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Process and device for coating the outer edge of a substrate during microelectronics manufacture

  • US 7,579,044 B2
  • Filed: 11/07/2005
  • Issued: 08/25/2009
  • Est. Priority Date: 11/08/2004
  • Status: Active Grant
First Claim
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1. A method of applying a composition to a substrate, said method comprising the steps of:

  • providing;

    a baffle comprising a body having an edge wall, said edge wall having a curved sidewall; and

    a substrate having a surface, a back surface, and an edge;

    positioning said baffle and substrate so that the substrate is spaced from said edge wall;

    applying a composition to said substrate surface;

    rotating said substrate, such that upon rotation, said composition accumulates in said curved sidewall so as to direct the composition around and in contact with the substrate edge and to the back surface of the substrate.

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