Biosensor with smart card configuration
First Claim
1. A biosensor comprising:
- a semiconductor chip including a bioactive structure and contact areas disposed on a first side of the semiconductor chip; and
a rewiring substrate including contact pads, external contact areas and rewiring lines that electrically connect the contact pads to the external contact areas;
wherein the rewiring substrate is directly positioned on and covers a portion of the first side of the semiconductor chip without covering the bioactive structure such that the rewiring substrate overlaps the contact areas of the semiconductor chip, and the contact pads of the rewriting substrate and the contact areas of the semiconductor chip are positioned directly on, aligned with and electrically connected to each other.
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Accused Products
Abstract
A biosensor that has a smart card configuration includes a semiconductor chip including a bioactive structure and contact areas disposed on a first side of the semiconductor chip, and a rewiring substrate including contact pads, external contact areas and rewiring lines that electrically connect the contact pads to the external contact areas. The rewiring substrate covers a portion of the first side of the semiconductor chip without covering the bioactive structure, such that the rewiring substrate overlaps the contact areas of the semiconductor chip and the contact pads and the contact areas are aligned with and electrically connect to each other. In addition, a measuring apparatus is configured to receive the biosensor and conduct measurements of a fluid medium that is delivered into the measuring apparatus.
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Citations
10 Claims
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1. A biosensor comprising:
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a semiconductor chip including a bioactive structure and contact areas disposed on a first side of the semiconductor chip; and a rewiring substrate including contact pads, external contact areas and rewiring lines that electrically connect the contact pads to the external contact areas; wherein the rewiring substrate is directly positioned on and covers a portion of the first side of the semiconductor chip without covering the bioactive structure such that the rewiring substrate overlaps the contact areas of the semiconductor chip, and the contact pads of the rewriting substrate and the contact areas of the semiconductor chip are positioned directly on, aligned with and electrically connected to each other. - View Dependent Claims (2, 3)
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4. A measuring apparatus for a biosensor having a semiconductor chip including a bioactive structure and contact areas disposed on a first side of the semiconductor chip, and a rewiring substrate including contact pads, external contact areas and rewiring lines that electrically connect the contact pads to the external contact areas, the measuring apparatus comprising:
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an inlet region including an entry opening to receive a medium to be measured and an entry channel in fluid communication with the inlet region; a fluid flow and measuring region including a measurement cavity, a measurement opening in fluid communication with the entry channel to facilitate flow of the medium into the measurement cavity, and an outflow opening in fluid communication with the measurement cavity; an exit region including an exit opening and an exit channel extending between the outflow opening of the fluid flow and measuring region and the exit opening; a sensing region comprising an insertion channel to receive the biosensor, and a sensing cavity including sensing contact elements; wherein the insertion channel of the sensing region is spatially adjacent the measurement cavity of the fluid flow and measuring region such that, upon insertion of the biosensor within the measuring apparatus, the biosensor divides and separates the insertion channel from the measurement cavity; upon insertion of the biosensor within the insertion channel of the sensing region, the sensing contact elements within the sensing cavity of the sensing region are brought into contact with the external contact areas of the biosensor; and the rewiring substrate covers a portion of the first side of the semiconductor chip without covering the bioactive structure such that the rewiring substrate overlaps the contact areas of the semiconductor chip, and the contact pads of the rewriting substrate and the contact areas of the semiconductor chip are aligned with and electrically connected to each other. - View Dependent Claims (5, 6, 7, 8, 9, 10)
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Specification