Method for correcting electron beam exposure data
First Claim
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1. A method for correcting electron beam exposure data, comprising:
- inputting electron beam exposure data identifiable for each type of pattern of a semiconductor device, wherein;
a first type of pattern is a dummy pattern used for planarization of a surface of the semiconductor device but having no influence on a function of the semiconductor device, anda second type of pattern is a normal pattern having an influence on a function of the semiconductor device; and
correcting electron beam exposure data only on the second type of pattern without correcting electron beam exposure data on the first type of pattern;
wherein, in the correcting the electron beam exposure data on the second type of pattern, a proximity effect correction is performed; and
in the proximity effect correction, electron beam exposure data for a variable rectangular exposure is selected from the electron beam exposure data for the variable rectangular exposure and electron beam exposure data for a one-shot exposure, and only regarding the electron beam exposure data for the variable rectangular exposure, a center portion and contour portions of the pattern of the electron beam exposure data are divided, and second exposure amounts of the contour portions are made larger than first exposure amounts of the contour portions in the electron beam exposure amounts, and said dummy pattern is not divided.
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Abstract
First, electron beam exposure data identifiable for each type of pattern of a semiconductor device is inputted (S601). Then, electron beam exposure data on a first type of pattern is not corrected, while electron beam exposure data on a second type of pattern is corrected (S603). The first type of pattern is, for example, a dummy pattern having no influence on the function of the semiconductor device. The second type of pattern is for example, a normal pattern having an influence on the function of the semiconductor device.
20 Citations
15 Claims
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1. A method for correcting electron beam exposure data, comprising:
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inputting electron beam exposure data identifiable for each type of pattern of a semiconductor device, wherein; a first type of pattern is a dummy pattern used for planarization of a surface of the semiconductor device but having no influence on a function of the semiconductor device, and a second type of pattern is a normal pattern having an influence on a function of the semiconductor device; and correcting electron beam exposure data only on the second type of pattern without correcting electron beam exposure data on the first type of pattern; wherein, in the correcting the electron beam exposure data on the second type of pattern, a proximity effect correction is performed; and in the proximity effect correction, electron beam exposure data for a variable rectangular exposure is selected from the electron beam exposure data for the variable rectangular exposure and electron beam exposure data for a one-shot exposure, and only regarding the electron beam exposure data for the variable rectangular exposure, a center portion and contour portions of the pattern of the electron beam exposure data are divided, and second exposure amounts of the contour portions are made larger than first exposure amounts of the contour portions in the electron beam exposure amounts, and said dummy pattern is not divided. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13)
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14. An electron beam exposure data correcting device, comprising:
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an input unit inputting electron beam exposure data identifiable for each type of pattern of a semiconductor device, wherein; the first type of pattern is a dummy pattern maintaining a planar surface but having no influence on a function of the semiconductor device, and the second type of pattern is a normal pattern having an influence on the function of the semiconductor device; and a correction unit correcting electron beam exposure data on a second type of pattern without correcting electron beam exposure data on a first type of pattern; wherein, in the correcting the electron beam exposure data on the second type of pattern, a proximity effect correction is performed; and in the proximity effect correction, electron beam exposure data for a variable rectangular exposure is selected from the electron beam exposure data for the variable rectangular exposure and electron beam exposure data for a one-shot exposure, and only regarding the electron beam exposure data for the variable rectangular exposure, a center portion and contour portions of the pattern of the electron beam exposure data are divided, and second exposure amounts of the contour portions are made larger than first exposure amounts of the contour portions in the electron beam exposure amounts, and said dummy pattern is not divided.
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15. A program product for causing a computer to execute:
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inputting electron beam exposure data identifiable for each type of pattern of a semiconductor device, wherein; the first type of pattern is a dummy pattern maintaining a planar surface but having no influence on a function of the semiconductor device, and the second type of pattern is a normal pattern having an influence on the function of the semiconductor device; and correcting electron beam exposure data on a second type of pattern without correcting electron beam exposure data on a first type of pattern; wherein, in the correcting the electron beam exposure data on the second type of pattern, a proximity effect correction is performed; and in the proximity effect correction, electron beam exposure data for a variable rectangular exposure is selected from the electron beam exposure data for the variable rectangular exposure and electron beam exposure data for a one-shot exposure, and only regarding the electron beam exposure data for the variable rectangular exposure, a center portion and contour portions of the pattern of the electron beam exposure data are divided, and second exposure amounts of the contour portions are made larger than first exposure amounts of the contour portions in the electron beam exposure amounts, and said dummy pattern is not divided.
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Specification