Imaging device package camera module and camera module producing method

• US 7,583,309 B2
• Filed: 06/27/2003
• Issued: 09/01/2009
• Est. Priority Date: 06/28/2002
• Status: Expired due to Fees

• Current Assignee: Kyocera Corporation
• Original Assignee: Kyocera Corporation
• Inventors: Aizawa, Mitsuaki, Nakai, Masanobu, Itoh, Hiroki
• Primary Examiner(s): Ho; Tuan V
• Application Number:
  US10/609,773
• Publication Number:
  US 20040095501A1
• Time in Patent Office: 2,258 Days
• Field of Search: 348/335, 348/340
• US Class Current: 348/340
• CPC Class Codes: H01L 2224/05568 the whole external layer protruding from the surface
• CPC Class Codes: H01L 2224/05573 Single external layer
• CPC Class Codes: H01L 2224/05599 Material
• CPC Class Codes: H01L 2224/14135 Covering only the peripheral area of the surface to be connected, i.e. peripheral arrangements
• CPC Class Codes: H01L 2224/17051 Bump connectors having different shapes
• CPC Class Codes: H01L 2224/29011 comprising apertures or cavities
• CPC Class Codes: H01L 2224/29035 covering only the peripheral area of the surface to be connected
• CPC Class Codes: H01L 2224/73204 the bump connector being embedded into the layer connector
• CPC Class Codes: H01L 2224/81191 wherein the bump connectors are disposed only on the semiconductor or solid-state body
• CPC Class Codes: H01L 27/14618 Containers
• CPC Class Codes: H01L 27/14625 Optical elements or arrangements associated with the device
• CPC Class Codes: H01L 2924/00012 Relevant to the scope of the group, the symbol of which is combined with the symbol of this group
• CPC Class Codes: H01L 2924/00014 the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details
• CPC Class Codes: H01L 31/0203 Containers; Encapsulations , e.g. encapsulation of photodiodesfor photovoltaic devices H01L31/048; for organic photosensitive devices H10K30/80
• CPC Class Codes: H01L 31/02325 the optical elements not being integrated nor being directly associated with the device
• CPC Class Codes: H04N 23/54 Mounting of pick-up tubes, electronic image sensors, deviation or focusing coils
• CPC Class Codes: H04N 23/55 Optical parts specially adapted for electronic image sensors; Mounting thereof
• CPC Class Codes: H04N 23/57 Mechanical or electrical details of cameras or camera modules specially adapted for being embedded in other devices
• CPC Class Codes: H05K 1/0219 Printed shielding conductors for shielding around or between signal conductors, e.g. coplanar or coaxial printed shielding conductors
• CPC Class Codes: H05K 2201/09809 Coaxial layout reduction of cross-talk, noise or interference by printed shielding conductors for shielding around a single via or around a group of vias H05K1/0222
• CPC Class Codes: H05K 2201/10719 : Land grid array [LGA]
• CPC Class Codes: H05K 2201/10977 : Encapsulated connections applying non-metallic protective coatings for encapsulating mounted components H05K3/284
• CPC Class Codes: H05K 3/323 : by applying an anisotropic conductive adhesive layer over an array of pads

Abstract

An IR cut-filter is fitted into a support portion within the optical-system containing portion of a ceramic board and a lens 11 is mounted in the ceramic board by screwing the lens.

In an imaging-device containing portion, an imaging device with a light receiving portion arranged therein is mounted outside the support portion by flip-chip packaging. Further, the vicinity of the flip-chip packaging portion is sealed with resin.

Additionally, on the base of the imaging-device containing portion of a ceramic package, the lands of an imaging device are so positioned as to correspond to the respective land positions of a ceramic package and patterns are electrically connected by melting a gold bump, whereby the imaging device is mounted by bare-chip packaging. The land portion is filled with an underfill agent and then sheet glass is mounted on a through-hole 5b and sealed with a sealing agent, so that the through-hole 5b for containing a light receiving portion is sealed up.

Claims

1. A small-sized module camera comprising:

a board having a through-hole, whereby to form an optical-system containing portion for containing an optical filter and a lens on the upper side of the through-hole and an imaging-device containing portion for containing an imaging device on the lower side of the through-hole;

the lens mounted on the top surface side of the board;

the imaging device mounted on the undersurface side of the board and used for receiving an image which is picked up through the lens; and

a support portion for supporting the optical filter between the optical-system containing portion and the imaging-device containing portion provided so that the support portion is projected on the imaging-device containing portion side,

wherein the imaging device and a land portion of the board are at a portion outside the support portion of the imaging-device containing portion.

2. A small-sized module camera as claimed in claim 1, wherein the imaging device is contained in the imaging-device containing portion so that the undersurface of the imaging device is positioned inside the underside of the through-hole of the board;

and

solder lands are provided around the board.

3. A small-sized module camera as claimed in claim 1,

wherein the board has a layer capable of forming electrical passive elements inside.

4. A small-sized module camera as claimed in claim 1, wherein an internal reflection preventive process is applied to the inner wall of the imaging-device containing portion.

5. A small-sized module camera as claimed in claim 1, wherein threads are respectively formed on the peripheral face of the lens and the inner wall of the imaging-device containing portion;

and

the lens is fitted to the optical-system containing portion by screwing the lens in.