Using external radiators with electroosmotic pumps for cooling integrated circuits

• US 7,576,432 B2
• Filed: 11/09/2005
• Issued: 08/18/2009
• Est. Priority Date: 10/31/2003
• Status: Active Grant

• Current Assignee: Intel Corporation
• Original Assignee: Intel Corporation
• Inventors: Vandentop, Gilroy, Maveety, James G., Prasher, Ravi, Kim, Sarah E., Mahajan, Ravi, Vu, Quat T., Myers, Alan M., List, R. Scott
• Primary Examiner(s): Chu; Chris C
• Application Number:
  US11/270,071
• Publication Number:
  US 20060055030A1
• Time in Patent Office: 1,378 Days
• Field of Search: 257/E23.098, 257/686, 257/724, 257/528, 257/723, 257/706, 257/707, 257712-714, 257/778, 257/777, 361/764, 361/760, 361/704, 622/592, 438/108, 438/109
• US Class Current: 257/777
• CPC Class Codes: H01L 2224/16 of an individual bump connector
• CPC Class Codes: H01L 2224/73253 Bump and layer connectors
• CPC Class Codes: H01L 2224/82 by forming build-up interconnects at chip-level, e.g. for high density interconnects [HDI]
• CPC Class Codes: H01L 23/473 by flowing liquids H01L23/4332, H01L23/4338 take precedence

Abstract

An integrated circuit to be cooled may be abutted in face-to-face abutment with a cooling integrated circuit. The cooling integrated circuit may include electroosmotic pumps to pump cooling fluid through the cooling integrated circuits via microchannels to thereby cool the heat generating integrated circuit. The electroosmotic pumps may be fluidically coupled to external radiators which extend upwardly away from a package including the integrated circuits. In particular, the external radiators may be mounted on tubes which extend the radiators away from the package.

Claims

1. A packaged integrated circuit comprising:

a stack including an integrated circuit chip to be cooled and a cooling integrated circuit chip formed of a semiconductor substrate, said cooling integrated circuit chip including microchannels formed in said substrate for the circulation of a cooling fluid through said cooling integrated circuit chip;

an integrated circuit package receiving said stack, said substrate having formed therein an inlet fluid reservoir and an outlet fluid reservoir to communicate with said microchannels; and

an external heat exchanger mounted on said package by a pair of cooling fluid circulating tubes.

2. The circuit of claim 1, said package including a first trench for containing a fluid so as to communicate from the exterior of said cooling integrated circuit chip with said microchannels.

3. The circuit of claim 2 including a second trench isolated from said first trench and abutting said cooling integrated circuit chip in said package.

4. The circuit of claim 3 wherein said second trench to contain fluid and to fluidically communicate with said microchannels.

5. The circuit of claim 1 wherein the edges of said integrated circuit chip are sealed.

6. The circuit of claim 1 wherein said package is a package for an integrated circuit including electrical connections.

7. A packaged integrated circuit structure comprising:

a stack including an integrated circuit chip to be cooled and a cooling integrated circuit chip including a semiconductor substrate, said semiconductor substrate including microchannels for the circulation of a cooling fluid;

an integrated circuit package receiving said stack, said substrate having formed therein an inlet fluid reservoir and an outlet fluid reservoir to communicate with said microchannels; and

an external heat exchanger in communication with said outlet fluid reservoir and said inlet fluid reservoir.

8. The structure of claim 7 wherein the edges of said integrated circuit chips are sealed.

9. The structure of claim 7 wherein said stack is in contact with said fluid reservoirs.

10. The structure of claim 9 wherein said microchannels communicate with the edges of said cooling integrated circuit chip.

11. The structure of claim 7 wherein said external heat exchanger is mounted on said package through a pair of fluid circulating tubes, said tubes arranged to circulate fluid through said heat exchanger.

12. The structure of claim 11 wherein said external heat exchanger is spaced from said package.

13. The structure of claim 7 including electroosmotic pumps in said cooling integrated circuit chip.

14. The structure of claim 13 including a re-combiner coupled to each of said electroosmotic pumps.

15. The structure of claim 7 wherein said package is a package for an integrated circuit including electrical connections.