Lithographic apparatus and device manufacturing method

• US 7,567,338 B2
• Filed: 08/30/2006
• Issued: 07/28/2009
• Est. Priority Date: 08/30/2006
• Status: Active Grant

• Current Assignee: ASML Netherlands BV (ASML Holding NV)
• Original Assignee: ASML Netherlands BV (ASML Holding NV)
• Inventors: Mulkens, Johannes Catharinus Hubertus, Munnig Schmidt, Robert-Han
• Primary Examiner(s): Kim; Peter B
• Application Number:
  US11/512,434
• Publication Number:
  US 20080057440A1
• Time in Patent Office: 1,063 Days
• Field of Search: 355/53, 355/30, 355/72, 355/75
• US Class Current: 355/53
• CPC Class Codes: G03F 7/70341 Details of immersion lithography aspects, e.g. exposure media or control of immersion liquid supply chemical composition of immersion liquids G03F7/2041

Abstract

In optical maskless lithography, scanning of a single substrate is typically much slower than in conventional lithography. Solutions are described for the adoption of immersion lithography techniques into optical maskless lithography and in particular provides one or more solutions to reduce the amount of time which the immersion liquid is in contact with any given part of the top surface of the substrate during imaging.

Claims

1. A lithographic apparatus, comprising:

an illumination system configured to condition a radiation beam, the illumination system configured to illuminate a nominal field on a substrate;

an array of individually controllable elements capable of modulating at least part of a cross-section of the radiation beam;

a projection system configured to project the modulated radiation beam onto a target portion of a substrate; and

a liquid supply system configured to provide a liquid to a space between the projection system and the substrate for the modulated radiation beam to pass through, the liquid supply system comprising a liquid supply limiter configured to limit an area of a top surface of the substrate to which liquid is supplied to a size smaller than the nominal field.

2. The apparatus of claim 1, wherein the liquid supply limiter is adapted such that the area to which liquid is supplied comprises two discrete areas.

3. The apparatus of claim 1, wherein the liquid supply limiter is adapted such that the area is configured to cover a position at which the radiation beam modulated by the array impinges, in use, on the substrate.

4. The apparatus of claim 3, wherein the array comprises a plurality of arrays.

5. The apparatus of claim 4, wherein the area comprises two discrete areas, each discrete area configured to cover a position at which the radiation beam modulated by one of the plurality of arrays impinges, in use, on the substrate.

6. The apparatus of claim 5, wherein at least one of the two discrete areas is configured to cover a plurality of positions at which the radiation beam modulated by the respective plurality of arrays impinges, in use, on the substrate.

7. The apparatus of claim 3, wherein the liquid supply system comprises a substrate liquid supply system configured to provide liquid on the area of the substrate and a projection system liquid supply system configured to supply liquid between the projection system and liquid provided by the substrate liquid supply system.

8. The apparatus of claim 3, wherein the area is larger than the cross-sectional area of the modulated beam.