System-in-package wireless communication device comprising prepackaged power amplifier

• US 7,580,687 B2
• Filed: 12/30/2005
• Issued: 08/25/2009
• Est. Priority Date: 01/19/2005
• Status: Active Grant

• Current Assignee: Micro Mobio Corporation
• Original Assignee: Micro Mobio Corporation
• Inventors: Ichitsubo, Ikuroh, Liu, Wen Chung, Kubota, Kanya
• Primary Examiner(s): Le; Lana N
• Application Number:
  US11/323,763
• Publication Number:
  US 20060160505A1
• Time in Patent Office: 1,334 Days
• Field of Search: 455/90.3, 455/127.2, 455/128, 330/126, 330/140, 257/692
• US Class Current: 455/127.1
• CPC Class Codes: H01L 2223/6677 for antenna, e.g. antenna included within housing of semiconductor device antennas per se H01Q
• CPC Class Codes: H01L 2224/32225 the item being non-metallic, e.g. insulating substrate with or without metallisation
• CPC Class Codes: H01L 2224/48227 connecting the wire to a bond pad of the item
• CPC Class Codes: H01L 2224/73265 Layer and wire connectors
• CPC Class Codes: H01L 24/73 Means for bonding being of different types provided for in two or more of groups H01L24/10, H01L24/18, H01L24/26, H01L24/34, H01L24/42, H01L24/50, H01L24/63, H01L24/71
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/00012 Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/1305 Bipolar Junction Transistor [BJT]
• CPC Class Codes: H01L 2924/14 Integrated circuits
• CPC Class Codes: H01L 2924/1815 Shape
• CPC Class Codes: H01L 2924/19105 in a side-by-side arrangement on a common die mounting substrate
• CPC Class Codes: H01L 2924/3011 Impedance
• CPC Class Codes: H01L 2924/3025 Electromagnetic shielding
• CPC Class Codes: H03F 1/34 Negative-feedback-circuit arrangements with or without positive feedback H03F1/02 - H03F1/30, H03F1/38 - H03F1/50, H03F3/50 take precedence ; for rejection of common mode signals H03F3/45479
• CPC Class Codes: H03F 2200/294 the amplifier being a low noise amplifier [LNA]
• CPC Class Codes: H03F 2200/372 Noise reduction and elimination in amplifier
• CPC Class Codes: H03F 2200/465 Power sensing
• CPC Class Codes: H03F 3/195 in integrated circuits
• CPC Class Codes: H03F 3/24 of transmitter output stages
• CPC Class Codes: H04B 2001/0433 with linearisation using feedback

Abstract

A substantially rectangular shaped power amplifier module includes a power amplifier for amplifying radio frequency signals, a bias control terminal and a power sensing terminal disposed on the same side of the power amplifier module, an input terminal and a ground terminal disposed on the same side of the power amplifier module, and an output terminal and one or more power supply terminals disposed on the same side of the power amplifier module.

Claims

1. A substantially rectangular shaped power amplifier module, comprising:

a first input terminal configured to receive a first input radio frequency signal;

a first power amplifier configured to produce a first amplified radio frequency signal in response to the first input radio frequency signal under the control of a bias control signal;

a first output terminal configured to output the first amplified radio frequency signal;

a second input terminal configured to receive a second input radio frequency signal, wherein the first input terminal and the second input terminal are disposed on a first side of the substantially rectangular shaped power amplifier module;

a second power amplifier configured to produce a second amplified radio frequency signal in response to the second input radio frequency signal under the control of the bias control signal;

a second output terminal configured to output the second amplified radio frequency signal, wherein the first output terminal and the second output terminal are disposed on a second side of the substantially rectangular shaped power amplifier module;

a first power supply terminal disposed on a third side of the substantially rectangular shaped power amplifier module and configured to supply power to the first power amplifier;

a bias control terminal disposed on the third side of the substantially rectangular shaped power amplifier module and in communication with the first power amplifier and the second power amplifier, wherein the bias control terminal is configured to receive the bias control signal;

a second power supply terminal disposed on a fourth side of the substantially rectangular shaped power amplifier module and configured to supply power to the second power amplifier; and

a power sensing terminal disposed on the fourth side of the substantially rectangular shaped power amplifier module, wherein the power sensing terminal is configured to output a power sensing signal in response to the first amplified radio frequency signal and the second amplified radio frequency signal.

2. The substantially rectangular shaped power amplifier module of claim 1, further comprising one or more ground terminals disposed on the first side of the substantially rectangular shaped power amplifier module and configured to provide ground connections to the first power amplifier and the second power amplifier.

3. The substantially rectangular shaped power amplifier module of claim 2, further comprising one or more ground terminals disposed on the second side of the substantially rectangular shaped power amplifier module and configured to provide ground connections to the first power amplifier and the second power amplifier.

4. The substantially rectangular shaped power amplifier module of claim 1, wherein the first side and the second side are disposed at the opposite sides of the substantially rectangular shaped power amplifier module.

5. The substantially rectangular shaped power amplifier module of claim 1, wherein the third side and the fourth side are disposed at the opposite sides of the substantially rectangular shaped power amplifier module.

6. The substantially rectangular shaped power amplifier module of claim 1, further comprising a ground terminal on a first surface of the substantially rectangular shaped power amplifier module.

7. The substantially rectangular shaped power amplifier module of claim 6, wherein the ground terminal covers a majority of a first surface of the substantially rectangular shaped power amplifier module.

8. The substantially rectangular shaped power amplifier module of claim 1, wherein the first side and the third side form a corner of the substantially rectangular shaped power amplifier module.

9. The substantially rectangular shaped power amplifier module of claim 1, further comprising:

a first bias control circuit configured to receive the bias control signal from the bias control terminal to control biasing of the first power amplifier; and

a second bias control circuit configured to receive the bias control signal from the bias control terminal to control biasing of the second power amplifier.

10. The substantially rectangular shaped power amplifier module of claim 1, further comprising one or more unconnected terminals.

11. The substantially rectangular shaped power amplifier module of claim 1, wherein the first side approximately 1.6 mm in width and the second side is approximately 2 mm in length and has a height of approximately 0.5 mm.

12. The substantially rectangular shaped power amplifier module of claim 1, wherein at least one of the first input terminal, the second input terminal, the first output terminal, the second output terminal, the bias control terminal, and the power sensing terminal has dimensions of approximately 0.2 mm by 0.2 mm.

13. The substantially rectangular shaped power amplifier module of claim 1, further comprising a ground plane with dimensions of approximately 1.2 mm by 1.6 mm.

14. The substantially rectangular shaped power amplifier module of claim 1, wherein the input impedance for the first input radio frequency signal is 50 ohm and the output impedance for the first output radio frequency signal is 50 ohm.

15. The substantially rectangular shaped power amplifier module of claim 1, further comprising:

a power sensing circuit configured to detect the first amplified radio frequency signal and the first amplified radio frequency signal to produce the power sensing signal at the power sensing terminal.