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Method for forming a bump, semiconductor device and method of fabricating same, semiconductor chip, circuit board, and electronic instrument

  • US 7,579,692 B2
  • Filed: 10/30/2007
  • Issued: 08/25/2009
  • Est. Priority Date: 09/04/2000
  • Status: Expired due to Fees
First Claim
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1. A semiconductor device comprising:

  • a semiconductor chips;

    a plurality of pads that is formed on a first surface of the semiconductor chip;

    a metal layer that is disposed on one of the plurality of pads;

    a plurality of leads; and

    a soldering or brazing material disposed between the metal layer and one of the plurality of leads,wherein the metal layer is bonded to the one of the plurality of leads through the soldering or brazing material,wherein at least one depression is formed in a periphery of the metal layer in a cross-sectional view of the metal layer taken parallel to the first surface of the semiconductor chip, andthe soldering or brazing material is located in the depression.

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