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Biosensor with smart card configuration

  • US 7,566,968 B2
  • Filed: 08/04/2005
  • Issued: 07/28/2009
  • Est. Priority Date: 02/05/2003
  • Status: Active Grant
First Claim
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1. A biosensor comprising:

  • a semiconductor chip including a bioactive structure and contact areas disposed on a first side of the semiconductor chip; and

    a rewiring substrate including contact pads, external contact areas and rewiring lines that electrically connect the contact pads to the external contact areas;

    wherein the rewiring substrate is directly positioned on and covers a portion of the first side of the semiconductor chip without covering the bioactive structure such that the rewiring substrate overlaps the contact areas of the semiconductor chip, and the contact pads of the rewriting substrate and the contact areas of the semiconductor chip are positioned directly on, aligned with and electrically connected to each other.

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