Bonding apparatus and method
First Claim
1. A bonding apparatus comprising:
- a bonding processor for executing a bonding process on a bonding subject using a bonding tool;
a plasma capillary having a high-frequency coil wound on a tip end portion thereof;
an inductively coupled microplasma generator including the plasma capillary and for performing a surface treatment on the bonding subject by ejecting gas being a plasma in an interior of the plasma capillary by supply of electric power to the high-frequency coil of the plasma capillary, from an opening at a tip end portion of the plasma capillary onto the bonding subject;
a position changing unit for changing positions a tip of a thin wire being made of a prescribed material inserted the interior of the plasma capillary between a surface removal position being outside of a plasma region and a surface deposition position being inside of the plasma region in the interior of the plasma capillary; and
a controller for depositing the prescribed material on the bonding subject to move positions of the tip of the thin wire to the surface deposition position in the inductively coupled microplasma generator by controlling the position changing unit after removing foreign matter or contaminants of a surface on the bonding subject to move positions of the tip of the thin wire to the surface removal position in the inductively coupled microplasma generator by controlling the position changing unit.
1 Assignment
0 Petitions
Accused Products
Abstract
A bonding apparatus including a capillary 40 having a high-frequency coil 50 on its tip end portion and allowing a bonding wire 2 to pass therethrough, a position changing unit for changing the position of the tip of the bonding wire, a gas supply unit for supplying gas into the capillary, and a high-frequency power supply unit for supplying high-frequency power to the high-frequency coil. When the bonding wire is outside a plasma region 52 in the capillary, a microplasma generated in the plasma region is ejected out of the capillary and removes foreign matter or contaminants on the surface of a bonding subject. When the bonding wire is inside the plasma region, the material of the bonding wire is turned into fine particles, and a microplasma 303 containing sputtered fine particles is ejected from the capillary, allowing the material the same as the bonding wire to be deposited on the bonding subject.
-
Citations
12 Claims
-
1. A bonding apparatus comprising:
-
a bonding processor for executing a bonding process on a bonding subject using a bonding tool; a plasma capillary having a high-frequency coil wound on a tip end portion thereof; an inductively coupled microplasma generator including the plasma capillary and for performing a surface treatment on the bonding subject by ejecting gas being a plasma in an interior of the plasma capillary by supply of electric power to the high-frequency coil of the plasma capillary, from an opening at a tip end portion of the plasma capillary onto the bonding subject; a position changing unit for changing positions a tip of a thin wire being made of a prescribed material inserted the interior of the plasma capillary between a surface removal position being outside of a plasma region and a surface deposition position being inside of the plasma region in the interior of the plasma capillary; and a controller for depositing the prescribed material on the bonding subject to move positions of the tip of the thin wire to the surface deposition position in the inductively coupled microplasma generator by controlling the position changing unit after removing foreign matter or contaminants of a surface on the bonding subject to move positions of the tip of the thin wire to the surface removal position in the inductively coupled microplasma generator by controlling the position changing unit.
-
-
2. A bonding apparatus comprising:
-
a capillary being tubular and made of an insulating material, the capillary being provided with a high-frequency coil wound on an outer circumference of a tip end portion of the capillary and being supplied of high-frequency electric power thereto, and the capillary allowing a bonding wire to insert into an interior thereof; a gas supply unit for supplying gas comprising a surface treatment gas and a carrier gas to an interior of the capillary, the gas supply unit including a switch box for switching the surface treatment gases, and a mixing box for mixing the surface treatment gas and the carrier gas; a position changing unit for changing positions of a tip position of the bonding wire; and a controller for controlling a wire bonding processing.
-
-
3. A bonding apparatus comprising:
-
a bonding processor for executing a bonding process on a bonding subject using a bonding arm having a bonding capillary; a plasma capillary for performing a surface treatment on the bonding subject and having a high-frequency coil wound on a tip end portion thereof, the plasma capillary ejecting gas being a plasma in an interior thereof by supply of electric power to the high-frequency coil thereof, from an opening at a tip end portion thereof onto the bonding subject; a plasma processor for performing the surface treatment on the bonding subject using a plasma arm having the plasma capillary at a tip end thereof; a position changing unit for changing positions a tip of a thin wire being made of a prescribed material inserted the interior of the plasma capillary between a surface removal position being outside of a plasma region and a surface deposition position being inside of the plasma region in the interior of the plasma capillary; and a controller for interconnectedly controlling actions of the bonding arm and actions of the plasma arm. - View Dependent Claims (4, 5, 6)
-
-
7. A bonding method using a bonding apparatus, comprising:
-
providing a bonding apparatus, the bonding apparatus comprising; a bonding processor for executing a bonding process on a bonding subject using a bonding tool, a plasma capillary having a high-frequency coil wound on a tip end portion thereof, an inductively coupled microplasma generator including the plasma capillary and for performing a surface treatment on the bonding subject by ejecting gas being a plasma in an interior of the plasma capillary by supply of electric power to the high-frequency coil of the plasma capillary, from an opening at a tip end portion of the plasma capillary onto the bonding subject, a position changing unit for changing positions of a tip position of thin wire being made of a prescribed material inserted the interior of the plasma capillary between a surface removal position being outside of a plasma region and a surface deposition position being inside of the plasma region in the interior of the plasma capillary, and a controller for depositing the prescribed material on the bonding subject to move positions of the tip of the thin wire to the surface deposition position in the inductively coupled microplasma generator by controlling the position changing unit after removing foreign matter or contaminants of a surface on the bonding subject to move positions of the tip of the thin wire to the surface removal position in the inductively coupled microplasma generator by controlling the position changing unit; changing positions of the tip of the thin wire inserted the interior of the plasma capillary between a surface removal position where the tip of the thin wire being positioned outside the plasma region, and a surface deposition position where the tip of the thin wire being positioned inside the plasma region; depositing the prescribed material on the bonding subject to move positions of the tip of the thin wire to the surface deposition position in the interior of the plasma capillary by controlling the position changing unit after removing foreign matter or contaminants of a surface on the bonding subject to move positions of the tip of the thin wire to the surface removal position in the interior of the plasma capillary by controlling the position changing unit;
thenexecuting the bonding process onto a site depositing the prescribed material by the bonding processor.
-
-
8. A bonding method using a bonding apparatus, comprising:
-
providing a bonding apparatus, the bonding apparatus comprising; a capillary being tubular and made of an insulating material, the capillary being provided with a high-frequency coil wound on an outer circumference of a tip end portion of the capillary and being supplied of high-frequency electric power thereto, and the capillary allowing a bonding wire to insert into an interior thereof, a gas supply unit for supplying gas to an interior of the capillary, a position changing unit for changing positions of a tip position of the bonding wire, and a controller for controlling a wire bonding processing;
changing positions of the tip position of the bonding wire inserted into the capillary amonga bonding process position for effecting wire bonding, a surface removal position where the tip of the bonding wire being positioned outside the plasma region, and a surface deposition position where the tip of the bonding wire being positioned inside the plasma region; depositing the material of the bonding wire on the bonding subject to move positions of the tip of the bonding wire to the surface deposition position in the interior of the capillary by controlling the position changing unit after removing foreign matter or contaminants of a surface on the bonding subject to move positions of the tip of the bonding wire to the surface removal position in the interior of the capillary by controlling the position changing unit;
thenexecuting the bonding process onto a site depositing the material of the bonding wire.
-
-
9. A bonding method using a bonding apparatus, comprising:
-
providing a bonding apparatus, the bonding apparatus comprising; a bonding processor for executing a bonding process on a bonding subject using a bonding arm having a bonding capillary, a plasma capillary for performing a surface treatment on the bonding subject and having a high-frequency coil wound on a tip end portion thereof, the plasma capillary ejecting gas being a plasma in an interior thereof by supply of electric power to the high-frequency coil thereof, from an opening at a tip end portion thereof onto the bonding subject, a plasma processor for performing the surface treatment on the bonding subject using a plasma arm having the plasma capillary at a tip end thereof, a position changing unit for changing positions a tip of a thin wire being made of a prescribed material inserted the interior of the plasma capillary between a surface removal position being outside of a plasma region and a surface deposition position being inside of the plasma region in the interior of the plasma capillary, and a controller for interconnectedly controlling actions of the bonding arm and actions of the plasma arm; changing positions of the tip of the thin wire inserted the interior of the plasma capillary between a surface removal position where the tip of the thin wire being positioned outside the plasma region, and a surface deposition position where the tip of the thin wire being positioned inside the plasma region; and depositing the prescribed material on the bonding subject to move positions of the tip of the thin wire to the surface deposition position in the interior of the plasma capillary by controlling the position changing unit after removing foreign matter or contaminants of a surface on the bonding subject to move positions of the tip of the thin wire to the surface removal position in the interior of the plasma capillary by controlling the position changing unit;
thenexecuting the bonding process onto a site depositing the prescribed material by the bonding processor.
-
-
10. A bonding method comprising the step of:
-
providing a bonding processor for executing a bonding process on a bonding subject using a bonding tool; providing a plasma capillary having a high-frequency coil wound on a tip end portion thereof; providing an inductively coupled microplasma generator including the plasma capillary and for performing a surface treatment on the bonding subject by ejecting gas being a plasma in an interior of the plasma capillary by supply of electric power to the high-frequency coil of the plasma capillary, from an opening at a tip end portion of the plasma capillary onto the bonding subject; providing a position changing unit for changing positions of a tip of a thin wire being made of a prescribed material inserted the interior of the plasma capillary between a surface removal position being outside of a plasma region and a surface deposition position being inside of the plasma region in the interior of the plasma capillary; providing a controller for depositing the prescribed material on the bonding subject to move positions of the tip of the thin wire to the surface deposition position in the inductively coupled microplasma generator by controlling the position changing unit after removing foreign matter or contaminants of a surface on the bonding subject to move positions of the tip of the thin wire to the surface removal position in the inductively coupled microplasma generator by controlling the position changing unit; changing positions of the tip of the thin wire inserted the interior of the plasma capillary between a surface removal position where the tip of the thin wire being positioned outside the plasma region, and a surface deposition position where the tip of the thin wire being positioned inside the plasma region; depositing the prescribed material on the bonding subject to move positions of the tip of the thin wire to the surface deposition position in tile interior of the plasma capillary by controlling the position changing unit after removing foreign matter or contaminants of a surface on the bonding subject to move positions of the tip of the thin wire to the surface removal position in the interior of the plasma capillary by controlling the position changing unit;
thanexecuting the bonding process onto a site depositing the prescribed material by the bonding processor.
-
-
11. A bonding method comprising the step of:
-
providing a capillary being tubular and made of an insulating material, the capillary being provided with a high-frequency coil wound on an outer circumference of a tip end portion of the capillary and being supplied of high-frequency electric power thereto, and the capillary allowing a bonding wire to insert into an interior thereof; providing a gas supply unit for supplying gas to an interior of the capillary; providing a position changing unit for changing positions of a tip position of the bonding wire; providing a controller for controlling a wire bonding processing; changing positions of the tip position of the bonding wire inserted into the capillary among a bonding process position for effecting wire bonding, a surface removal position where the tip of the bonding wire being positioned outside the plasma region, and a surface deposition position where the tip of the bonding wire being positioned inside the plasma region; depositing the material of the bonding wire on the bonding subject to wove positions of the tip of the bonding wire to the surface deposition position in the interior of the capillary by controlling the position changing unit after removing foreign matter or contaminants of a surface on the bonding subject to move positions of the tip of the bonding wire to the surface removal position in the interior of the capillary by controlling the position changing unit;
thenexecuting the bonding process onto a site depositing the material of the bonding wire.
-
-
12. A bonding method comprising the step of:
-
providing a bonding processor for executing a bonding process on a bonding subject using a bonding arm having a bonding capillary; providing a plasma capillary for performing a surface treatment on the bonding subject and having a high-frequency coil wound on a tip end portion thereof, the plasma capillary ejecting gas being a plasma in an interior thereof by supply of electric power to the high-frequency coil thereof, from an opening at a tip end portion thereof onto the bonding subject; providing a plasma processor for performing the surface treatment on the bonding subject using a plasma arm having the plasma capillary at a tip end thereof, providing a position changing unit for changing positions a tip of a thin wire being made of a prescribed material inserted the interior of the plasma capillary between a surface removal position being outside of a plasma region and a surface deposition position being inside of the plasma region in the interior of the plasma capillary; providing a controller for interconnectedly controlling actions of the bonding arm and actions of the plasma arm; changing positions of the tip of the thin wire inserted the interior of the plasma capillary between a surface removal position where the tip of the thin wire being positioned outside the plasma region, and a surface deposition position where the tip of the thin wire being positioned inside the plasma region; depositing the prescribed material on the bonding subject to move positions of the tip of the thin wire to the surface deposition position in the interior of the plasma capillary by controlling the position changing unit after removing foreign matter or contaminants of a surface on the banding subject to move positions of the tip of the thin wire to the surface removal position in the interior of the plasma capillary by controlling the position changing unit;
thenexecuting the bonding process onto a site depositing the prescribed material by the bonding processor.
-
Specification