High-frequency chip packages

• US 7,566,955 B2
• Filed: 08/28/2002
• Issued: 07/28/2009
• Est. Priority Date: 08/28/2001
• Status: Expired due to Fees

• Current Assignee: Tessera, Inc. (Adeia Inc.)
• Original Assignee: Tessera, Inc. (Adeia Inc.)
• Inventors: Warner, Michael
• Primary Examiner(s): Nguyen; Thinh T
• Application Number:
  US10/488,210
• Publication Number:
  US 20050046001A1
• Time in Patent Office: 2,526 Days
• Field of Search: 257/686, 257/687, 257/678, 257/719, 257/723, 257/724, 257/777, 257/697
• US Class Current: 257/678
• CPC Class Codes: G06F 21/10 Protecting distributed programs or content, e.g. vending or licensing of copyrighted material protection in video systems or pay television H04N7/16 ; Digital rights management [DRM]
• CPC Class Codes: G06F 2221/2129 Authenticate client device independently of the user
• CPC Class Codes: H01F 17/0033 with the coil helically wound around a magnetic core
• CPC Class Codes: H01L 2223/6611 Wire connections
• CPC Class Codes: H01L 2224/05569 the external layer being disposed on a redistribution layer on the semiconductor or solid-state body
• CPC Class Codes: H01L 2224/05571 the external layer being disposed in a recess of the surface
• CPC Class Codes: H01L 2224/05573 Single external layer
• CPC Class Codes: H01L 2224/05599 Material
• CPC Class Codes: H01L 2224/08225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/12105 Bump connectors formed on an encapsulation of the semiconductor or solid-state body, e.g. bumps on chip-scale packages
• CPC Class Codes: H01L 2224/131 with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
• CPC Class Codes: H01L 2224/16145 the bodies being stacked
• CPC Class Codes: H01L 2224/16225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/16235 the bump connector connecting to a via metallisation of the item
• CPC Class Codes: H01L 2224/16265 the item being a discrete passive component
• CPC Class Codes: H01L 2224/17519 including bump connectors providing primarily thermal dissipation
• CPC Class Codes: H01L 2224/32145 the bodies being stacked
• CPC Class Codes: H01L 2224/32225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/32245 the item being metallic
• CPC Class Codes: H01L 2224/45014 Ribbon connectors, e.g. rectangular cross-section
• CPC Class Codes: H01L 2224/45015 : being circular
• CPC Class Codes: H01L 2224/45099 : Material
• CPC Class Codes: H01L 2224/451 : with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
• CPC Class Codes: H01L 2224/48091 : Arched
• CPC Class Codes: H01L 2224/48145 : the bodies being stacked
• CPC Class Codes: H01L 2224/48225 : the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/48227 : connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/4824 : Connecting between the body and an opposite side of the item with respect to the body
• CPC Class Codes: H01L 2224/4911 : the connectors being bonded to at least one common bonding area, e.g. daisy chain
• CPC Class Codes: H01L 2224/73204 : the bump connector being embedded into the layer connector
• CPC Class Codes: H01L 2224/73207 : Bump and wire connectors
• CPC Class Codes: H01L 2224/73253 : Bump and layer connectors
• CPC Class Codes: H01L 2224/73257 : Bump and wire connectors
• CPC Class Codes: H01L 2224/73265 : Layer and wire connectors
• CPC Class Codes: H01L 2224/85207 : Thermosonic bonding
• CPC Class Codes: H01L 2224/85399 : Material
• CPC Class Codes: H01L 2225/0651 : Wire or wire-like electrical connections from device to substrate
• CPC Class Codes: H01L 2225/06513 : Bump or bump-like direct electrical connections between devices, e.g. flip-chip connection, solder bumps
• CPC Class Codes: H01L 2225/06517 : Bump or bump-like direct electrical connections from device to substrate
• CPC Class Codes: H01L 2225/0652 : Bump or bump-like direct electrical connections from substrate to substrate
• CPC Class Codes: H01L 2225/06527 : Special adaptation of electrical connections, e.g. rewiring, engineering changes, pressure contacts, layout
• CPC Class Codes: H01L 2225/06541 : Conductive via connections through the device, e.g. vertical interconnects, through silicon via [TSV] manufacturing via connections per se H01L21/76898
• CPC Class Codes: H01L 2225/06551 : Conductive connections on the side of the device
• CPC Class Codes: H01L 2225/06568 : the devices decreasing in size, e.g. pyramidical stack
• CPC Class Codes: H01L 2225/06572 : Auxiliary carrier between devices, the carrier having an electrical connection structure
• CPC Class Codes: H01L 2225/06579 : TAB carriers; beam leads
• CPC Class Codes: H01L 2225/06582 : Housing for the assembly, e.g. chip scale package [CSP]
• CPC Class Codes: H01L 23/24 : solid or gel at the normal operating temperature of the device H01L23/3135 takes precedence
• CPC Class Codes: H01L 23/3107 : the device being completely enclosed
• CPC Class Codes: H01L 23/3114 : the device being a chip scale package, e.g. CSP
• CPC Class Codes: H01L 23/36 : Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks H01L23/28, H01L23/40, H01L23/42, H01L23/44, H01L23/46 take precedence; heating H01L23/345
• CPC Class Codes: H01L 23/3675 : characterised by the shape of the housing
• CPC Class Codes: H01L 23/4334 : Auxiliary members in encapsulations H01L23/49568 takes precedence
• CPC Class Codes: H01L 23/49531 : the additional leads being a wiring board
• CPC Class Codes: H01L 23/49575 : Assemblies of semiconductor devices on lead frames
• CPC Class Codes: H01L 23/49822 : Multilayer substrates multilayer metallisation on monolayer substrate H01L23/498
• CPC Class Codes: H01L 23/49838 : Geometry or layout
• CPC Class Codes: H01L 23/49861 : Lead-frames fixed on or encapsulated in insulating substrates H01L23/4985, H01L23/49805 take precedence
• CPC Class Codes: H01L 23/5387 : Flexible insulating substrates H01L23/5388 takes precedence
• CPC Class Codes: H01L 23/552 : Protection against radiation, e.g. light or electromagnetic waves
• CPC Class Codes: H01L 23/645 : Inductive arrangements H01L23/647, H01L23/66 take precedence
• CPC Class Codes: H01L 24/05 : of an individual bonding area
• CPC Class Codes: H01L 24/16 : of an individual bump connector
• CPC Class Codes: H01L 24/17 : of a plurality of bump connectors
• CPC Class Codes: H01L 24/32 : of an individual layer connector
• CPC Class Codes: H01L 24/45 : of an individual wire connector
• CPC Class Codes: H01L 24/48 : of an individual wire connector
• CPC Class Codes: H01L 24/49 : of a plurality of wire connectors
• CPC Class Codes: H01L 24/50 : Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto thin flexible metallic tape with or without a film carrier H01L23/49572, flexible insulating substrates H01L23/4985, H01L23/5387
• CPC Class Codes: H01L 24/73 : Means for bonding being of different types provided for in two or more of groups H01L24/10, H01L24/18, H01L24/26, H01L24/34, H01L24/42, H01L24/50, H01L24/63, H01L24/71
• CPC Class Codes: H01L 24/86 : using tape automated bonding [TAB]
• CPC Class Codes: H01L 25/0652 : the devices being arranged next and on each other, i.e. mixed assemblies
• CPC Class Codes: H01L 25/0657 : Stacked arrangements of devices
• CPC Class Codes: H01L 25/16 : the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
• CPC Class Codes: H01L 2924/00 : Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00012 : Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00014 : the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01005 : Boron [B]
• CPC Class Codes: H01L 2924/01006 : Carbon [C]
• CPC Class Codes: H01L 2924/01007 : Nitrogen [N]
• CPC Class Codes: H01L 2924/01013 : Aluminum [Al]
• CPC Class Codes: H01L 2924/01014 : Silicon [Si]
• CPC Class Codes: H01L 2924/01023 : Vanadium [V]
• CPC Class Codes: H01L 2924/01027 : Cobalt [Co]
• CPC Class Codes: H01L 2924/01028 : Nickel [Ni]
• CPC Class Codes: H01L 2924/01029 : Copper [Cu]
• CPC Class Codes: H01L 2924/01031 : Gallium [Ga]
• CPC Class Codes: H01L 2924/01033 : Arsenic [As]
• CPC Class Codes: H01L 2924/01047 : Silver [Ag]
• CPC Class Codes: H01L 2924/0105 : Tin [Sn]
• CPC Class Codes: H01L 2924/01061 : Promethium [Pm]
• CPC Class Codes: H01L 2924/01075 : Rhenium [Re]
• CPC Class Codes: H01L 2924/01078 : Platinum [Pt]
• CPC Class Codes: H01L 2924/01079 : Gold [Au]
• CPC Class Codes: H01L 2924/01082 : Lead [Pb]
• CPC Class Codes: H01L 2924/01322 : Eutectic Alloys, i.e. obtained by a liquid transforming into two solid phases
• CPC Class Codes: H01L 2924/01327 : Intermediate phases, i.e. intermetallics compounds
• CPC Class Codes: H01L 2924/014 : Solder alloys
• CPC Class Codes: H01L 2924/10253 : Silicon [Si]
• CPC Class Codes: H01L 2924/12042 : LASER
• CPC Class Codes: H01L 2924/15311 : being a ball array, e.g. BGA
• CPC Class Codes: H01L 2924/1532 : the connection portion being formed on the die mounting surface of the substrate
• CPC Class Codes: H01L 2924/15331 : being a ball array, e.g. BGA
• CPC Class Codes: H01L 2924/15787 : Ceramics, e.g. crystalline carbides, nitrides or oxides
• CPC Class Codes: H01L 2924/16152 : Cap comprising a cavity for hosting the device, e.g. U-shaped cap
• CPC Class Codes: H01L 2924/19011 : including integrated passive components
• CPC Class Codes: H01L 2924/19041 : being a capacitor
• CPC Class Codes: H01L 2924/19042 : being an inductor
• CPC Class Codes: H01L 2924/19043 : being a resistor
• CPC Class Codes: H01L 2924/19103 : interposed between the semiconductor or solid-state device and the die mounting substrate, i.e. chip-on-passive
• CPC Class Codes: H01L 2924/19104 : on the semiconductor or solid-state device, i.e. passive-on-chip
• CPC Class Codes: H01L 2924/19105 : in a side-by-side arrangement on a common die mounting substrate
• CPC Class Codes: H01L 2924/19107 : off-chip wires
• CPC Class Codes: H01L 2924/207 : Diameter ranges
• CPC Class Codes: H01L 2924/30105 : Capacitance
• CPC Class Codes: H01L 2924/30107 : Inductance
• CPC Class Codes: H01L 2924/3011 : Impedance
• CPC Class Codes: H01L 2924/3025 : Electromagnetic shielding
• CPC Class Codes: H03H 2009/0019 : Surface acoustic wave multichip
• CPC Class Codes: H03H 9/0542 : consisting of a lateral arrangement H03H9/0566 takes precedence
• CPC Class Codes: H03H 9/0547 : consisting of a vertical arrangement H03H9/0566 takes precedence
• CPC Class Codes: H03H 9/1064 : for surface acoustic wave [SAW] devices
• CPC Class Codes: Y04S 40/20 : Information technology specific aspects, e.g. CAD, simulation, modelling, system security

Abstract

A packaged semiconductor chip includes features such as a chip carrier having a large thermal conductor which can be solder-bonded to a circuit board so as to provide enhanced thermal conductivity to the circuit board and electromagnetic shielding and a conductive enclosure which partially or completely surrounds the packaged chip to provide additional heat dissipation and shielding. The packaged unit may include both an active semiconductor chip and a passive element, desirably in the form of a chip, which includes resistors and capacitors. Inductors may be provided in whole or in part on the chip carrier. A module includes two circuits and an enclosure with a medial wall between the circuits to provide electromagnetic shielding between the circuits.

Claims

1. A packaged semiconductor chip comprising:

(a) a first semiconductor chip having an upwardly-facing front face, a downwardly-facing rear face, edges bounding said faces and contacts exposed at said front face, said first semiconductor chip including active components;

(b) a connecting element including passive components, said connecting element being electrically connected to at least some of said contacts, said connecting element overlying said front face of said first chip and projecting outwardly beyond said edges of said first chip;

(c) a chip carrier disposed below said rear face of said first chip, said chip carrier having a bottom surface facing downwardly away from said first chip and having a plurality of terminals exposed at said bottom surface, at least some of said terminals being electrically connected to at least some of said contacts of said first chip through said connecting element; and

(d) deformable leads connecting said terminals to said connecting element.

3. A packaged semiconductor chip as claimed in claim 1 or 2, wherein said deformable leads are formed integrally with said terminals.

4. A packaged chip as claimed in claim 1 or 2 wherein said connecting element projects beyond said edges of said first chip.

5. A packaged chip as claimed in claim 1 or 2 further comprising a hollow can encompassing said first chip, said can having a top wall extending above said first chip and having side walls extending downwardly from said top wall.

6. A packaged chip as claimed in claim 5 wherein said side walls of said can are attached to said chip carrier.

7. A packaged chip as claimed in claim 5 wherein said side walls of said can extend outside of the periphery of said chip carrier.

8. A packaged chip as claimed in claim 1 or 2 wherein said first chip includes active semiconductor components.

9. A packaged chip as claimed in claim 8 wherein said passive components in said connecting element include at least one passive component selected from the group consisting of resistors and capacitors.

10. A packaged chip as claimed in claim 9 further comprising at least one inductor formed at least in part on said chip carrier.

11. A packaged chip as claimed in claim 1 or 2 further comprising an electrically conductive enclosure element overlying said connecting element.

12. A packaged chip as claimed in claim 11 wherein said enclosure element is a hollow can having a rear wall overlying said connecting element and having side walls extending downwardly to the vicinity of said chip carrier.

13. A packaged chip as claimed in claim 1 or 2 wherein said chip carrier is a sheet-like element having thickness in the vertical direction less than about 150 microns.

14. A packaged chip as claimed in claim 13 wherein said chip carrier includes a thermal conductor underlying at least a major portion of said rear face of said first chip, said thermal conductor being in thermal communication with said first chip, said thermal conductor being exposed at said bottom surface of said chip carrier.

15. A packaged chip as claimed in claim 14 wherein said thermal conductor and said terminals are adapted for surface mounting to a circuit board.

16. A packaged chip as claimed in claim 1 or 2 wherein said chip carrier includes peripheral portions extending outwardly beyond the edges of said first semiconductor chip, all of said terminals being disposed in said peripheral portions.

17. A packaged chip as claimed in claim 1 or 2 wherein said connecting element is a second semiconductor chip.

18. A packaged chip as claimed in claim 17 wherein said first semiconductor chip and said second semiconductor chip include different semiconductor materials.

19. A packaged chip as claimed in claim 17 wherein said second semiconductor chip has minimum feature size larger than the minimum feature size of said first semiconductor chip.

20. A packaged semiconductor chip as claimed in claim 1 or 2 wherein said first semiconductor chip is a radio frequency power amplification chip.

2. A packaged semiconductor chip comprising:

(a) a first semiconductor chip having an upwardly-facing front face, a downwardly-facing rear face, edges bounding said faces and contacts exposed at said front face, said first semiconductor chip including active components;

(b) a connecting element including passive components, said connecting element being electrically connected to at least some of said contacts, said connecting element overlying said front face of said first chip and projecting outwardly beyond said edges of said first chip;

(c) a chip carrier disposed below said rear face of said first chip, said chip carrier having a bottom surface facing downwardly away from said first chip and having a plurality of terminals exposed at said bottom surface, at least some of said terminals being electrically connected to at least some of said contacts of said first chip through said connecting element, wherein said chip carrier includes a dielectric element having an exposed surface defining said bottom surface of said chip carrier and said terminals are exposed at said bottom surface within openings in said dielectric element; and

(d) deformable leads connecting said terminals to said connecting element.

21. A packaged semiconductor chip as claimed in claim 2, wherein contact surfaces of said terminals are separated from said bottom surface of said chip carrier by said dielectric element.