MEMS device and interconnects for same
First Claim
1. A microelectromechanical systems device, comprising:
- a fixed electrode;
a reflective layer in a display region of the device;
a mechanical layer over the reflective layer;
a conductive layer between the fixed electrode and the reflective layer; and
an electrical interconnect in a peripheral region of the device, the electrical interconnect in electrical communication with circuitry outside the device and at least one of the fixed electrode and the reflective layer, wherein at least a portion of the electrical interconnect and the conductive layer are formed from a same material, wherein a thickness of the portion of the electrical interconnect corresponds to a thickness of the conductive layer.
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Accused Products
Abstract
A microelectromechanical systems device having an electrical interconnect between circuitry outside the device and at least one of an electrode and a movable layer within the device. At least a portion of the electrical interconnect is formed from the same material as a conductive layer between the electrode and a mechanical layer of the device. In an embodiment, this conductive layer is a sacrificial layer that is subsequently removed to form a cavity between the electrode and the movable layer. The sacrificial layer is preferably formed of molybdenum, doped silicon, tungsten, or titanium. According to another embodiment, the conductive layer is a movable reflective layer that preferably comprises aluminum.
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Citations
47 Claims
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1. A microelectromechanical systems device, comprising:
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a fixed electrode; a reflective layer in a display region of the device; a mechanical layer over the reflective layer; a conductive layer between the fixed electrode and the reflective layer; and an electrical interconnect in a peripheral region of the device, the electrical interconnect in electrical communication with circuitry outside the device and at least one of the fixed electrode and the reflective layer, wherein at least a portion of the electrical interconnect and the conductive layer are formed from a same material, wherein a thickness of the portion of the electrical interconnect corresponds to a thickness of the conductive layer. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 33, 34, 35, 36, 37)
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12. A method of forming a microelectromechanical systems device, the method comprising:
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providing a fixed electrode; forming a conductive layer over the fixed electrode; patterning the conductive layer to form at least a portion of an electrical interconnect in a peripheral region of the device and to form at least a portion of a sacrificial layer in a display region of the device, wherein a thickness of the electrical interconnect corresponds to a thickness of the sacrificial layer, the electrical interconnect in electrical communication with circuitry outside the device and at least one of the fixed electrode and a second electrode over the sacrificial layer; and forming a mechanical layer over the conductive layer after patterning the conductive layer. - View Dependent Claims (13, 14, 15, 16, 17, 18, 19, 20)
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21. A method of forming a microelectromechanical systems device, the method comprising
providing a fixed electrode formed over a substrate; -
forming a movable layer over the fixed electrode in a display region of the device; forming a mechanical layer over the movable layer; depositing a conductive layer between the fixed electrode and the mechanical layer, wherein a portion of the conductive layer forms at least a part of an electrical interconnect in a peripheral region of the device, the electrical interconnect in electrical communication with circuitry outside the device and at least one of the fixed electrode and the movable layer; and selectively removing the conductive layer to create at least one cavity in the display region, wherein a thickness of the part of the electrical interconnect corresponds to a height of the cavity. - View Dependent Claims (22, 23, 24, 25)
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26. A microelectromechanical systems device, comprising:
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a fixed electrode; a movable layer in a display region of the device; a mechanical layer over the movable layer; a cavity between the fixed electrode and the movable layer; and an electrical interconnect in a peripheral region of the device, the electrical interconnect in electrical communication with circuitry outside the device and at least one of the fixed electrode and the movable layer, wherein a thickness of a portion of the electrical interconnect corresponds to a height of the cavity. - View Dependent Claims (27, 28, 38, 39, 40, 41, 42)
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29. A method of forming a microelectromechanical systems device, the method comprising:
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providing fixed electrode; depositing a conductive material over the fixed electrode; forming a movable layer over the conductive layer; depositing a mechanical layer over the movable layer, wherein the conductive material forms at least a portion of an electrical interconnect in a peripheral region of the device, the electrical interconnect in electrical communication with circuitry outside the device and at least one of the fixed electrode and the movable layer; and selectively removing the conductive material in a display region of the device to form a cavity between the fixed electrode and the movable layer after the mechanical layer is deposited. - View Dependent Claims (30, 31, 32, 43, 44, 45, 46, 47)
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Specification