Low resistance polymer matrix fuse apparatus and method

• US 7,570,148 B2
• Filed: 01/09/2003
• Issued: 08/04/2009
• Est. Priority Date: 01/10/2002
• Status: Expired due to Fees

• Current Assignee: Cooper Technologies Company (Eaton Corporation PLC.)
• Original Assignee: Cooper Technologies Company (Eaton Corporation PLC.)
• Inventors: Manoukian, Daniel M., Winnett Bender, Joan L., Parker, Robert
• Primary Examiner(s): Vortman; Anatoly
• Application Number:
  US10/339,114
• Publication Number:
  US 20030142453A1
• Time in Patent Office: 2,399 Days
• Field of Search: 337/297, 337/232, 337/227, 337/228, 296/23
• US Class Current: 337/297
• CPC Class Codes: H01H 69/022 of printed circuit fuses
• CPC Class Codes: H01H 85/0047 Heating means
• CPC Class Codes: H01H 85/006 Heat reflective or insulating layer on the casing or on the fuse support
• CPC Class Codes: H01H 85/046 Fuses formed as printed circuits

Abstract

A low resistance fuse includes a fuse element layer, and first and second intermediate insulation layers extending on opposite sides of the fuse element layer and coupled thereto. The fuse element layer is formed on the first intermediate insulation layer and the second insulation layer is laminated to the fuse element layer.

Claims

1. A low resistance fuse comprising:

a fuse element layer;

first and second intermediate insulation layers extending on opposite sides of said fuse element layer and coupled thereto, said fuse element layer formed on said first intermediate insulation layer and said second insulation layer laminated to said fuse element layer, wherein said first intermediate insulation layer comprises first and second termination windows therein and;

solder bump terminations located within said termination windows.

2. A low resistance fuse in accordance with claim 1 wherein said fuse element layer comprises a fusible link, at least one of said first and second intermediate layers comprises an opening overlying said fusible link.

3. A low resistance fuse in accordance with claim 2 wherein both of said first and second intermediate insulation layers comprise an opening in the vicinity of said fusible link.

4. A low resistance fuse in accordance with claim 1 wherein said fuse element layer comprises a thin film foil.

5. A low resistance fuse in accordance with claim 4 wherein said fuse element layer has a thickness between about 1 to about 20 microns.

6. A low resistance fuse in accordance with claim 5 wherein said fuse element layer has a thickness between about 3 to about 9 microns.

7. A low resistance fuse in accordance with claim 1 wherein said fuse element layer comprises first and second contact pads and at least one fusible link extending therebetween.

8. A low resistance fuse in accordance with claim 1 further comprising first and second outer insulating layers laminated to respective said first and second intermediate insulating layers.

9. A low resistance fuse in accordance with claim 8 wherein at least one of said first and second outer insulating layers comprises a liquid crystal polymer.

10. A low resistance fuse in accordance with claim 8 wherein at least one of said first and second outer insulating layers comprises a polyimide material.

11. A low resistance fuse comprising:

a thin foil fuse element layer comprising first and second contact pads and a fusible link extending between said first and second contact pads;

first and second intermediate insulation layers extending on and in direct contact with opposite sides of said fuse element layer, at least one of said first and second intermediate insulation layers comprising a substantially cylindrical opening therethrough in the vicinity of said fusible link;

a first outer insulating layer extending over said first intermediate insulation layer;

a second outer insulating layer extending over said second intermediate insulation layer, at least one of said first and second outer insulating layer enclosing said opening of at least one of said first and second intermediate insulation layers; and

solder bump terminations extending through said first outer insulating layer and said first intermediate insulation layer in electrical connection with said contact pads of said fuse element layer.

12. A low resistance fuse in accordance with claim 11 wherein at least one of said first and second intermediate insulation layers comprises a polyimide material.

13. A low resistance fuse in accordance with claim 11 wherein at least one of said first and second intermediate insulation layers comprises a liquid crystal polymer.

14. A low resistance fuse in accordance with claim 12 wherein at least one of said first outer insulating layer and said second outer insulating layer comprises a polyimide material.

15. A low resistance fuse in accordance with claim 12 wherein at least one of said first outer insulating layer and said second outer insulating layer comprises a liquid crystal polymer.

16. A low resistance fuse in accordance with claim 11 wherein said thin foil fuse element layer comprises a 1 micron to 20 micron metal foil.

17. A low resistance fuse in accordance with claim 16 wherein said thin foil fuse element layer comprises an electrodeposited 1 micron! to 2b micron metal foil.

18. A low resistance fuse in accordance with claim 17 wherein said thin foil fuse element layer comprises an electrodeposited 3 micron to 12 micron metal foil.

19. A low resistance fuse in accordance with claim 11 wherein said thin foil fuse element layer comprises an electrodeposited copper foil.