Securities, chip mounting product, and manufacturing method thereof

• US 7,566,010 B2
• Filed: 12/22/2004
• Issued: 07/28/2009
• Est. Priority Date: 12/26/2003
• Status: Expired due to Fees

• Current Assignee: Semiconductor Energy Laboratory Co., Ltd.
• Original Assignee: Semiconductor Energy Laboratory Co., Ltd.
• Inventors: Kato, Kiyoshi, Yamazaki, Shunpei
• Primary Examiner(s): Frech; Karl D.
• Application Number:
  US11/018,151
• Publication Number:
  US 20050146006A1
• Time in Patent Office: 1,679 Days
• Field of Search: 235/492, 235/380, 235/451, 235/486, 257/679, 257/895, 343/895
• US Class Current: 235/492
• CPC Class Codes: G06K 19/07749 the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
• CPC Class Codes: G06K 19/07758 arrangements for adhering the record carrier to further objects or living beings, functioning as an identification tag
• CPC Class Codes: G06K 19/07767 the first and second communication means being two different antennas types, e.g. dipole and coil type, or two antennas of the same kind but operating at different frequencies
• CPC Class Codes: G07D 7/01 Testing electronic circuits therein
• CPC Class Codes: H01L 23/49855 for flat-cards, e.g. credit cards cards per se G06K19/00
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Abstract

The invention provides an ID chip with reduced cost, increased impact resistance and attractive design, as well as products and the like mounting the ID chip and a manufacturing method thereof. In view of the foregoing, an integrated circuit having a semiconductor film with a thickness of 0.2 μm or less is mounted on securities including bills, belongings, containers of food and drink, and the like (hereinafter referred to as products and the like). The ID chip of the invention can be reduced in cost and increased in impact resistance as compared with a chip formed over a silicon wafer while maintaining an attractive design.

Claims

1. A chip comprising:

an integrated circuit including;

a memory cell including a semiconductor film with a thickness of 0.2 μ

m or less;

a first wiring over the semiconductor film; and

a second wiring over the semiconductor film,

wherein the semiconductor film is connected to one of the first wiring and the second wiring by disconnecting the other of the first wiring and the second wiring with laser cutting to input data to the memory cell.

2. The chip according to claim 1, wherein the semiconductor film is formed on an insulating surface over a substrate selected from the group consisting of a glass substrate, a quartz substrate, a stainless substrate, and a flexible substrate formed of a synthetic resin.

3. The chip according to claim 1, wherein the integrated circuit comprises a thin film transistor including the semiconductor film.

4. A chip comprising:

an integrated circuit including;

a non-volatile and non-rewritable memory cell including a semiconductor film with a thickness of 0.2 μ

m or less;

a first wiring over the semiconductor film; and

a second wiring over the semiconductor film,

wherein the semiconductor film is connected to one of the first wiring and the second wiring by disconnecting the other of the first wiring and the second wiring with laser cutting to input data to the non-volatile and non-rewritable memory cell, and

wherein the integrated circuit comprises the non-volatile and non-rewritable memory cell that stores the data based on variations in characteristics of the semiconductor film.

5. The chip according to claim 4, wherein the semiconductor film is formed of a crystalline semiconductor film.

6. The chip according to claim 4, wherein the semiconductor film is formed on an insulating surface over a substrate selected from the group consisting of a glass substrate, a quartz substrate, a stainless substrate, and a flexible substrate formed of a synthetic resin.

7. The chip according to claim 4, wherein the integrated circuit comprises a thin film transistor including the semiconductor film.

8. A chip mounting product comprising:

an integrated circuit including;

a memory cell including a semiconductor film with a thickness of 0.2 μ

m or less;

a first wiring over the semiconductor film; and

a second wiring over the semiconductor film,

wherein the semiconductor film is connected to one of the first wiring and the second wiring by disconnecting the other of the first wiring and the second wiring with laser cutting to input data to the memory cell.

9. The chip mounting product according to claim 8, wherein the semiconductor film is formed on an insulating surface over a substrate selected from the group consisting of a glass substrate, a quartz substrate, a stainless substrate, and a flexible substrate formed of a synthetic resin.

10. The chip mounting product according to claim 8, wherein the integrated circuit comprises a thin film transistor including the semiconductor film.

11. A chip mounting product comprising:

an integrated circuit including;

a non-volatile and non-rewritable memory cell including a semiconductor film with a thickness of 0.2 μ

m or less;

a first wiring over the semiconductor film; and

a second wiring over the semiconductor film,

wherein the semiconductor film is connected to one of the first wiring and the second wiring by disconnecting the other of the first wiring and the second wiring with laser cutting to input data to the non-volatile and non-rewritable memory cell, and

wherein the integrated circuit comprises the non-volatile and non-rewritable memory cell that stores the data based on variations in characteristics of the semiconductor film.

12. The chip mounting product according to claim 11, wherein the semiconductor film is formed of a crystalline semiconductor film.

13. The chip mounting product according to claim 11, wherein the semiconductor film is formed over an insulating surface of a substrate selected from the group consisting of a glass substrate, a quartz substrate, a stainless substrate, and a flexible substrate formed of a synthetic resin.

14. The chip mounting product according to claim 11, wherein the integrated circuit comprises a thin film transistor including the semiconductor film.

15. A manufacturing method of a chip, comprising:

forming a semiconductor film with a thickness of 0.2 μ

m or less;

crystallizing the semiconductor film to form a crystalline semiconductor film;

forming a first wiring over the crystalline semiconductor film by photolithography;

forming a second wiring and a third wiring over the crystalline semiconductor film;

forming an integrated circuit by forming a first memory cell and a second memory cell, wherein the first memory cell includes the first wiring and a first part of the crystalline semiconductor film, and wherein the second memory cell includes the second wiring, the third wiring and a second part of the crystalline semiconductor film; and

cutting one of the second wiring and the third wiring with laser to input data to the second memory cell,

wherein the first memory cell is selected by a circuit connection obtained by the first wiring.

16. The manufacturing method of a chip, according to claim 15,

wherein an antenna electrically connected to the integrated circuit is formed.

17. The manufacturing method of a chip, according to claim 16,

wherein the antenna is formed symmetrically with the integrated circuit interposed therebetween.

18. The manufacturing method of chip, according to claim 16,

wherein the antenna is formed over a second substrate;

wherein the second substrate is folded so as to interpose the integrated circuit; and

wherein the antenna is formed symmetrically with the integrated circuit interposed therebetween.

19. A manufacturing method of a chip mounting product, comprising:

forming a semiconductor film with a thickness of 0.2 μ

m or less;

crystallizing the semiconductor film to form a crystalline semiconductor film;

forming a first wiring over the crystalline semiconductor film by photolithography;

forming a second wiring and a third wiring over the crystalline semiconductor film;

forming an integrated circuit by forming a first memory cell having a circuit connection obtained by the first wiring and by forming a second memory cell having a circuit connection by the second wiring and the third wiring formed over the crystalline semiconductor film by droplet ejection; and

cutting one of the second wiring and the third wiring with laser to input data to the second memory cell.

20. The manufacturing method of a chip mounting product, according to claim 19,

wherein an antenna electrically connected to the integrated circuit is formed.

21. The manufacturing method of a chip mounting product, according to claim 20,

wherein the antenna is formed symmetrically with the integrated circuit interposed therebetween.

22. The manufacturing method of a chip mounting product, according to claim 20,

wherein the antenna is formed over a second substrate;

and

wherein the second substrate is folded so as to interpose the integrated circuit and the antenna is formed symmetrically with the integrated circuit interposed therebetween.