Multiple chip package module including die stacked over encapsulated package
First Claim
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1. A multiple chip package module comprising:
- a module having a substrate and a package encapsulant on the substrate;
a first package comprising;
a first package substrate having a die mount side and a land side,a first package die mounted on the die mount side of the first package substrate,a first encapsulant covering the first package die and the die mount side of the first package substrate, andthe first package being inverted and supported by the first encapsulant on the package encapsulant over a first side of the module substrate;
wire bonds connecting a land side of the first package substrate with the first side of the module substrate; and
a module encapsulant covering the land side.
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Abstract
A module having multiple die includes a first package (such as a land grid array package) inverted and mounted upon a lower substrate, and one or more die mounted or stacked over the upward-facing side of the inverted package.
139 Citations
14 Claims
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1. A multiple chip package module comprising:
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a module having a substrate and a package encapsulant on the substrate; a first package comprising; a first package substrate having a die mount side and a land side, a first package die mounted on the die mount side of the first package substrate, a first encapsulant covering the first package die and the die mount side of the first package substrate, and the first package being inverted and supported by the first encapsulant on the package encapsulant over a first side of the module substrate; wire bonds connecting a land side of the first package substrate with the first side of the module substrate; and a module encapsulant covering the land side. - View Dependent Claims (2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, 13, 14)
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Specification