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Flip-chip packaging method for light emitting diode with eutectic layer not overlapping insulating layer

  • US 7,569,420 B2
  • Filed: 05/07/2008
  • Issued: 08/04/2009
  • Est. Priority Date: 08/08/2006
  • Status: Active Grant
First Claim
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1. A packaging method of a LED having a first electrode and a second electrode on a top side of said LED, comprising the steps of:

  • (1) providing a thermal and electrical conducting substrate;

    (2) forming an insulating layer in an appropriate area on the top surface of said substrate, and forming a bonding pad on top of said insulating layer;

    (3) reversing said LED so that said first electrode and said second electrode face the top surface of said substrate; and

    (4) eutectic bonding said LED to said substrate so that a eutectic layer is formed and bonded between said first electrode and an appropriate area not overlapping said insulating layer on the top surface of said substrate, and said second electrode electrically connected to said bonding pad.

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