Methods to make piezoelectric ceramic thick film array and single elements with a reusable single layer substrate structure
First Claim
1. A method of producing at least one piezoelectric element comprising:
- depositing a piezoelectric ceramic material onto a first surface of at least one first reusable single layer substrate structure to form at least one piezoelectric element structure, wherein a first surface of the piezoelectric ceramic material and the first surface of the first reusable single layer substrate are in direct contact;
depositing an electrode on a second surface of the at least one piezoelectric element structure;
bonding the at least one piezoelectric element structure to a second substrate, the second substrate being conductive or having a conductive layer;
removing the at least one first reusable single layer substrate from the at least one piezoelectric element structure;
depositing a second side electrode on the first surface of the at least one piezoelectric element structure; and
poling, by applying a DC voltage to the at least one piezoelectric element structure, to provide the at least one piezoelectric element structure with piezoelectric characteristics.
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Abstract
A method of producing at least one piezoelectric element includes depositing a piezoelectric ceramic material onto a surface of a first substrate to form at least one piezoelectric element structure. Then an electrode is deposited on a surface of the at least one piezoelectric element structure. Next, the at least one piezoelectric element structure is bonded to a second substrate, the second substrate being conductive or having a conductive layer. The first substrate is then removed from the at least one piezoelectric element structure and a second side electrode is deposited on a second surface of the at least one piezoelectric element structure. A poling operation is performed to provide the at least one piezoelectric element structure with piezoelectric characteristics.
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Citations
22 Claims
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1. A method of producing at least one piezoelectric element comprising:
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depositing a piezoelectric ceramic material onto a first surface of at least one first reusable single layer substrate structure to form at least one piezoelectric element structure, wherein a first surface of the piezoelectric ceramic material and the first surface of the first reusable single layer substrate are in direct contact; depositing an electrode on a second surface of the at least one piezoelectric element structure; bonding the at least one piezoelectric element structure to a second substrate, the second substrate being conductive or having a conductive layer; removing the at least one first reusable single layer substrate from the at least one piezoelectric element structure; depositing a second side electrode on the first surface of the at least one piezoelectric element structure; and poling, by applying a DC voltage to the at least one piezoelectric element structure, to provide the at least one piezoelectric element structure with piezoelectric characteristics. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20, 21, 22)
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Specification