Direct glass attached on die optical module

• US 7,576,401 B1
• Filed: 07/07/2005
• Issued: 08/18/2009
• Est. Priority Date: 07/07/2005
• Status: Active Grant

• Current Assignee: Amkor Technology Singapore Holding Pte., Ltd. (Amkor Technology Incorporated)
• Original Assignee: Amkor Technology Incorporated
• Inventors: Darveaux, Robert F., Kim, Young Ho, de Guzman, Arsenio
• Primary Examiner(s): Williams; Alexander O
• Application Number:
  US11/177,904
• Time in Patent Office: 1,503 Days
• Field of Search: 257/432, 257/294, 257/433, 257/435, 257/234, 257/680, 257/774, 257/728, 257/E31.117, 257/E31.127, 257/E33.076
• US Class Current: 257/432
• CPC Class Codes: G02B 13/001 Miniaturised objectives for electronic devices, e.g. portable telephones, webcams, PDAs, small digital cameras G02B23/243 takes precedence
• CPC Class Codes: G02B 7/021 for more than one lens
• CPC Class Codes: G02B 7/023 permitting adjustment
• CPC Class Codes: H01L 2224/32225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48227 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/73265 Layer and wire connectors
• CPC Class Codes: H01L 27/14618 Containers
• CPC Class Codes: H01L 27/14625 Optical elements or arrangements associated with the device
• CPC Class Codes: H01L 27/14685 Process for coatings or optical elements
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/15311 being a ball array, e.g. BGA
• CPC Class Codes: H04N 23/55 Optical parts specially adapted for electronic image sensors; Mounting thereof
• CPC Class Codes: H04N 23/57 Mechanical or electrical details of cameras or camera modules specially adapted for being embedded in other devices

Abstract

An optical module includes an image sensor having an active area and a window mounted directly to the image sensor above the active area. The optical module further includes a mount mounted to the window, the mount supporting a barrel having a lens assembly. By mounting the window directly to the image sensor and the mount directly to the window, the substrate surface area of the optical module is minimized.

Claims

1. An optical module comprising:

an image sensor comprising an active area;

a window mounted directly to the image sensor above the active area;

a window adhesive mounting a first surface of the window to a first surface of the image sensor, the first surface of the image sensor comprising the active area, wherein a shape of the first surface of the window is the same as a shape of the first surface of the image sensor;

a mount coupled to the window; and

a barrel supported by the mount.

2. The optical module of claim 1 wherein the window adhesive mounts the periphery of the first surface of the window to the periphery of the first surface of the image sensor.

3. The optical module of claim 1 wherein the first surface of the window, the first surface of the image sensor, and the window adhesive form a cavity, the active area being located within the cavity.

4. The optical module of claim 1 wherein the image sensor further comprises bond pads on the first surface of the image sensor, the window adhesive being applied directly on and covering the bond pads.

5. The optical module of claim 4 further comprising:

a substrate comprising a first surface having traces thereon; and

bond wires electrically connecting the bond pads to the traces.

6. The optical module of claim 5 wherein the window adhesive partially covers the bond wires.

7. The optical module of claim 5 wherein the window adhesive entirely covers the bond wires.

8. The optical module of claim 5 wherein the window adhesive spaces the window above a loop height of the bond wires.

9. The optical module of claim 1 wherein the image sensor further comprises bond pads on the first surface of the image sensor, the window adhesive being applied between the bond pads and the active area.

10. The optical module of claim 1 further comprising an encapsulant mounting the mount to the window, wherein the mount comprises a lip which protrudes into the encapsulant.

11. An optical module comprising:

a substrate comprising a first surface;

an electronic component coupled to the first surface of the substrate;

an image sensor stacked above the electronic component by an image sensor spacer, the image sensor comprising an active area;

a window mounted above the active area;

a mount coupled to the window; and

a barrel supported by the mount.

12. The optical module of claim 11 further comprising an adhesive coupling the image sensor to the image sensor spacer.

14. The optical module of claim 11 wherein a window adhesive mounts the window to the image sensor.

15. The optical module of claim 14 wherein the window, the image sensor, and the window adhesive form a cavity, the active area being located within the cavity.

16. The optical module of claim 14 wherein the image sensor further comprises bond pads on a first surface of the image sensor, the window adhesive being applied directly on and covering the bond pads.

17. The optical module of claim 11 further comprising an encapsulant mounting the mount to the window, wherein the mount comprises a lip which protrudes into the encapsulant.

13. An optical module comprising:

a substrate comprising a first surface;

an electronic component coupled to the first surface of the substrate, the electronic component comprising bond pads on a first surface of the electronic component;

an image sensor comprising an active area;

an image sensor spacer stacking the image sensor above the electronic component, the image sensor spacer being coupled to a central region of the first surface of the electronic component inward of the bond pads, the image sensor spacer comprising;

a central spacer;

a first adhesive on a first surface of the central spacer; and

a second adhesive on a second surface of the central spacer;

a window mounted above the active area;

a mount coupled to the window; and

a barrel supported by the mount.

18. The optical module of claim 13 wherein a window adhesive mounts the window to the image sensor.

19. The optical module of claim 18 wherein the window, the image sensor, and the window adhesive form a cavity, the active area being located within the cavity.

20. The optical module of claim 18 wherein the image sensor further comprises bond pads on a first surface of the image sensor, the window adhesive being applied directly on and covering the bond pads.