Two-part microprobes for contacting electronic components and methods for making such probes

• US 7,567,089 B2
• Filed: 12/07/2006
• Issued: 07/28/2009
• Est. Priority Date: 02/04/2003
• Status: Active Grant

• Current Assignee: Microfabrica Incorporated (Technoprobe S.P.A.)
• Original Assignee: Microfabrica Incorporated (Technoprobe S.P.A.)
• Inventors: Folk, Chris, Cohen, Adam L., Arat, Vacit, Chen, Richard T.
• Primary Examiner(s): TANG, MINH NHUT
• Application Number:
  US11/636,147
• Publication Number:
  US 20070205374A1
• Time in Patent Office: 964 Days
• Field of Search: None
• US Class Current: 324/755.11
• CPC Class Codes: G01R 1/0483 Sockets for un-leaded IC's having matrix type contact fields, e.g. BGA or PGA devices; Sockets for unpackaged, naked chips for IC's with connecting points around the edges only G01R1/0433
• CPC Class Codes: G01R 1/06727 Cantilever beams
• CPC Class Codes: G01R 1/06733 Geometry aspects G01R1/06727 takes precedence
• CPC Class Codes: G01R 1/07342 the body of the probe being at an angle other than perpendicular to test object, e.g. probe card
• CPC Class Codes: G01R 1/07357 with flexible bodies, e.g. buckling beams
• CPC Class Codes: G01R 3/00 Apparatus or processes specially adapted for the manufacture or maintenance of measuring instruments , e.g. of probe tips
• CPC Class Codes: G01R 31/2886 Features relating to contacting the IC under test, e.g. probe heads; chucks G01R31/2865 takes precedence, test connections, e.g. test sockets, or probes per se, G01R1/04 or G01R1/06

Abstract

Embodiments disclosed herein are directed to compliant probe structures for making temporary or permanent contact with electronic circuits and the like. In particular, embodiments are directed to various designs of two-part probe elements, socket-able probes and their mounts. Some embodiments are directed to methods for fabricating such probes and mounts. In some embodiments, for example, probes have slide in mounting structures, twist in mounting structures, mounting structures that include compliant elements, and the like.

Claims

1. A probe mounted to a substrate for testing semiconductor devices, comprising:

(a) a substrate;

(b) a mounting element affixed to the substrate;

(c) a probe element comprising a body portion, having a distal end connected to a tip portion, and a proximal end connected to a base portion;

wherein the base portion and the mounting element have at least some substantially complementary features which allow aligned and retained mating of the probe to the mounting element; and

wherein the probe element and the mounting element are engaged with one another through at least two non-parallel motions of the probe element relative to both the mounting element and the substrate to which the mounting element is mounted.

2. The probe of claim 1 wherein the motions are not parallel to the X or Y axes.

3. The probe of claim 1 wherein the motions are parallel to the X and Y axes.

4. The probe of claim 1 wherein at least one of the motions comprises a rotation about an axis parallel to a plane of the substrate.

5. The probe of claim 1 wherein at least one of the motions comprises a rotation about an axis that is perpendicular to a plane of the substrate.

6. The probe of claim 1 wherein either the mounting element or the probe element includes a compliant element that engages the other of the probe element or the mounting element when the positioning of the mounting element and the probe element place them in a desired relationship.

7. The probe of claim 1 wherein either the mounting element or the probe element includes a plurality of compliant fingers that ensure interlocking of the probe element and the mounting element, wherein the fingers provide interlocking at a plurality of insertion depths between the probe and the mounting element.