to create an opening that resides above a transistor gate structure and above areas adjacent to the transistor gate structure, wherein the transistor gate structure comprises a metal transistor gate and spacers adjacent to the metal transistor gate, wherein a top, metal portion of the transistor gate is exposed by the opening; performing a selective etch through the opening that does not etch the transistor gate structure but does etch material that resides laterally with respect to the transistor gate structure in order to expose tops, immediately adjacent to the transistor gate structure, of drain and source regions of a diffusion layer of the transistor; depositing conductive material that covers respective tops of the drain and source regions of the diffusion layer of the transistor to a depth that does not short the drain and source regions of the diffusion layer of the transistor; forming a layer above the conductive material; forming, through the layer above the conductive material, contacts to respective portions of the conductive material that cover respective tops of the drain and source regions of the diffusion layer of the transistor. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8)
-
-
9. A method comprising:
-
polishing a wafer that includes a gate, spacers adjacent to the gate, and a diffusion layer with drain and source regions, wherein the polishing stops at a top of the spacers, wherein a top, conductive portion of the gate is exposed by the polishing; removing an upper portion of the gate so that a top of the gate is recessed with respect to the top of the spacers such that a gate recess is formed; filling the gate with a protective material; patterning an etch-resistant material to create an opening that resides (1) above the spacers, (2) above the protective material, and (3) above areas adjacent to the spacers; performing a selective etch through the opening that does not etch the gate, the protective material, or the spacers, but does etch material that resides laterally with respect to the spacers in order to expose tops, immediately adjacent to the spacers, of the drain and source regions of the diffusion layer; depositing conductive material that covers respective tops of the drain and source regions of the diffusion layer to a depth that does not short the drain and source regions of the diffusion layer; forming a layer above the conductive material; forming, in the layer above the conductive material, metal lines that contact respective portions of the conductive material that cover respective tops of the drain and source regions of the diffusion layer. - View Dependent Claims (10, 11, 12, 13, 14, 15, 16, 17)
-
Specification