Advanced antenna integrated printed wiring board with metallic waveguide plate
First Claim
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1. A phased array antenna system, comprising:
- a multi-layer printed wiring board assembly;
at least one probe integrated with the multi-layer printed wiring board assembly;
at least one electronic device integrated with the multi-layer printed wiring board assembly;
a metallic waveguide plate positioned adjacent to the multi-layer printed wiring board assembly such that heat generated by the at least one electronic device dissipates to the metallic waveguide plate; and
at least one waveguide formed within the metallic waveguide plate, wherein at least a portion of the at least one probe is disposed within the at least one waveguide of the metallic waveguide plate; and
dielectric material filling the at least one waveguide around the entire portion of the at least one probe disposed within the at least one waveguide of the metallic waveguide plate, wherein the dielectric material forms a dielectric barrier between the at least one probe and the metallic waveguide plate.
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Abstract
A system and method of constructing a phased array antenna system that incorporates a printed wiring board assembly with a metallic waveguide plate is provided. The system uses a metallic waveguide plate to dissipate heat toward and through the waveguide portion of the system.
14 Citations
17 Claims
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1. A phased array antenna system, comprising:
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a multi-layer printed wiring board assembly; at least one probe integrated with the multi-layer printed wiring board assembly; at least one electronic device integrated with the multi-layer printed wiring board assembly; a metallic waveguide plate positioned adjacent to the multi-layer printed wiring board assembly such that heat generated by the at least one electronic device dissipates to the metallic waveguide plate; and at least one waveguide formed within the metallic waveguide plate, wherein at least a portion of the at least one probe is disposed within the at least one waveguide of the metallic waveguide plate; and dielectric material filling the at least one waveguide around the entire portion of the at least one probe disposed within the at least one waveguide of the metallic waveguide plate, wherein the dielectric material forms a dielectric barrier between the at least one probe and the metallic waveguide plate. - View Dependent Claims (2, 3, 4, 5, 6, 7)
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8. A method of constructing a phased array antenna system, comprising:
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forming at least one waveguide within a metallic waveguide plate; positioning the metallic waveguide plate adjacent to a multi-layer printed wiring board assembly, wherein the multi-layer printed wiring board assembly has at least one electronic device integrated therein; filling the at least one waveguide within the metallic waveguide plate with dielectric material; drilling at least one channel through the dielectric material filling the at least one waveguide within the metallic waveguide plate; disposing at least one probe into the at least one channel so that the at least one waveguide within the metallic waveguide plate is filled with the at least one probe and the dielectric material surrounding the at least one probe to form a dielectric barrier between the at least one probe and the metallic waveguide plate; and dissipating heat from the at least one electronic device through the metallic waveguide plate. - View Dependent Claims (9, 10, 11, 12, 13, 14, 15, 16, 17)
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Specification