Processor apparatus

• US 7,583,505 B2
• Filed: 01/18/2008
• Issued: 09/01/2009
• Est. Priority Date: 05/20/1992
• Status: Expired due to Fees

• Current Assignee: Seiko Epson Corporation (Seiko Group)
• Original Assignee: Seiko Epson Corporation (Seiko Group)
• Inventors: Wakabayashi, Kenichi, Takayama, Chitoshi, Shiozaki, Tadashi
• Primary Examiner(s): DATSKOVSKIY, MICHAIL V
• Application Number:
  US12/016,646
• Publication Number:
  US 20080158829A1
• Time in Patent Office: 592 Days
• Field of Search: 361/687, 361/690, 361/692, 361702-712, 361714-721, 361/732, 361/737, 361/803, 361/816, 361/818, 361726-728, 361/761, 257715-727, 165/80.2, 165/80.3, 165/80.4, 165/165, 165/185, 165/104.33, 174/50, 174/51
• US Class Current: 361/714
• CPC Class Codes: B41J 29/377 Cooling or ventilating arrangements
• CPC Class Codes: G06K 19/077 Constructional details, e.g. mounting of circuits in the carrier
• CPC Class Codes: G06K 19/07735 the record carrier comprising means for protecting against electrostatic discharge
• CPC Class Codes: G06K 19/07741 comprising a first part operating as a regular record carrier and a second attachable part that changes the functional appearance of said record carrier, e.g. a contact-based smart card with an adapter part which, when attached to the contact card makes the contact card function as a non-contact card
• CPC Class Codes: G06K 19/07743 External electrical contacts
• CPC Class Codes: H05K 5/0208 Interlock mechanisms; Means for avoiding unauthorised use or function, e.g. tamperproof
• CPC Class Codes: H05K 5/0256 of interchangeable modules or receptacles therefor, e.g. cartridge mechanisms
• CPC Class Codes: H05K 7/20445 the coupling element being an additional piece, e.g. thermal standoff

Abstract

A processor apparatus is disclosed. The apparatus includes a case with air passages, and a heat dissipation plate structure having a thermally conductive material within the case. It includes a processor having a major surface, where the processor generates heat when energized, and where the heat dissipation plate structure is adapted to dissipate heat from the processor. It also includes an array of pins, where the pins in the array of pins are substantially perpendicular to the major surface of the processor and are operatively coupled to the processor. It also includes a socket assembly, and a circuit board, where the socket assembly is on the circuit board. The pins in the array of pins are configured to be received in the socket assembly.

Claims

1. An apparatus comprising:

a case comprising air passages;

a heat dissipation plate structure comprising a thermally conductive material within the case;

a processor comprising a major surface, wherein said processor generates heat when energized, and wherein the heat dissipation plate structure is adapted to dissipate heat from the processor;

an array of pins, wherein the pins in the array of pins are substantially perpendicular to the major surface of the processor and are operatively coupled to the processor;

a socket assembly; and

a circuit board, wherein the socket assembly is on the circuit board,

wherein the pins in the array of pins are configured to be received in the socket assembly,

wherein the heat dissipation plate structure comprises a side portion that faces the processor.

3. The apparatus of claim 1 wherein the processor is a microprocessor.

4. The apparatus of claim 1 wherein the heat dissipation plate structure comprises aluminum.

5. The apparatus of claim 1 wherein the processor is a RISC type processor.

6. The apparatus of claim 1 wherein the processor operates at a frequency of 25 MHz or more.

7. The apparatus of claim 1 further comprising a conductive structure mechanically coupled to the processor, and wherein the conductive structure forms an electromagnetic shield for the processor.

8. The apparatus of claim 1 further comprising a conductive structure mechanically coupled to the processor, wherein the conductive structure forms an electromagnetic shield for the processor, and wherein the conductive structure is grounded to the circuit board.

9. The apparatus of claim 1 wherein the pins are only at a peripheral region of the processor.

10. The apparatus of claim 1 wherein the apparatus is a computer.

11. The apparatus of claim 1 wherein the apparatus is a printer.

13. The apparatus of claim 1 wherein the air passages are in the form of slots.

2. An apparatus comprising:

a case comprising air passages;

a heat dissipation plate structure comprising a thermally conductive material within the case;

a processor comprising a major surface, wherein said processor generates heat when energized, and wherein the heat dissipation plate structure is adapted to dissipate heat from the processor;

an array of pins, wherein the pins in the array of pins are substantially perpendicular to the major surface of the processor and are operatively coupled to the processor;

a socket assembly;

a circuit board, wherein the socket assembly is on the circuit board, wherein the pins in the array of pins are configured to be received in the socket assembly, and

a biasing element operatively coupled to the processor.

12. An apparatus comprising:

a case comprising air passages;

a heat dissipation plate structure comprising a thermally conductive material within the case;

a processor comprising a major surface, wherein said processor generates heat when energized, and wherein the heat dissipation plate structure is adapted to dissipate heat from the processor;

an array of pins, wherein the pins in the array of pins are substantially perpendicular to the major surface of the processor and are operatively coupled to the processor;

a socket assembly;

a circuit board, wherein the socket assembly is on the circuit board, wherein the pins in the array of pins are configured to be received in the socket assembly; and

a biasing element comprising a pushing element operatively coupled to the processor.