Method of manufacturing an implantable wireless sensor
First Claim
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1. A method of manufacturing a sensor, comprising the steps of:
- forming a first cavity in a first side of a first substrate, the first cavity having a base;
forming a first conductive structure on the base of the first cavity;
forming a second conductive structure on a surface of a second substrate;
mutually imposing the first and second substrates such that the first and second conductive structures are disposed in opposed, spaced-apart relation; and
using heat from a laser to bond the first and second substrates together and simultaneously to individualize the sensor, the heat being controlled such that said first and second conductive structures are not damaged thereby.
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Abstract
In the disclosed method of manufacturing an implantable wireless sensor, a cavity is etched in one side of a first substrate. A conductive structure are formed on the base of the cavity. A second conductive structureare formed on a surface of a second substrate, and the two substrates are mutually imposed such that the two conductive plates and coils are disposed in opposed, spaced-apart relation. A laser is then used to cut away perimeter portions of the imposed substrates and simultaneously to heat bond the two substrates together such that the cavity in the first substrate is hermetically sealed.
167 Citations
40 Claims
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1. A method of manufacturing a sensor, comprising the steps of:
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forming a first cavity in a first side of a first substrate, the first cavity having a base; forming a first conductive structure on the base of the first cavity; forming a second conductive structure on a surface of a second substrate; mutually imposing the first and second substrates such that the first and second conductive structures are disposed in opposed, spaced-apart relation; and using heat from a laser to bond the first and second substrates together and simultaneously to individualize the sensor, the heat being controlled such that said first and second conductive structures are not damaged thereby. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14, 15, 16, 17, 18, 19, 20, 21, 22, 23, 24, 25)
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26. A method of manufacturing a plurality of sensors, comprising the steps of:
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forming a plurality of first cavity cavities in a first side of a first substrate, each of said plurality of first cavities having a base; forming a plurality of first conductive structures, one on the base of the each of said plurality of first cavity cavities; forming a plurality of second conductive structures on a surface of a second substrate; mutually imposing the first and second substrates such that the first and second conductive structures are aligned in opposed, spaced-apart relation; and using heat to bond the first and second substrates together and simultaneously to individualize a plurality of sensors, the heat being controlled such that said plurality of first and second conductive structures are not damaged thereby. - View Dependent Claims (27, 28, 29, 30, 31, 32, 33, 34, 35, 36, 37, 38, 39, 40)
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Specification