Microelectronic spring contact elements

• US 7,579,269 B2
• Filed: 04/08/2004
• Issued: 08/25/2009
• Est. Priority Date: 11/16/1993
• Status: Expired due to Fees

• Current Assignee: FormFactor Incorporated
• Original Assignee: FormFactor Incorporated
• Inventors: Mathieu, Gaetan L., Eldridge, Benjamin N., Khandros, Igor Y., Pedersen, David V.
• Primary Examiner(s): MENZ, LAURA MARY
• Application Number:
  US10/821,715
• Publication Number:
  US 20040198081A1
• Time in Patent Office: 1,965 Days
• Field of Search: 438/618, 438/14, 438/128, 324/754
• US Class Current: 438/618
• CPC Class Codes: B23K 1/0016 Brazing of electronic components
• CPC Class Codes: B23K 20/004 Wire welding
• CPC Class Codes: B23K 2101/40 Semiconductor devices
• CPC Class Codes: C25D 21/02 Heating or cooling
• CPC Class Codes: C25D 5/22 Electroplating combined with mechanical treatment during the deposition
• CPC Class Codes: G01R 1/0483 Sockets for un-leaded IC's having matrix type contact fields, e.g. BGA or PGA devices; Sockets for unpackaged, naked chips for IC's with connecting points around the edges only G01R1/0433
• CPC Class Codes: G01R 1/06711 Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
• CPC Class Codes: G01R 1/06727 Cantilever beams
• CPC Class Codes: G01R 1/06744 Microprobes, i.e. having dimensions as IC details
• CPC Class Codes: G01R 1/07307 with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
• CPC Class Codes: G01R 1/07314 the body of the probe being perpendicular to test object, e.g. bed of nails or probe with bump contacts on a rigid support on an elastic support, e.g. a film, G01R1/0735
• CPC Class Codes: G01R 1/07342 the body of the probe being at an angle other than perpendicular to test object, e.g. probe card
• CPC Class Codes: G01R 1/07371 using an intermediate card or back card with apertures through which the probes pass
• CPC Class Codes: G01R 1/07378 using an intermediate adapter, e.g. space transformers G01R1/07371 takes precedence
• CPC Class Codes: G01R 3/00 Apparatus or processes specially adapted for the manufacture or maintenance of measuring instruments , e.g. of probe tips
• CPC Class Codes: G01R 31/2884 using dedicated test connectors, test elements or test circuits on the IC under test G01R31/2855 takes precedence
• CPC Class Codes: G01R 31/2886 Features relating to contacting the IC under test, e.g. probe heads; chucks G01R31/2865 takes precedence, test connections, e.g. test sockets, or probes per se, G01R1/04 or G01R1/06
• CPC Class Codes: H01H 1/0036 Switches making use of microelectromechanical systems [MEMS] for electromagnetic relays H01H50/005; for electrostatic relays H01H59/0009
• CPC Class Codes: H01L 21/4853 Connection or disconnection of other leads to or from a metallisation, e.g. pins, wires, bumps
• CPC Class Codes: H01L 21/4889 Connection or disconnection of other leads to or from wire-like parts, e.g. wires
• CPC Class Codes: H01L 21/563 : Encapsulation of active face of flip-chip device, e.g. underfilling or underencapsulation of flip-chip, encapsulation preform on chip or mounting substrate
• CPC Class Codes: H01L 21/6715 : Apparatus for applying a liquid, a resin, an ink or the like H01L21/67126 takes precedence
• CPC Class Codes: H01L 21/67248 : Temperature monitoring
• CPC Class Codes: H01L 21/67253 : Process monitoring, e.g. flow or thickness monitoring
• CPC Class Codes: H01L 21/67288 : Monitoring of warpage, curvature, damage, defects or the like
• CPC Class Codes: H01L 21/76897 : Formation of self-aligned vias or contact plugs, i.e. involving a lithographically uncritical step self-aligned silicidation on field effect transistors H01L29/665
• CPC Class Codes: H01L 22/20 : Sequence of activities consisting of a plurality of measurements, corrections, marking or sorting steps
• CPC Class Codes: H01L 2224/0401 : Bonding areas specifically adapted for bump connectors, e.g. under bump metallisation [UBM]
• CPC Class Codes: H01L 2224/04042 : Bonding areas specifically adapted for wire connectors, e.g. wirebond pads
• CPC Class Codes: H01L 2224/05599 : Material
• CPC Class Codes: H01L 2224/06136 : Covering only the central area of the surface to be connected, i.e. central arrangements
• CPC Class Codes: H01L 2224/1134 : Stud bumping, i.e. using a wire-bonding apparatus
• CPC Class Codes: H01L 2224/13082 : Two-layer arrangements
• CPC Class Codes: H01L 2224/13099 : Material
• CPC Class Codes: H01L 2224/13109 : Indium [In] as principal constituent
• CPC Class Codes: H01L 2224/13111 : Tin [Sn] as principal constituent
• CPC Class Codes: H01L 2224/13113 : Bismuth [Bi] as principal constituent
• CPC Class Codes: H01L 2224/13116 : Lead [Pb] as principal constituent
• CPC Class Codes: H01L 2224/13139 : Silver [Ag] as principal constituent
• CPC Class Codes: H01L 2224/13144 : Gold [Au] as principal constituent
• CPC Class Codes: H01L 2224/13147 : Copper [Cu] as principal constituent
• CPC Class Codes: H01L 2224/13155 : Nickel [Ni] as principal constituent
• CPC Class Codes: H01L 2224/13157 : Cobalt [Co] as principal constituent
• CPC Class Codes: H01L 2224/1316 : Iron [Fe] as principal constituent
• CPC Class Codes: H01L 2224/13164 : Palladium [Pd] as principal constituent
• CPC Class Codes: H01L 2224/13169 : Platinum [Pt] as principal constituent
• CPC Class Codes: H01L 2224/1318 : Molybdenum [Mo] as principal constituent
• CPC Class Codes: H01L 2224/13184 : Tungsten [W] as principal constituent
• CPC Class Codes: H01L 2224/45015 : being circular
• CPC Class Codes: H01L 2224/45099 : Material
• CPC Class Codes: H01L 2224/4554 : Coating
• CPC Class Codes: H01L 2224/48 : of an individual wire connector
• CPC Class Codes: H01L 2224/49109 : outside the semiconductor or solid-state body
• CPC Class Codes: H01L 2224/73203 : Bump and layer connectors
• CPC Class Codes: H01L 2224/81801 : Soldering or alloying
• CPC Class Codes: H01L 2224/85201 : Compression bonding
• CPC Class Codes: H01L 2224/85399 : Material
• CPC Class Codes: H01L 23/49811 : Additional leads joined to the metallisation on the insulating substrate, e.g. pins, bumps, wires, flat leads H01L23/49827 takes precedence
• CPC Class Codes: H01L 24/06 : of a plurality of bonding areas
• CPC Class Codes: H01L 24/11 : Manufacturing methods for bumps on insulating substrates H01L21/4853
• CPC Class Codes: H01L 24/12 : Structure, shape, material or disposition of the bump connectors prior to the connecting process
• CPC Class Codes: H01L 24/48 : of an individual wire connector
• CPC Class Codes: H01L 24/49 : of a plurality of wire connectors
• CPC Class Codes: H01L 24/72 : Detachable connecting means consisting of mechanical auxiliary parts connecting the device, e.g. pressure contacts using springs or clips
• CPC Class Codes: H01L 24/81 : using a bump connector
• CPC Class Codes: H01L 25/0652 : the devices being arranged next and on each other, i.e. mixed assemblies
• CPC Class Codes: H01L 25/16 : the devices being of types provided for in two or more different main groups of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. forming hybrid circuits
• CPC Class Codes: H01L 2924/00013 : Fully indexed content
• CPC Class Codes: H01L 2924/00014 : the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01015 : Phosphorus [P]
• CPC Class Codes: H01L 2924/01019 : Potassium [K]
• CPC Class Codes: H01L 2924/01022 : Titanium [Ti]
• CPC Class Codes: H01L 2924/01027 : Cobalt [Co]
• CPC Class Codes: H01L 2924/01028 : Nickel [Ni]
• CPC Class Codes: H01L 2924/01029 : Copper [Cu]
• CPC Class Codes: H01L 2924/01033 : Arsenic [As]
• CPC Class Codes: H01L 2924/01039 : Yttrium [Y]
• CPC Class Codes: H01L 2924/01042 : Molybdenum [Mo]
• CPC Class Codes: H01L 2924/01045 : Rhodium [Rh]
• CPC Class Codes: H01L 2924/01046 : Palladium [Pd]
• CPC Class Codes: H01L 2924/01047 : Silver [Ag]
• CPC Class Codes: H01L 2924/01049 : Indium [In]
• CPC Class Codes: H01L 2924/0105 : Tin [Sn]
• CPC Class Codes: H01L 2924/01074 : Tungsten [W]
• CPC Class Codes: H01L 2924/01078 : Platinum [Pt]
• CPC Class Codes: H01L 2924/01079 : Gold [Au]
• CPC Class Codes: H01L 2924/01082 : Lead [Pb]
• CPC Class Codes: H01L 2924/014 : Solder alloys
• CPC Class Codes: H01L 2924/14 : Integrated circuits
• CPC Class Codes: H01L 2924/1433 : Application-specific integrated circuit [ASIC]
• CPC Class Codes: H01L 2924/207 : Diameter ranges
• CPC Class Codes: H01L 2924/3011 : Impedance
• CPC Class Codes: H01R 12/52 : connecting to other rigid printed circuits or like structures
• CPC Class Codes: H05K 1/141 : One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters H05K1/142 and H05K1/147 take precedence
• CPC Class Codes: H05K 2201/0397 : Tab forming integral conductive tabs H05K3/4092
• CPC Class Codes: H05K 2201/068 : wherein the coefficient of thermal expansion is important
• CPC Class Codes: H05K 2201/1031 : Surface mounted metallic connector elements
• CPC Class Codes: H05K 2201/10318 : Surface mounted metallic pins
• CPC Class Codes: H05K 2201/10378 : Interposers
• CPC Class Codes: H05K 2201/10719 : Land grid array [LGA]
• CPC Class Codes: H05K 2201/10734 : Ball grid array [BGA]; Bump grid array
• CPC Class Codes: H05K 2201/10757 : Bent leads
• CPC Class Codes: H05K 2201/10878 : Means for retention of a lead in a hole
• CPC Class Codes: H05K 2201/10909 : Materials of terminal, e.g. of leads or electrodes of components
• CPC Class Codes: H05K 2201/10946 : Leads attached onto leadless component after manufacturing the component
• CPC Class Codes: H05K 3/20 : by affixing prefabricated conductor pattern H05K1/187, H05K3/046, H05K3/4658, H05K3/4682 takes precedence
• CPC Class Codes: H05K 3/308 : Adaptations of leads connectors to printed circuits H01R12/00
• CPC Class Codes: H05K 3/326 : the printed circuit having integral resilient or deformable parts, e.g. tabs or parts of flexible circuits H05K3/365 takes precedence
• CPC Class Codes: H05K 3/3421 : Leaded components
• CPC Class Codes: H05K 3/3426 : characterised by the leads
• CPC Class Codes: H05K 3/368 : parallel to each other H05K3/361 takes precedence
• CPC Class Codes: H05K 3/4015 : using auxiliary conductive elements, e.g. pieces of metal foil, metallic spheres
• CPC Class Codes: H05K 3/4092 : Integral conductive tabs, i.e. conductive parts partly detached from the substrate
• CPC Class Codes: H05K 7/1069 : with spring contact pieces
• CPC Class Codes: Y02P 70/50 : Manufacturing or production processes characterised by the final manufactured product

Abstract

Spring contact elements are fabricated by depositing at least one layer of metallic material into openings defined in masking layers deposited on a surface of a substrate which may be an electronic component such as an active semiconductor device. Each spring contact element has a base end, a contact end, and a central body portion. The contact end is offset in the z-axis (at a different height) and in at least one of the x and y directions from the base end. In this manner, a plurality of spring contact elements are fabricated in a prescribed spatial relationship with one another on the substrate. The spring contact elements make temporary (i.e., pressure) or permanent (e.g., joined by soldering or brazing or with a conductive adhesive) connections with terminals of another electronic component to effect electrical connections therebetween. In an exemplary application, the spring contact elements are disposed on a semiconductor devices resident on a semiconductor wafer so that temporary connections can be made with the semiconductor devices to burn-in and/or test the semiconductor devices.

Claims

1. A method of making electrical connections between a first electronic component and a second electronic component, comprising:

fabricating a plurality of spring contact elements directly upon the first .electronic component, the spring contact elements each having a tip end which is spaced above a surface of the first electronic component and at least one of the plurality of spring contact elements being a different size than others of the plurality of spring contact elements; and

bringing the first electronic component together with a second electronic component so that the tip ends of the spring contact elements axe in electrical contact with corresponding terminals on the second electronic component,

wherein the first electronic component is an active semiconductor device; and

the second electronic component is a test substrate;

further comprising;

powering up the active semiconductor device while maintaining the tip ends of the spring contacts in electrical contact with the terminals of the second electronic component.

2. The method according to claim 1, wherein the plurality of spring contact elements each have an elongate structure and the at least one of the plurality of spring contact elements has a different length than the others of the plurality of spring contact elements.

3. The method according to claim 2, wherein the length is measured in a plane substantially parallel to the surface of the first electronic component.

4. The method according to claim 3, wherein the at least one of the plurality of spring contacts elements has substantially the same spring constant as the others of the plurality of spring contact elements.

5. The method according to claim 1, wherein the at least one of the plurality of spring contacts elements has substantially the same spring constant as the others of the plurality of spring contact elements.

6. The method according to claim 1, wherein the plurality of spring contact elements each have a tapered body coupling the tip end to the surface of the first electronic component.

7. The method according to claim 6, further comprising tailoring the taper for each of the plurality of spring contact elements so that the plurality of spring contact elements each have a substantially equal spring constant.

8. The method according to claim 1, wherein:

the fabricating comprises fabricating additional spring contact elements directly upon at least one other first electronic component, the additional spring contact elements each having a tip end which is spaced above a surface of the at least one other first electronic component; and

the bringing comprises bringing the first electronic component and the at least one other first electronic component together with the second electronic component so that the tip ends of the spring contact elements and the tip ends of the additional spring contact elements are in electrical contact with corresponding terminals on the second electronic component.