Substrate processing apparatus and substrate processing method

• US 7,575,636 B2
• Filed: 06/20/2006
• Issued: 08/18/2009
• Est. Priority Date: 11/15/2002
• Status: Active Grant

• Current Assignee: Ebara Corporation
• Original Assignee: Ebara Corporation
• Inventors: Katsuoka, Seiji, Motoshima, Yasuyuki, Owatari, Akira, Watanabe, Teruyuki, Dai, Naoki, Ogawa, Takahiro, Kobayashi, Kenichi, Sekimoto, Masahiko, Yokoyama, Toshio, Miyazaki, Mitsuru
• Primary Examiner(s): EDWARDS, LAURA ESTELLE
• Application Number:
  US11/455,777
• Publication Number:
  US 20060243205A1
• Time in Patent Office: 1,155 Days
• Field of Search: 118/500, 118/428, 118/429, 269/20, 269/21, 204/298.01, 204/224.R, 204/270, 204/278, 204/297.01, 451/388, 451/289, 205/148, 205/96
• US Class Current: 118/428
• CPC Class Codes: C23C 18/1628 Specific elements or parts of the apparatus
• CPC Class Codes: C23C 18/1893 with use of organic or inorganic compounds other than metals, first
• CPC Class Codes: C25D 17/001 Apparatus specially adapted for electrolytic coating of wafers, e.g. semiconductors or solar cells
• CPC Class Codes: C25D 17/08 Supporting racks , i.e. not for suspending
• CPC Class Codes: C25D 7/123 Semiconductors first coated with a seed layer or a conductive layer
• CPC Class Codes: H01L 21/67051 using mainly spraying means, e.g. nozzles
• CPC Class Codes: H01L 21/67126 Apparatus for sealing, encapsulating, glassing, decapsulating or the like processes H01L23/02, H01L23/28
• CPC Class Codes: H01L 21/67161 characterized by the layout of the process chambers
• CPC Class Codes: H01L 21/67173 in-line arrangement
• CPC Class Codes: H01L 21/6719 characterized by the construction of the processing chambers, e.g. modular processing chambers
• CPC Class Codes: H01L 21/67196 characterized by the construction of the transfer chamber
• CPC Class Codes: H01L 21/6723 comprising at least one plating chamber electroless plating apparatuses C23C, electroplating apparatuses C25D
• CPC Class Codes: H01L 21/67742 Mechanical parts of transfer devices robots in general in B25J
• CPC Class Codes: H01L 21/67751 vertical transfer of a single workpiece
• CPC Class Codes: H01L 21/67766 Mechanical parts of transfer devices robots in general in B25J
• CPC Class Codes: H01L 21/67781 Batch transfer of wafers
• CPC Class Codes: H01L 21/68707 the wafers being placed on a robot blade, or gripped by a gripper for conveyance
• CPC Class Codes: H01L 21/68721 characterised by edge clamping, e.g. clamping ring
• CPC Class Codes: Y10S 134/902 Semiconductor wafer
• CPC Class Codes: Y10T 279/11 Vacuum

Abstract

The present invention relates to a substrate processing apparatus useful for plating a substrate or processing a substrate by dipping a substrate in a processing liquid. A substrate processing apparatus of the present invention includes: a loading/unloading area for carrying in and out a substrate; a cleaning area for cleaning the substrate; and a plating area for plating the substrate. The loading/unloading area is provided with a substrate transfer robot having a plurality of hands of dry-use design, a loading port mounted with a cassette for housing substrates, and a reversing machine of dry-use design for reversing the substrate from face up to face down.

Claims

1. A substrate processing apparatus, comprising:

a substrate holding device for holding a substrate in a horizontal position, said substrate holding device being operable to lower the substrate into a processing liquid and to hold the substrate within the processing liquid in a bubble removal position and a substrate processing position; and

a processing tank for holding the processing liquid, said processing tank including;

a gas bubble removing section including a circular wall having a circular top end portion with an outer diameter smaller than an outer diameter of the substrate to be held by said substrate holding device; and

a processing liquid supply inlet for supplying the processing liquid into said processing tank such that the processing liquid must flow through a center area surrounded by said circular wall toward a lower surface of the substrate to be held by said substrate holding device and then radially along the lower surface of the substrate toward a periphery of the substrate;

wherein said substrate holding device and said gas bubble removing section are arranged such that, when the substrate is lowered into the processing liquid in said processing tank to the bubble removal position which is lower than the substrate processing position, a circular slit is formed between said circular top end portion of said circular wall and a periphery of the lower surface of the substrate to thereby increase a flow speed of the processing liquid flowing radially along the lower surface of the substrate through the circular slit so as to remove gas bubbles resting against the lower surface of the substrate; and

wherein said substrate holding device and said gas bubble removing section are arranged such that, when the substrate is raised to the substrate processing position within the processing liquid from the bubble removal position, a sufficiently wide clearance is formed between said circular top end portion of said circular wall and the periphery of the lower surface of the substrate to thereby form a stable flow of the processing solution.

2. The substrate processing apparatus of claim 1, wherein said gas bubble removing section further includes a current plate arranged horizontally within said processing tank, said circular wall extending upward from said current plate, a plurality of through-holes being formed in said current plate within said center area surrounded by said circular wall.

3. The substrate processing apparatus of claim 2, wherein said processing tank further including a first tank surrounding said circular wall, said circular wall forming a second tank within said processing tank, said first tank having an outer circular wall with a circular top end portion located higher than said circular top end portion of said circular wall of said second tank.

4. The substrate processing apparatus of claim 3, wherein said processing tank further includes a cover portion surrounding said first tank such that an overflow groove is formed between said first tank and said cover portion, a portion of the processing liquid flowing over said circular top end portion of said circular wall of said first tank flows into said overflow groove to be recovered.

5. The substrate processing apparatus of claim 1, wherein said processing tank further including a first tank surrounding said circular wall, said circular wall forming a second tank within said processing tank, said first tank having an outer circular wall with a circular top end portion located higher than said circular top end portion of said circular wall of said second tank.

6. The substrate processing apparatus of claim 5, wherein said processing tank further includes a cover portion surrounding said first tank such that an overflow groove is formed between said first tank and said cover portion, a portion of the processing liquid flowing over said circular top end portion of said circular wall of said first tank flows into said overflow groove to be recovered.

7. The substrate processing apparatus of claim 1, wherein said circular top end portion of said circular wall comprises a circular top end portion of a peripheral portion of said processing tank.

8. The substrate processing apparatus of claim 1, wherein said circular top end portion of said circular wall comprises a circular top end portion of an inner tank located inside a peripheral portion of said processing tank such that said inner tank and said peripheral portion of said processing tank form a double-tank structure.

9. The substrate processing apparatus of claim 1, wherein said substrate holding device has an escape groove passing through a bottom portion thereof for allowing the processing liquid flowing along the lower surface of the substrate to pass through the substrate holding device.

10. The substrate processing apparatus of claim 9, wherein said escape groove comprises one of a plurality of escape grooves passing radially through said bottom portion of said substrate holding device, said plurality of escape grooves being evenly spaced around said bottom portion of said substrate holding device.

11. A substrate processing apparatus, comprising:

a substrate holding device for holding a substrate in a horizontal position, said substrate holding device being operable to lower the substrate into a processing liquid; and

a processing tank for holding the processing liquid, said processing tank including;

a gas bubble removing section including a circular wall having a circular top end portion with an outer diameter smaller than an outer diameter of the substrate to be held by said substrate holding device, and a current plate arranged horizontally within said processing tank, said circular wall extending upward from said current plate, a plurality of through-holes being formed in said current plate within said center area surrounded by said circular wall, said current plate extending radially outward of said circular wall, a portion of said current plate located radially outward of said circular wall being free of any through-holes; and

a processing liquid supply inlet for supplying the processing liquid into said processing tank such that the processing liquid must flow through a center area surrounded by said circular wall toward a lower surface of the substrate to be held by said substrate holding device and then radially along the lower surface of the substrate toward a periphery of the substrate so as to remove gas bubbles resting against the lower surface of the substrate;

wherein said substrate holding device and said gas bubble removing section are arranged such that, when the substrate is lowered into the processing liquid in said processing tank, a circular slit is formed between said circular top end portion of said circular wall and a periphery of the lower surface of the substrate to thereby increase a flow speed of the processing liquid flowing radially along the lower surface of the substrate through the circular slit.

12. The substrate processing apparatus of claim 11, wherein said substrate holding device has an escape groove passing through a bottom portion thereof for allowing the processing liquid flowing along the lower surface of the substrate to pass through the substrate holding device.

13. The substrate processing apparatus of claim 12, wherein said escape groove comprises one of a plurality of escape grooves passing radially through said bottom portion of said substrate holding device, said plurality of escape grooves being evenly spaced around said bottom portion of said substrate holding device.