Flip chip in leaded molded package and method of manufacture thereof

• US 7,582,956 B2
• Filed: 03/29/2007
• Issued: 09/01/2009
• Est. Priority Date: 12/16/1999
• Status: Expired due to Fees

• Current Assignee: Semiconductor Components Industries LLC (ON Semiconductor Corporation)
• Original Assignee: Fairchild Semiconductor Corporation (ON Semiconductor Corporation)
• Inventors: Joshi, Rajeev, Tangpuz, Consuelo N., Manatad, Romel N.
• Primary Examiner(s): Purvis, Sue
• Assistant Examiner(s): SODERHOLM, KRISTA Z
• Application Number:
  US11/693,141
• Publication Number:
  US 20080036056A1
• Time in Patent Office: 887 Days
• Field of Search: 257/685, 257/673, 257/E23.129
• US Class Current: 257/673
• CPC Class Codes: H01L 2223/54406 comprising alphanumeric information
• CPC Class Codes: H01L 2223/54433 containing identification or tracking information
• CPC Class Codes: H01L 2223/54486 Located on package parts, e.g. encapsulation, leads, package substrate
• CPC Class Codes: H01L 23/3121 a substrate forming part of the encapsulation
• CPC Class Codes: H01L 23/3185 the coating covering also the sidewalls of the semiconductor body
• CPC Class Codes: H01L 23/49531 the additional leads being a wiring board
• CPC Class Codes: H01L 23/49562 for devices being provided for in H01L29/00
• CPC Class Codes: H01L 23/544 Marks applied to semiconductor devices or parts, e.g. registration marks, alignment structures, wafer maps test patterns for characterising or monitoring manufacturing processes H01L22/00
• CPC Class Codes: H01L 2924/00 Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
• CPC Class Codes: H01L 2924/0002 Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
• CPC Class Codes: H01L 2924/13091 Metal-Oxide-Semiconductor Field-Effect Transistor [MOSFET]

Abstract

A chip device that includes a leadframe, a die and a mold compound. The backside of the die is metallized and exposed through a window defined within a mold compound that encapsulates the die when it is coupled to the leadframe. Leads on the leadframe are coupled to source and gate terminals on the die while the metallized backside of the die serves as the drain terminals.

Claims

1. An assembly comprising:

a semiconductor die package comprising a leadframe, a semiconductor die that includes a backside including a first electrical terminal and a frontside including a second electrical terminal, wherein the first electrical terminal and the second electrical terminal are terminals in an electrical device, wherein the semiconductor die is mounted on the leadframe, and a body comprising a molding material covering at least a portion of the semiconductor die and at least a portion of the leadframe, wherein the body has a window and an exterior surface, wherein the backside of the semiconductor die is exposed through the window of the body and wherein the backside is substantially flush with the exterior surface of the body; and

a circuit board, wherein the backside of the semiconductor die is directly attached to the circuit board.

2. The assembly of claim 1 wherein first electrical terminal is a drain terminal.

3. The assembly of claim 1 wherein the leadframe has leads that extend laterally away from the molding material.

4. The assembly of claim 1 wherein the second electrical terminal is a source terminal or a gate terminal.

5. The assembly of claim 1 wherein the leadframe is pre-plated.

6. The assembly of claim 1 wherein the semiconductor die is mounted to the leadframe with solder.

7. The assembly of claim 1 wherein the leadframe has leads that have surfaces substantially coplanar with the backside of the semiconductor die.

8. The assembly of claim 1 wherein the leadframe includes two die attach pads.

9. The assembly of claim 8 wherein the semiconductor die is a first semiconductor die and the semiconductor die package comprises a second semiconductor die, wherein the first and second semiconductor dies are attached to the two die attach pads of the leadframe.