Electronic assembly/system with reduced cost, mass, and volume and increased efficiency and power density

• US 7,579,218 B2
• Filed: 10/30/2006
• Issued: 08/25/2009
• Est. Priority Date: 07/23/2003
• Status: Active Grant

• Current Assignee: Display Vectors LLC (Jeffrey M. Gross)
• Original Assignee: OnScreen Technologies, Inc.
• Inventors: Popovich, John M.
• Primary Examiner(s): Graybill, David E
• Application Number:
  US11/588,941
• Publication Number:
  US 20080032461A1
• Time in Patent Office: 1,030 Days
• Field of Search: None
• US Class Current: 438/122
• CPC Class Codes: D03D 1/0088 Fabrics having an electronic function
• CPC Class Codes: D10B 2401/16 antistatic; conductive
• CPC Class Codes: F21K 9/00 Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
• CPC Class Codes: G09F 9/33 being semiconductor devices, e.g. diodes
• CPC Class Codes: H01L 2224/45015 being circular
• CPC Class Codes: H01L 2224/45124 Aluminium (Al) as principal constituent
• CPC Class Codes: H01L 2224/48091 Arched
• CPC Class Codes: H01L 2224/48472 the other connecting portion not on the bonding area also being a wedge bond, i.e. wedge-to-wedge
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/207 Diameter ranges
• CPC Class Codes: H01L 33/62 Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls

Abstract

An LED display assembly, comprising a grid of electrical conductors; light emitting diodes in association with the grid and in electrical communication with the conductors that provide power for LED operation, the grid operable to receive heat from the diodes during diode operation, and the array configured for passing coolant fluid for transfer of heat to the fluid. LED packages adjustable relative to a mounting grid, are also provided.

Claims

1. The method that includes:

a) providing multiple LEDs positioned in a display array, and

b) selectively electrically energizing the LEDs in the array to adjust the display,

c) cooling the display array,

d) said cooling including passing a coolant fluid through a heat conductive first woven mesh associated with the array, and defining a mesh plane, all of the coolant flowing only generally parallel to said plane as it flows through the mesh,

e) and providing means for confining all of the coolant fluid to flow in and parallel to said plane of the mesh.

2. The method of claim 1 including selectively adjusting the positioning of the LEDs in the array.

3. The method of claim 1 including removing heat from coolant fluid that has passed through the first mesh, at a location spaced from the first mesh.

4. The method of claim 3 wherein said location is defined by a second woven mesh, and defining a second plane through which coolant fluid flows.

5. The method of claim 4 wherein coolant fluid flows successively through said meshes, substantially in the planes of the meshes and parallel to said planes.