Semiconductor device, method and apparatus for testing same, and method for manufacturing semiconductor device
First Claim
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1. A semiconductor device comprising:
- an electrode pad disposed in an INPUT/OUTPUT region of the semiconductor device; and
a probe area mark that defines a probe area for contacting a test probe to the electrode pad,wherein the probe area mark is disposed away from the electrode pad;
wherein the probe area mark extends toward the electrode pad and does not arrive at the electrode pad, andwherein the probe area mark is disposed on a scribe line and said electrode pad is disposed outside of the scribe line.
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Abstract
A semiconductor device wherein an electrode pad to be contacted a test probe for performing probe testing, a bonding area mark for defining a bonding area which performs wire boding on the electrode pad, and a probe area mark for defining a probe repair area for repairing or replacing the test probe for the electrode pad.
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Citations
19 Claims
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1. A semiconductor device comprising:
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an electrode pad disposed in an INPUT/OUTPUT region of the semiconductor device; and a probe area mark that defines a probe area for contacting a test probe to the electrode pad, wherein the probe area mark is disposed away from the electrode pad; wherein the probe area mark extends toward the electrode pad and does not arrive at the electrode pad, and wherein the probe area mark is disposed on a scribe line and said electrode pad is disposed outside of the scribe line. - View Dependent Claims (2, 3, 9, 10, 11)
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4. A semiconductor device comprising:
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an electrode pad to be contacted by a test probe for performing probe testing; a bonding area mark for defining a bonding area which performs bonding on the electrode pad; and a probe area mark for defining a probe repair area for repairing or replacing the test probe for the electrode pad, wherein the probe area mark is disposed away from the electrode pad, wherein the probe area mark extends toward the electrode pad and does not arrive at the electrode pad, and wherein the probe area mark is disposed on a scribe line and said electrode pad is disposed outside of the scribe line. - View Dependent Claims (5, 6, 7, 8, 12)
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13. A semiconductor device comprising:
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an electrode pad to be contacted by a test probe for performing probe testing; a bonding area mark for defining a bonding area which performs bonding on the electrode pad; and a probe area mark for defining a probe repair area for repairing or replacing the test probe for the electrode pad, wherein in the electrode pad, probe damage of the test probe is formed in a direction tilted from an edge of the electrode pad. - View Dependent Claims (14)
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15. A semiconductor device, comprising:
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an electrode pad; a probe damage associated with contacting a test probe on a surface of said electrode pad, wherein said probe damage is present in a first region of said surface of said electrode pad; a bonding wire for connecting said electrode pad with another electrode pad. wherein said bonding wire is disposed on a second region of said surface of said electrode pad, said second region being a. different region from said first region; and a probe area mark disposed on said semiconductor device and defining said first region, said probe area mark extending toward said electrode pad and not arriving at said electrode pad. - View Dependent Claims (16, 17, 18, 19)
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Specification