Semiconductor device and programming method

• US 7,566,978 B2
• Filed: 01/17/2007
• Issued: 07/28/2009
• Est. Priority Date: 01/17/2006
• Status: Expired due to Fees

• Current Assignee: Monterey Research, LLC (Vector Capital Corporation)
• Original Assignee: Spansion LLC (Infineon Technologies AG)
• Inventors: Taya, Koji, Tanaka, Junji, Onodera, Masanori, Meguro, Kouichi
• Primary Examiner(s): Mandala, Victor
• Assistant Examiner(s): SODERHOLM, KRISTA Z
• Application Number:
  US11/654,703
• Publication Number:
  US 20080169552A1
• Time in Patent Office: 923 Days
• Field of Search: 257/790, 257/686, 257/685
• US Class Current: 257/790
• CPC Class Codes: B29C 45/02 Transfer moulding, i.e. transferring the required volume of moulding material by a plunger from a "shot" cavity into a mould cavity
• CPC Class Codes: B29C 45/14655 connected to or mounted on a carrier, e.g. lead frame
• CPC Class Codes: B29C 45/1671 with an insert
• CPC Class Codes: H01L 21/56 Encapsulations, e.g. encapsulation layers, coatings
• CPC Class Codes: H01L 21/565 Moulds
• CPC Class Codes: H01L 2224/05599 Material
• CPC Class Codes: H01L 2224/32145 the bodies being stacked
• CPC Class Codes: H01L 2224/45099 Material
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48227 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/48247 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/85399 Material
• CPC Class Codes: H01L 2225/0651 Wire or wire-like electrical connections from device to substrate
• CPC Class Codes: H01L 23/28 Encapsulations, e.g. encapsulating layers, coatings, e.g. for protectionH01L23/552 takes precedence; insulating layers for contacts or interconnections H01L23/5329
• CPC Class Codes: H01L 23/3128 the substrate having spherical bumps for external connection
• CPC Class Codes: H01L 23/3135 Double encapsulation or coating and encapsulation
• CPC Class Codes: H01L 23/552 Protection against radiation, e.g. light or electromagnetic waves
• CPC Class Codes: H01L 24/48 of an individual wire connector
• CPC Class Codes: H01L 25/0657 Stacked arrangements of devices
• CPC Class Codes: H01L 25/50 Multistep manufacturing processes of assemblies consisting of devices, each device being of a type provided for in group H01L27/00 or H01L29/00 H01L21/50 takes precedence
• CPC Class Codes: H01L 2924/00 : Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00012 : Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00014 : the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01004 : Beryllium [Be]
• CPC Class Codes: H01L 2924/01005 : Boron [B]
• CPC Class Codes: H01L 2924/01006 : Carbon [C]
• CPC Class Codes: H01L 2924/01013 : Aluminum [Al]
• CPC Class Codes: H01L 2924/01029 : Copper [Cu]
• CPC Class Codes: H01L 2924/01033 : Arsenic [As]
• CPC Class Codes: H01L 2924/01082 : Lead [Pb]
• CPC Class Codes: H01L 2924/014 : Solder alloys
• CPC Class Codes: H01L 2924/12042 : LASER
• CPC Class Codes: H01L 2924/14 : Integrated circuits
• CPC Class Codes: H01L 2924/15311 : being a ball array, e.g. BGA
• CPC Class Codes: H01L 2924/181 : Encapsulation
• CPC Class Codes: H01L 2924/1815 : Shape
• CPC Class Codes: H01L 2924/3025 : Electromagnetic shielding

Abstract

The present invention include a semiconductor device and a method therefor, the method includes disposing a sheet-shaped resin at a side opposite to the chip mounting portion mounting semiconductor chips to be mounted on the chip mounting portion, and forming a resin sealing portion between the sheet-shaped resin and the chip mounting portion, to seal the semiconductor chips. According to an aspect of the present invention, it is possible to provide a semiconductor device and a fabrication method therefor, by which it is possible to reduce the size of the package and to prevent the generation of an unfilled portion in a resin sealing portion or a filler-removed portion or to prevent the exposure of wire from the resin sealing portion.

Claims

1. A semiconductor device comprising:

a semiconductor chip;

a chip mounting portion mounting the semiconductor chip;

a sheet-shaped resin portion provided at a side of the semiconductor chip opposite to the chip mounting portion;

a resin sealing portion provided between the sheet-shaped resin and the chip mounting portion, to seal the semiconductor chip; and

a wire connected between the semiconductor chip and the chip mounting portion, wherein the wire is provided in contact with the sheet-shaped resin portion.

2. The semiconductor device claimed in claim 1, wherein the sheet-shaped resin does not include a filler.

3. The semiconductor device claimed in claim 1, wherein the resin sealing portion is partially provided between the sheet-shaped resin portion and the semiconductor chip.

4. The semiconductor device claimed in claim 1, wherein the sheet-shaped resin portion is provided in contact with the semiconductor chip.

5. The semiconductor device as claimed in claim 1 further comprising:

a wire connected between the semiconductor chip and the chip mounting portion, wherein the wire is partially embedded in the sheet-shaped resin portion.

6. The semiconductor device as claimed in claim 1 further comprising:

a second sheet-shaped resin portion at a side of the chip mounting portion opposite to the semiconductor chip, wherein the resin sealing portion is provided between the sheet-shaped resin portion and the second sheet-shaped resin portion.

7. The semiconductor device as claimed in claim 1, further comprising:

a conductive sheet provided at a side of the sheet-shaped resin opposite to the semiconductor chip.

8. The semiconductor chip as claimed in claim 1, wherein the semiconductor chip has stacked semiconductor chips.

9. A semiconductor device comprising:

a semiconductor chip;

a chip mounting portion mounting the semiconductor chip;

a sheet-shaped resin portion provided at a side of the semiconductor chip opposite to the chip mounting portion; and

a resin sealing portion provided between the sheet-shaped resin and the chip mounting portion, to seal the semiconductor chip; and

a wire connected between the semiconductor chip and the chip mounting portion, wherein the wire is partially embedded in the sheet-shaped resin portion.

10. The semiconductor device as claimed in claim 9, wherein the sheet-shaped resin does not include a filler.

11. The semiconductor device as claimed in claim 9, wherein the resin sealing portion is partially provided between the sheet-shaped resin portion and the semiconductor chip.

12. The semiconductor device as claimed in claim 9, wherein the sheet-shaped resin portion is provided in contact with the semiconductor chip.

13. The semiconductor device as claimed in claim 9 further comprising:

a wire connected between the semiconductor chip and the chip mounting portion, wherein the wire is provided in contact with the sheet-shaped resin portion.

14. The semiconductor device as claimed in claim 9 further comprising:

a second sheet-shaped resin portion at a side of the chip mounting portion opposite to the semiconductor chip, wherein the resin sealing portion is provided between the sheet-shaped resin portion and the second sheet-shaped resin portion.

15. The semiconductor device as claimed in claim 9, further comprising:

a conductive sheet provided at a side of the sheet-shaped resin opposite to the semiconductor chip.

16. The semiconductor chip as claimed in claim 9, wherein the semiconductor chip has stacked semiconductor chips.