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Using external radiators with electroosmotic pumps for cooling integrated circuits

  • US 7,576,432 B2
  • Filed: 11/09/2005
  • Issued: 08/18/2009
  • Est. Priority Date: 10/31/2003
  • Status: Active Grant
First Claim
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1. A packaged integrated circuit comprising:

  • a stack including an integrated circuit chip to be cooled and a cooling integrated circuit chip formed of a semiconductor substrate, said cooling integrated circuit chip including microchannels formed in said substrate for the circulation of a cooling fluid through said cooling integrated circuit chip;

    an integrated circuit package receiving said stack, said substrate having formed therein an inlet fluid reservoir and an outlet fluid reservoir to communicate with said microchannels; and

    an external heat exchanger mounted on said package by a pair of cooling fluid circulating tubes.

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