Method for forming a bump, semiconductor device and method of fabricating same, semiconductor chip, circuit board, and electronic instrument

• US 7,579,692 B2
• Filed: 10/30/2007
• Issued: 08/25/2009
• Est. Priority Date: 09/04/2000
• Status: Expired due to Fees

• Current Assignee: Seiko Epson Corporation (Seiko Group)
• Original Assignee: Seiko Epson Corporation (Seiko Group)
• Inventors: Matsushima, Fumiaki, Ota, Tsutomu, Makabe, Akira
• Primary Examiner(s): CLARK, JASMINE JHIHAN B
• Application Number:
  US11/980,126
• Publication Number:
  US 20080073783A1
• Time in Patent Office: 665 Days
• Field of Search: 257/737, 257/738, 257/772, 257/779, 257/E23.015, 257/E23.02, 257E2323-E23079, 438613-617, 228/180.22
• US Class Current: 257/738
• CPC Class Codes: H01L 2224/05001 Internal layers
• CPC Class Codes: H01L 2224/05022 the internal layer being at least partially embedded in the surface
• CPC Class Codes: H01L 2224/05124 Aluminium [Al] as principal constituent
• CPC Class Codes: H01L 2224/05144 Gold [Au] as principal constituent
• CPC Class Codes: H01L 2224/05147 Copper [Cu] as principal constituent
• CPC Class Codes: H01L 2224/05155 Nickel [Ni] as principal constituent
• CPC Class Codes: H01L 2224/05164 Palladium [Pd] as principal constituent
• CPC Class Codes: H01L 2224/05568 the whole external layer protruding from the surface
• CPC Class Codes: H01L 2224/05644 Gold [Au] as principal constituent
• CPC Class Codes: H01L 2224/11462 Electroplating
• CPC Class Codes: H01L 2224/1147 using a lift-off mask
• CPC Class Codes: H01L 2224/11822 by dipping, e.g. in a solder bath
• CPC Class Codes: H01L 2224/11849 Reflowing
• CPC Class Codes: H01L 2224/11901 with repetition of the same manufacturing step
• CPC Class Codes: H01L 2224/13012 in top view
• CPC Class Codes: H01L 2224/13078 being disposed next to each other, e.g. side-to-side arrangements
• CPC Class Codes: H01L 2224/1308 being stacked
• CPC Class Codes: H01L 2224/13083 Three-layer arrangements
• CPC Class Codes: H01L 2224/13099 Material
• CPC Class Codes: H01L 2224/131 with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
• CPC Class Codes: H01L 2224/13144 : Gold [Au] as principal constituent
• CPC Class Codes: H01L 2224/13155 : Nickel [Ni] as principal constituent
• CPC Class Codes: H01L 2224/1411 : the bump connectors being bonded to at least one common bonding area
• CPC Class Codes: H01L 2224/274 : by blanket deposition of the material of the layer connector
• CPC Class Codes: H01L 24/03 : Manufacturing methods
• CPC Class Codes: H01L 24/05 : of an individual bonding area
• CPC Class Codes: H01L 24/11 : Manufacturing methods for bumps on insulating substrates H01L21/4853
• CPC Class Codes: H01L 24/13 : of an individual bump connector
• CPC Class Codes: H01L 24/94 : at wafer-level, i.e. with connecting carried out on a wafer comprising a plurality of undiced individual devices
• CPC Class Codes: H01L 2924/00012 : Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00013 : Fully indexed content
• CPC Class Codes: H01L 2924/00014 : the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 2924/01004 : Beryllium [Be]
• CPC Class Codes: H01L 2924/01005 : Boron [B]
• CPC Class Codes: H01L 2924/01006 : Carbon [C]
• CPC Class Codes: H01L 2924/01013 : Aluminum [Al]
• CPC Class Codes: H01L 2924/01029 : Copper [Cu]
• CPC Class Codes: H01L 2924/0103 : Zinc [Zn]
• CPC Class Codes: H01L 2924/01033 : Arsenic [As]
• CPC Class Codes: H01L 2924/01046 : Palladium [Pd]
• CPC Class Codes: H01L 2924/01047 : Silver [Ag]
• CPC Class Codes: H01L 2924/01061 : Promethium [Pm]
• CPC Class Codes: H01L 2924/01075 : Rhenium [Re]
• CPC Class Codes: H01L 2924/01078 : Platinum [Pt]
• CPC Class Codes: H01L 2924/01079 : Gold [Au]
• CPC Class Codes: H01L 2924/01082 : Lead [Pb]
• CPC Class Codes: H01L 2924/014 : Solder alloys
• CPC Class Codes: H01L 2924/14 : Integrated circuits
• CPC Class Codes: H01L 2924/15311 : being a ball array, e.g. BGA

Abstract

A method for forming a bump includes the steps of forming a resist layer so that a through-hole formed therein is located on a pad; and forming a metal layer to be electrically connected to the pad conforming to the shape of the through-hole. The metal layer is formed so as to have a shape in which is formed a region for receiving a soldering or brazing material.

Claims

1. A semiconductor device comprising:

a semiconductor chips;

a plurality of pads that is formed on a first surface of the semiconductor chip;

a metal layer that is disposed on one of the plurality of pads;

a plurality of leads; and

a soldering or brazing material disposed between the metal layer and one of the plurality of leads,

wherein the metal layer is bonded to the one of the plurality of leads through the soldering or brazing material,

wherein at least one depression is formed in a periphery of the metal layer in a cross-sectional view of the metal layer taken parallel to the first surface of the semiconductor chip, and

the soldering or brazing material is located in the depression.

2. The semiconductor device according to claim 1,

wherein two or more metal layers are formed on the one of the pads, and

the soldering or brazing material is located in a region formed between adjacent metal layers of the two or more metal layers on the one of the pads.

3. A circuit board on which is mounted the semiconductor device according to claim 1.

4. An electronic instrument comprising the semiconductor device according to claim 1.

5. A semiconductor device comprising:

a semiconductor chip;

a plurality of pads that is formed on the semiconductor chip;

a metal layer that is disposed on one of the plurality of the pads, the metal layer having a first surface, a second surface and a third surface, the first surface facing the one the plurality of pads, the second surface being opposite to the first surface, the third surface connecting the first surface and the second surface;

a plurality of leads; and

a soldering or brazing material that is disposed between the metal layer and one of the plurality of leads,

wherein the metal layer is bonded to the one of the plurality of leads through the soldering or brazing material,

wherein at least one depression is formed in the third surface of the metal layer, and

the soldering or brazing material is located in the depression.

6. The semiconductor device according to claim 5,

wherein two or more metal layers are formed on the one of the pads and

the soldering or brazing material is located in a region formed between adjacent metal layers of the two or more metal layers on the one of the pads.

7. A circuit board on which is mounted the semiconductor device according to claim 5.

8. An electronic instrument comprising the semiconductor device according to claim 5.