Cooling subsystem with easily adjustable mounting assembly

• US 7,564,683 B2
• Filed: 08/30/2007
• Issued: 07/21/2009
• Est. Priority Date: 08/30/2007
• Status: Active Grant

• Current Assignee: Dell Products LP (Dell Technologies Inc.)
• Original Assignee: Dell Products LP (Dell Technologies Inc.)
• Inventors: Hood, Charles D. III, Shepherd, Jason A.
• Primary Examiner(s): CHERVINSKY, BORIS LEO
• Application Number:
  US11/848,048
• Publication Number:
  US 20090059513A1
• Time in Patent Office: 691 Days
• Field of Search: None
• US Class Current: 361/679.47
• CPC Class Codes: G06F 1/184 Mounting of motherboards
• CPC Class Codes: G06F 1/20 Cooling means

Abstract

An apparatus for mounting a motherboard includes a mounting boss and a boss backing. The mounting boss is alignable in a first orientation with a first hole spacing in the motherboard, and alignable in a second orientation with a second hole spacing in the motherboard. The boss backing is adapted to connect with the mounting boss in the first orientation through the motherboard having the first hole spacing, and adapted to connect with the mounting boss in the second orientation through the motherboard having the second hole spacing.

Claims

1. An apparatus for mounting a cooling device on a motherboard, the apparatus comprising:

a mounting bracket adapted for physical communication with the motherboard;

a mounting boss configured to attach to the mounting bracket, the mounting boss alignable in a first orientation with a first hole spacing in the motherboard, and alignable in a second orientation with a second hole spacing in the motherboard; and

a boss backing adapted to connect through the motherboard with the mounting boss in either the first orientation or the second orientation.

2. The apparatus of claim 1 further comprising a screw configured to connect the mounting boss with the boss backing.

3. The apparatus of claim 2 further comprising a spring disposed in the mounting boss, the spring biasing the screw toward a retracted position in the mounting boss.

4. The apparatus of claim 1 wherein the mounting boss has an offset portion adapted to align with the first hole spacing in the motherboard when the mounting boss is in the first orientation, and adapted to align with the second hole spacing in the motherboard when the mounting boss is in the second orientation.

5. The apparatus of claim 1 wherein the boss backing has an offset portion adapted to align with the first hole spacing in the motherboard when the boss backing is in the first orientation, and adapted to align with the second hole spacing in the motherboard when the boss backing is in the second orientation.

6. The apparatus of claim 1 wherein the mounting boss has a hook and a notch adapted to snap fit the mounting boss to the mounting bracket.

7. The apparatus of claim 1 wherein the boss backing has a hook and a notch adapted to snap fit the boss backing to a backing plate.

8. A computer comprising:

a motherboard having an electrical component;

a mounting bracket in thermal communication with the electrical component;

a mounting boss configured to attach to the mounting bracket, the mounting boss alignable in a first orientation with a first hole spacing in the motherboard, and alignable in a second orientation with a second hole spacing in the motherboard; and

a boss backing adapted to connect through the motherboard with the mounting boss in either the first orientation or the second orientation.

9. The computer of claim 8 further comprising a screw configured to connect the mounting boss with the boss backing.

10. The computer of claim 9 further comprising a spring adapted to bias the screw toward a retracted position in the mounting boss.

11. The computer of claim 8 wherein the mounting boss has an offset portion adapted to align with the first hole spacing in the motherboard when the mounting boss is in the first orientation, and adapted to align with the second hole spacing in the motherboard when the mounting boss is in the second orientation.

12. The computer of claim 8 wherein the boss backing has an offset portion adapted to align with the first hole spacing in the motherboard when the boss backing is in the first orientation, and adapted to align with the second hole spacing in the motherboard when the boss backing is in the second orientation.

13. The computer of claim 8 wherein the mounting boss has a hook and a notch adapted to snap fit the mounting boss to the mounting bracket.

14. The computer of claim 8 wherein the boss backing has a hook and a notch adapted to snap fit the boss backing to a backing plate.

15. An apparatus for mounting a cooling device on a motherboard, the apparatus comprising:

a mounting boss alignable in a first orientation with a first hole spacing in the motherboard, and alignable in a second orientation with a second hole spacing in the motherboard; and

a boss backing adapted to connect through the motherboard with the mounting boss in either the first orientation or the second orientation.

16. The apparatus of claim 15 further comprising a screw configured to connect the mounting boss with the boss backing.

17. The apparatus of claim 15 wherein the mounting boss has an offset portion adapted to align with the first hole spacing in the motherboard when the mounting boss is in the first orientation, and adapted to align with the second hole spacing in the motherboard when the mounting boss is in the second orientation.

18. The apparatus of claim 15 wherein the boss backing has an offset portion adapted to align with the first hole spacing in the motherboard when the boss backing is in the first orientation, and adapted to align with the second hole spacing in the motherboard when the boss backing is in the second orientation.

19. The apparatus of claim 15 wherein the mounting boss has a hook and a notch adapted to snap fit the mounting boss to a mounting bracket.

20. The apparatus of claim 15 wherein the boss backing has a hook and a notch adapted to snap fit the boss backing to a backing plate.