Thermal resistance measuring apparatus

• US 7,578,614 B2
• Filed: 01/20/2007
• Issued: 08/25/2009
• Est. Priority Date: 12/01/2006
• Status: Expired due to Fees

• Current Assignee: Hong Fu Jin Precision Industry (Shenzhen) Co., Ltd. (Hon Hai Precision Industry Co., Ltd.), Hon Hai Precision Industry Co., Ltd.
• Original Assignee: Hong Fu Jin Precision Industry (Shenzhen) Co., Ltd. (Hon Hai Precision Industry Co., Ltd.), Hon Hai Precision Industry Co., Ltd.
• Inventors: Ye, Zhen-Xing, Chen, Xiao-Zhu
• Primary Examiner(s): VERBITSKY, GAIL KAPLAN
• Application Number:
  US11/625,288
• Publication Number:
  US 20080130705A1
• Time in Patent Office: 948 Days
• Field of Search: 374/4, 374/5, 374/29, 374 43- 45, 374/57, 374/135, 374/137, 374/163, 374/183, 374/185, 374/208, 702130-136, 361/679.52, 361/679.54, 361/688, 361/704, 361/157, 361/158
• US Class Current: 374/44
• CPC Class Codes: G01N 25/18 by investigating thermal conductivity by calorimetry G01N25/20; by measuring change of resistance of an electrically-heated body G01N27/18

Abstract

A thermal resistance measuring apparatus for a heat sink includes a heat source, a temperature sensor, a micro control unit (MCU), a display, and a power apparatus. The heat source heats the heat sink. The temperature sensor senses temperature signals of the heat source. The MCU receives the temperature signals from the temperature sensor and processes them to calculate thermal resistance of the heat sink. The display is electrically connected to the MCU for showing the thermal resistance of the heat sink. The power apparatus supplies power to the heat source, the temperature sensor, and the MCU.

Claims

1. A thermal resistance measuring apparatus for a heat sink, comprising:

a heat source configured for heating the heat sink;

a temperature sensor configured for sensing temperature signals of the heat source;

micro control unit (MCU) configured for receiving the temperature signals from the temperature sensor and processing them to calculate thermal resistance of the heat sink;

a display electrically connected to the MCU for showing the thermal resistance of the heat sink; and

a power apparatus for supplying power to the heat source, the temperature sensor, and the MCU,

wherein the MCU calculates the thermal resistance of the heat sink by the following formula;

TR=(Tm−

Te)/Pw

where TR is the thermal resistance of the heat sink, Tm is the maximum temperature of the heat source when the heat source works under the rated power thereof, Te is room temperature, and Pw is the rated power of the heat source.

2. The thermal resistance measuring apparatus as claimed in claim 1, further comprising:

a case, wherein the heat source, the temperature sensor, and the MCU are arranged in the case, and the display is installed on one side of the case.

3. The thermal resistance measuring apparatus as claimed in claim 2, wherein a power button and a reset button are arranged on the case, the power apparatus is connected to a power pin of the MCU via the power button, the reset button is connected to a reset pin of the MCU.

4. The thermal resistance measuring apparatus as claimed in claim 2, wherein a plurality of through holes is defined in a top side of the case.

5. The thermal resistance measuring apparatus as claimed in claim 2, wherein the power apparatus is a power connector installed on the case configured for electrically connecting an external power source.

6. The thermal resistance measuring apparatus as claimed in claim 2, wherein the power apparatus is an internal power source installed in the case.

7. The thermal resistance measuring apparatus as claimed in claim 1, wherein the heat source is an aluminum oxide ceramic heating plate.

8. The thermal resistance measuring apparatus as claimed in claim 1, wherein the temperature sensor is a programmable resolution 1-wire digital thermometer and contacts the heat source.

9. The thermal resistance measuring apparatus as claimed in claim 1, wherein the display is a liquid crystal display (LCD).

10. A thermal resistance measuring apparatus comprising:

a case;

a heat source received in the case, and configured for being supplied with power to reach a desired temperature which depends on the related power of the heat source, a heat sink attached to a surface of the heat source;

a temperature sensor contacting the heat source for sensing temperature signals thereof;

a micro control unit (MCU) connected to the temperature sensor for receiving the temperature signals and processing them to calculate thermal resistance of the heat sink;

a display electrically connected to the MCU for showing the thermal resistance of the heat sink; and

a power apparatus connected to the display, the temperature sensor, and the MCU for supplying power thereto,

where the MCU calculates the thermal resistance of the heat sink by the following formula;

TR=(Tm−

Te)/Pw

where TR is the thermal resistance the heat sink, Tm is the maximum temperature of the heat source when the heat source works under the rated power thereof, Te is room temperature, and Pw is the rated power of the heat source.

11. The thermal resistance measuring apparatus as claimed in claim 10, further comprising a driving circuit electrically connected between the MCU and the display for driving the display.

12. The thermal resistance measuring apparatus as claimed in claim 10, wherein the heat source is an aluminum oxide ceramic heating plate.

13. The thermal resistance measuring apparatus as claimed in claim 10, wherein the temperature sensor is a programmable resolution 1-wire digital thermometer.

14. The thermal resistance measuring apparatus as claimed in claim 10, wherein the display is a liquid crystal display (LCD).