Process and device for coating the outer edge of a substrate during microelectronics manufacture
First Claim
1. A method of applying a composition to a substrate, said method comprising the steps of:
- providing;
a baffle comprising a body having an edge wall, said edge wall having a curved sidewall; and
a substrate having a surface, a back surface, and an edge;
positioning said baffle and substrate so that the substrate is spaced from said edge wall;
applying a composition to said substrate surface;
rotating said substrate, such that upon rotation, said composition accumulates in said curved sidewall so as to direct the composition around and in contact with the substrate edge and to the back surface of the substrate.
3 Assignments
0 Petitions
Accused Products
Abstract
New baffles and methods of using these baffles are provided. The baffles comprise a body having an edge wall configured to direct the flow of a composition against a substrate (e.g., silicon wafer) edge. The edge wall comprises a vertical surface, a curved sidewall coupled to the vertical surface, and a lip coupled to the curved sidewall. A preferred baffle is annular in shape and formed from a synthetic resinous composition. Even more preferably, the baffle is not formed of a metal. The inventive methods comprise positioning the baffle adjacent a substrate during a spin coating process so that the edge wall causes the composition to cover the edges of the substrate and preferably a portion of the back side of the substrate.
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Citations
8 Claims
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1. A method of applying a composition to a substrate, said method comprising the steps of:
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providing; a baffle comprising a body having an edge wall, said edge wall having a curved sidewall; and a substrate having a surface, a back surface, and an edge; positioning said baffle and substrate so that the substrate is spaced from said edge wall; applying a composition to said substrate surface; rotating said substrate, such that upon rotation, said composition accumulates in said curved sidewall so as to direct the composition around and in contact with the substrate edge and to the back surface of the substrate. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8)
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Specification