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Semiconductor device with a resin-sealed optical semiconductor element

  • US 7,566,588 B2
  • Filed: 10/13/2006
  • Issued: 07/28/2009
  • Est. Priority Date: 02/28/2003
  • Status: Expired due to Fees
First Claim
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1. A semiconductor device manufacturing method, comprising:

  • protecting a top surface of a cover layer with a sheet, wherein the cover layer is a part of the semiconductor device and wherein the cover layer covers a top surface of an optical semiconductor element having a light receiving part or a light emitting part; and

    sealing, thereafter, the optical semiconductor element with a sealing resin,wherein sealing the optical semiconductor element is performed using molding dies with one surface of the sheet contacting the cover layer and the other surface of the sheet contacting inner walls of the molding dies.

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