IC card

• US 7,566,001 B2
• Filed: 08/18/2004
• Issued: 07/28/2009
• Est. Priority Date: 08/29/2003
• Status: Expired due to Fees

• Current Assignee: Semiconductor Energy Laboratory Co., Ltd.
• Original Assignee: Semiconductor Energy Laboratory Co., Ltd.
• Inventors: Yamazaki, Shunpei
• Primary Examiner(s): Koyama; Kumiko C
• Application Number:
  US10/920,352
• Publication Number:
  US 20050045729A1
• Time in Patent Office: 1,805 Days
• Field of Search: 235/375, 235/380, 235/492, 235/451, 257/635, 257/754, 257/E31.04, 438/30, 438/462
• US Class Current: 235/380
• CPC Class Codes: G06K 19/0704 the battery being rechargeable, e.g. solar batteries
• CPC Class Codes: G06K 19/072 the record carrier comprising a plurality of integrated circuit chips
• CPC Class Codes: G06K 19/0723 the record carrier comprising an arrangement for non-contact communication, e.g. wireless communication circuits on transponder cards, non-contact smart cards or RFIDs
• CPC Class Codes: G06K 19/077 Constructional details, e.g. mounting of circuits in the carrier
• CPC Class Codes: G06K 19/07703 the interface being visual
• CPC Class Codes: G06K 19/07743 External electrical contacts
• CPC Class Codes: G06K 19/07747 at least one of the integrated circuit chips being mounted as a module
• CPC Class Codes: G06K 19/07749 the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
• CPC Class Codes: H01L 2224/05599 Material
• CPC Class Codes: H01L 2224/16 of an individual bump connector
• CPC Class Codes: H01L 2224/45147 Copper (Cu) as principal constituent
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48227 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 23/5388 for flat cards, e.g. credit cards cards per se G06K19/00
• CPC Class Codes: H01L 24/45 of an individual wire connector
• CPC Class Codes: H01L 24/48 of an individual wire connector
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01015 Phosphorus [P]
• CPC Class Codes: H01L 2924/01047 Silver [Ag]
• CPC Class Codes: H01L 2924/01079 : Gold [Au]
• CPC Class Codes: H01L 2924/10253 : Silicon [Si]
• CPC Class Codes: H01L 2924/12042 : LASER
• CPC Class Codes: H01L 2924/12044 : OLED
• CPC Class Codes: H01L 2924/14 : Integrated circuits
• CPC Class Codes: H01L 2924/19041 : being a capacitor
• CPC Class Codes: H01L 2924/3025 : Electromagnetic shielding

Abstract

The present invention includes an IC card that can realize high function without increasing the size of an IC chip, and that can realize cost reduction. The IC card has a first single crystal integrated circuit, a second integrated circuit, and a display device. The second integrated circuit and the display device are each formed from a thin film semiconductor film, over a plastic substrate, and the first single crystal integrated circuit is mounted on the plastic substrate so as to be electrically connected to the second integrated circuit.

Claims

1. A card comprising:

a plastic substrate;

a first single crystal integrated circuit mounted over the plastic substrate;

a second integrated circuit mounted over the plastic substrate;

a display device mounted over the plastic substrate; and

a covering material over the first single crystal integrated circuit and the second integrated circuit,

wherein the second integrated circuit and the display device each comprise a semiconductor element;

wherein the semiconductor element comprises a polycrystalline semiconductor film;

wherein the polycrystalline semiconductor film is used as a channel formation region of the semiconductor element;

wherein the display device is an active matrix type;

wherein the first single crystal integrated circuit comprises an analog circuit and a radio frequency circuit, and the second integrated circuit comprises a digital circuit;

wherein the semiconductor element is formed over an oxide film;

wherein the oxide film is bonded to the plastic substrate with an adhesive agent;

wherein the first single crystal integrated circuit is electrically connected to the second integrated circuit; and

wherein the covering material has an opening portion which is overlapped with the display device.

2. The card according to claim 1, wherein the display device is a liquid crystal display device.

3. The card according to claim 1, wherein the display device is a light emitting device.

4. The card according to claim 1, wherein the first single crystal integrated circuit is mounted over the plastic substrate by a chip on glass method.

5. The card according to claim 1, wherein a thickness of the second integrated circuit is 1 μ

m or more and 5 μ

m or less.

6. The card according to claim 1, wherein a thickness of the card is 0.5 mm or more and 1.5 mm or less.

7. The card according to claim 1,

wherein the first single crystal integrated circuit is packed, and

wherein a mode of packaging is selected from the group consisting of Chip Size Package, Multi Chip Package, Dual In-line Package, Quad Flat Package, and Small Outline Package.

8. The card according to claim 1, wherein the oxide film is a silicon oxide film.

9. The card according to claim 1, wherein the oxide film is from 150 to 300 nm in a thickness.

10. The card according to claim 1, wherein the adhesive agent is one selected from the group consisting of a reaction-curing adhesive agent, a thermal-curing adhesive agent, a photo-curing adhesive agent such as a UV curing adhesive agent, and an anaerobic adhesive agent.

11. The card according to claim 1, wherein the first single crystal integrated circuit is electrically connected with an antenna coil.

12. A card comprising:

a plastic substrate;

a first single crystal integrated circuit mounted over the plastic substrate;

a second integrated circuit mounted over the plastic substrate;

a display device mounted over the plastic substrate; and

a covering material over the first single crystal integrated circuit and the second integrated circuit,

wherein the second integrated circuit and the display device each comprise a semiconductor element;

wherein the semiconductor element comprises a polycrystalline semiconductor film;

wherein the polycrystalline semiconductor film is used as a channel formation region of the semiconductor element;

wherein the display device is an active matrix type;

wherein the first single crystal integrated circuit comprises an analog circuit and a radio frequency circuit, and the second integrated circuit comprises a digital circuit;

wherein the first single crystal integrated circuit is electrically connected to the second integrated circuit;

wherein the semiconductor element is formed over an oxide film;

wherein the oxide film is bonded to the plastic substrate with an adhesive agent;

wherein the first single crystal integrated circuit includes an interface; and

wherein the covering material has an opening portion which is overlapped with the display device.

13. The card according to claim 12 wherein the display device is a liquid crystal display device.

14. The card according to claim 12, wherein the display device is a light emitting device.

15. The card according to claim 12, wherein the first single crystal integrated circuit is mounted over the plastic substrate by a chip on glass method.

16. The card according to claim 12, wherein a thickness of the second integrated circuit is 1 μ

m or more and 5 μ

m or less.

17. The card according to claim 12, wherein a thickness of the card is 0.5 mm or more and 1.5 mm or less.

18. The card according to claim 12,

wherein the first single crystal integrated circuit is packed, and

wherein a mode of packaging is selected from the group consisting of Chip Size Package, Multi Chip Package, Dual In-line Package, Quad Flat Package, and Small Outline Package.

19. The card according to claim claim 12, wherein the oxide film is a silicon oxide film.

20. The card according to claim claim 12, wherein the oxide film is from 150 to 300 nm in a thickness.

21. The card according to claim claim 12, wherein the adhesive agent is one selected from the group consisting of a reaction-curing adhesive agent, a thermal-curing adhesive agent, a photo-curing adhesive agent such as a UV curing adhesive agent, and an anaerobic adhesive agent.

22. The card according to claim claim 12, wherein the first single crystal integrated circuit is electrically connected with an antenna coil.

23. A card comprising:

a plastic substrate;

a first single crystal integrated circuit mounted over the plastic substrate;

a second integrated circuit mounted over the plastic substrate;

a display device mounted over the plastic substrate; and

a covering material over the first single crystal integrated circuit and the second integrated circuit,

wherein the second integrated circuit and the display device each comprise a semiconductor element;

wherein the semiconductor element comprises a polycrystalline semiconductor film;

wherein the polycrystalline semiconductor film is used as a channel formation region of the semiconductor element;

wherein the display device is an active matrix type;

wherein the first single crystal integrated circuit comprises an analog circuit and a radio frequency circuit, and the second integrated circuit comprises a digital circuit;

wherein the semiconductor element is formed over an oxide film;

wherein the oxide film is bonded to the plastic substrate with an adhesive agent;

wherein the first single crystal integrated circuit is electrically connected to the second integrated circuit;

wherein driving of the display device is controlled by the second integrated circuit; and

wherein the covering material has an opening portion which is overlapped with the display device.

24. The card according to claim 23, wherein the display device is a liquid crystal display device.

25. The card according to claim 23, wherein the display device is a light emitting device.

26. The card according to claim 23, wherein the first single crystal integrated circuit is mounted over the plastic substrate by a chip on glass method.

27. The card according to claim 23, wherein a thickness of the second integrated circuit is 1 μ

m or more and 5 μ

m or less.

28. The card according to claim 23, wherein a thickness of the card is 0.5 mm or more and 1.5 mm or less.

29. The card according to claim 23,

wherein the first single crystal integrated circuit is packed, and

wherein a mode of packaging is selected from the group consisting of Chip Size Package, Multi Chip Package, Dual In-line Package, Quad Flat Package, and Small Outline Package.

30. The card according to claim claim 23, wherein the oxide film is a silicon oxide film.

31. The card according to claim claim 23, wherein the oxide film is from 150 to 300 nm in a thickness.

32. The card according to claim claim 23, wherein the adhesive agent is one selected from the group consisting of a reaction-curing adhesive agent, a thermal-curing adhesive agent, a photo-curing adhesive agent such as a UV curing adhesive agent, and an anaerobic adhesive agent.

33. The card according to claim claim 23, wherein the first single crystal integrated circuit is electrically connected with an antenna coil.

34. A card comprising:

a plastic substrate;

a first single crystal integrated circuit mounted over the plastic substrate;

a second integrated circuit mounted over the plastic substrate;

a display device mounted over the plastic substrate; and

a covering material over the first single crystal integrated circuit and the second integrated circuit,

wherein the second integrated circuit and the display device each comprise a semiconductor element;

wherein the display device is an active matrix type;

wherein the first single crystal integrated circuit comprises an analog circuit and a radio frequency circuit, and the second integrated circuit comprises a digital circuit;

wherein the semiconductor element comprises a polycrystalline semiconductor film;

wherein the polycrystalline semiconductor film is used as a channel formation region of the semiconductor element;

wherein the semiconductor element is formed over an oxide film;

wherein the oxide film is bonded to the plastic substrate with an adhesive agent;

wherein the first single crystal integrated circuit is electrically connected to the second integrated circuit;

wherein the first single crystal integrated circuit includes an interface;

wherein driving of the display device is controlled by the second integrated circuit; and

wherein the covering material has an opening portion which is overlapped with the display device.

35. The card according to claim 34, wherein the display device is a liquid crystal display device.

36. The card according to claim 34, wherein the display device is a light emitting device.

37. The card according to claim 34, wherein the first single crystal integrated circuit is mounted over the plastic substrate by a chip on glass method.

38. The card according to claim 34, wherein a thickness of the second integrated circuit is 1 μ

m or more and 5 μ

m or less.

39. The card according to claim 34, wherein a thickness of the card is 0.5 mm or more and 1.5 mm or less.

40. The card according to claim 34,

wherein the first single crystal integrated circuit is packed, and

wherein a mode of packaging is selected from the group consisting of Chip Size Package, Multi Chip Package, Dual In-line Pack age, Quad Flat Package, and Small Outline Package.

41. The card according to claim 34, wherein the oxide film is a silicon oxide film.

42. The card according to claim 34, wherein the oxide film is from 150 to 300 nm in a thickness.

43. The card according to claim 34, wherein the adhesive agent is one selected from the group consisting of a reaction-curing adhesive agent, a thermal-curing adhesive agent, a photo-curing adhesive agent such as a UV curing adhesive agent, and an anaerobic adhesive agent.

44. The card according to claim 34, wherein the first single crystal integrated circuit is electrically connected with an antenna coil.

45. A card comprising:

a plastic substrate;

a first single crystal integrated circuit mounted over a concave portion of the plastic substrate;

a display device mounted over the plastic substrate; and

a second integrated circuit mounted over the plastic substrate,

wherein the second integrated circuit comprises a semiconductor element;

wherein the semiconductor element comprises a polycrystalline semiconductor film;

wherein the polycrystalline semiconductor film is used as a channel formation region of the semiconductor element;

wherein the display device is an active matrix type;

wherein the first single crystal integrated circuit comprises an analog circuit and a radio frequency circuit, and the second integrated circuit comprises a digital circuit;

wherein the semiconductor element is formed over an oxide film;

wherein the oxide film is bonded to the plastic substrate with an adhesive agent; and

wherein the first single crystal integrated circuit is electrically connected to the second integrated circuit.

46. The card according to claim 45, wherein the first single crystal integrated circuit is mounted over the plastic substrate by a chip on glass method.

47. The card according to claim 45, wherein a thickness of the second integrated circuit is 1 μ

m or more and 5 μ

m or less.

48. The card according to claim 45, wherein a thickness of the card is 0.5 mm or more and 1.5 mm or less.

49. The card according to claim 45,

wherein the first single crystal integrated circuit is packed, and

wherein a mode of packaging is selected from the group consisting of Chip Size Package, Multi Chip Package, Dual In-line Pack age, Quad Flat Package, and Small Outline Package.

50. The card according to claim 45, wherein the oxide film is a silicon oxide film.

51. The card according to claim 45, wherein the oxide film is from 150 to 300 nm in a thickness.

52. The card according to claim 45, wherein the adhesive agent is one selected from the group consisting of a reaction-curing adhesive agent, a thermal-curing adhesive agent, a photo-curing adhesive agent such as a UV curing adhesive agent, and an anaerobic adhesive agent.

53. The card according to claim 45, wherein the first single crystal integrated circuit is electrically connected with an antenna coil.