Methods for depositing, releasing and packaging micro-electromechanical devices on wafer substrates
First Claim
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1. A projection system, comprising:
- a light source;
a spatial light modulator comprising a mirror array having a rectangular active area and a plurality of mirrors;
optics through which light passes when mirrors are in their ON state;
wherein light from the light source is directed at an angle perpendicular to an edge of the active area;
wherein the mirrors are disposes such that their edges are neither parallel nor perpendicular to the edges of the active area;
wherein the mirrors have a switching axis perpendicular to the incident light beam, and wherein the mirrors have edges that are not perpendicular to the incident light beam;
wherein the spatial light modulator further comprises a semiconductor substrate and a transparent substrate bonded together with a gap therebetween in which the mirrors are disposed; and
a lower packaging substrate to which the silicon substrate is bonded having metal areas located thereon.
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Abstract
A method for forming a MEMS device is disclosed, where a final release step is performed just prior to a wafer bonding step to protect the MEMS device from contamination, physical contact, or other deleterious external events. Without additional changes to the MEMS structure between release and wafer bonding and singulation, except for an optional stiction treatment, the MEMS device is best protected and overall process flow is improved. The method is applicable to the production of any MEMS device and is particularly beneficial in the making of fragile micromirrors.
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Citations
38 Claims
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1. A projection system, comprising:
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a light source; a spatial light modulator comprising a mirror array having a rectangular active area and a plurality of mirrors; optics through which light passes when mirrors are in their ON state; wherein light from the light source is directed at an angle perpendicular to an edge of the active area; wherein the mirrors are disposes such that their edges are neither parallel nor perpendicular to the edges of the active area; wherein the mirrors have a switching axis perpendicular to the incident light beam, and wherein the mirrors have edges that are not perpendicular to the incident light beam; wherein the spatial light modulator further comprises a semiconductor substrate and a transparent substrate bonded together with a gap therebetween in which the mirrors are disposed; and a lower packaging substrate to which the silicon substrate is bonded having metal areas located thereon. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20, 21, 22, 23, 24, 25, 26, 27, 28, 29, 30, 31, 32, 33, 34, 35, 36, 37, 38)
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Specification