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Multiple chip package module including die stacked over encapsulated package

  • US 7,582,960 B2
  • Filed: 05/05/2006
  • Issued: 09/01/2009
  • Est. Priority Date: 05/05/2005
  • Status: Active Grant
First Claim
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1. A multiple chip package module comprising:

  • a module having a substrate and a package encapsulant on the substrate;

    a first package comprising;

    a first package substrate having a die mount side and a land side,a first package die mounted on the die mount side of the first package substrate,a first encapsulant covering the first package die and the die mount side of the first package substrate, andthe first package being inverted and supported by the first encapsulant on the package encapsulant over a first side of the module substrate;

    wire bonds connecting a land side of the first package substrate with the first side of the module substrate; and

    a module encapsulant covering the land side.

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