Direct glass attached on die optical module
First Claim
Patent Images
1. An optical module comprising:
- an image sensor comprising an active area;
a window mounted directly to the image sensor above the active area;
a window adhesive mounting a first surface of the window to a first surface of the image sensor, the first surface of the image sensor comprising the active area, wherein a shape of the first surface of the window is the same as a shape of the first surface of the image sensor;
a mount coupled to the window; and
a barrel supported by the mount.
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Abstract
An optical module includes an image sensor having an active area and a window mounted directly to the image sensor above the active area. The optical module further includes a mount mounted to the window, the mount supporting a barrel having a lens assembly. By mounting the window directly to the image sensor and the mount directly to the window, the substrate surface area of the optical module is minimized.
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Citations
20 Claims
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1. An optical module comprising:
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an image sensor comprising an active area; a window mounted directly to the image sensor above the active area; a window adhesive mounting a first surface of the window to a first surface of the image sensor, the first surface of the image sensor comprising the active area, wherein a shape of the first surface of the window is the same as a shape of the first surface of the image sensor; a mount coupled to the window; and a barrel supported by the mount. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10)
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11. An optical module comprising:
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a substrate comprising a first surface; an electronic component coupled to the first surface of the substrate; an image sensor stacked above the electronic component by an image sensor spacer, the image sensor comprising an active area; a window mounted above the active area; a mount coupled to the window; and a barrel supported by the mount. - View Dependent Claims (12, 14, 15, 16, 17)
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13. An optical module comprising:
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a substrate comprising a first surface; an electronic component coupled to the first surface of the substrate, the electronic component comprising bond pads on a first surface of the electronic component; an image sensor comprising an active area; an image sensor spacer stacking the image sensor above the electronic component, the image sensor spacer being coupled to a central region of the first surface of the electronic component inward of the bond pads, the image sensor spacer comprising; a central spacer; a first adhesive on a first surface of the central spacer; and a second adhesive on a second surface of the central spacer; a window mounted above the active area; a mount coupled to the window; and a barrel supported by the mount. - View Dependent Claims (18, 19, 20)
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Specification