Method for manufacturing camera module where a solid state imaging device is an assembly reference plane of an optical unit
First Claim
1. A camera module comprising:
- a solid-state imaging device including a semiconductor substrate, on a first surface of which light-receiving elements are formed;
an optical unit having a built-in photographic optical system for forming a subject image on said light-receiving elements;
an electronic component for driving said solid-state imaging device, a first surface of said electronic component being attached to a second surface of said semiconductor substrate, which is opposite to said first surface of said semiconductor substrate, and said electronic component being electrically connected to said solid-state imaging device; and
a circuit board provided with a circuit for driving said solid-state imaging device, said circuit board being attached to a second surface of said electronic component, which is opposite to said first surface of said electronic component, and said circuit board being electrically connected to said solid-state imaging device,wherein said first surface of said semiconductor substrate is used as an assembly reference plane when said solid-state imaging device and said optical unit are combined.
2 Assignments
0 Petitions
Accused Products
Abstract
A cover glass covers only light-receiving elements formed on a semiconductor substrate of a solid-state imaging device. The other area of the substrate except the light-receiving elements is exposed. An FPC interposed between an optical unit and the solid-state imaging device is formed with an opening for exposing the cover glass and an assembly reference surface of the solid-state imaging device. When the solid-state imaging device is attached to the optical unit, the center of the light-receiving elements is determined as a reference position. The optical unit is directly attached to the assembly reference surface so as to make the reference position coincide with a photographic optical axis of the optical unit.
-
Citations
9 Claims
-
1. A camera module comprising:
-
a solid-state imaging device including a semiconductor substrate, on a first surface of which light-receiving elements are formed; an optical unit having a built-in photographic optical system for forming a subject image on said light-receiving elements; an electronic component for driving said solid-state imaging device, a first surface of said electronic component being attached to a second surface of said semiconductor substrate, which is opposite to said first surface of said semiconductor substrate, and said electronic component being electrically connected to said solid-state imaging device; and a circuit board provided with a circuit for driving said solid-state imaging device, said circuit board being attached to a second surface of said electronic component, which is opposite to said first surface of said electronic component, and said circuit board being electrically connected to said solid-state imaging device, wherein said first surface of said semiconductor substrate is used as an assembly reference plane when said solid-state imaging device and said optical unit are combined. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9)
-
Specification