Method for determining correction values for the measured values of positions of structures on a substrate

• US 7,584,072 B2
• Filed: 06/27/2008
• Issued: 09/01/2009
• Est. Priority Date: 07/17/2007
• Status: Active Grant

• Current Assignee: Vistec Semiconductor Systems GmbH (Dr. Johannes Heidenhain GmbH)
• Original Assignee: Vistec Semiconductor Systems GmbH (Dr. Johannes Heidenhain GmbH)
• Inventors: Gundal, Linda, Fricke, Wolfgang
• Primary Examiner(s): Lau; Tung S
• Assistant Examiner(s): SUN, XIUQIN
• Application Number:
  US12/147,703
• Publication Number:
  US 20090024351A1
• Time in Patent Office: 431 Days
• Field of Search: 702/150, 219/121.71, 250/548, 250/491.1, 345/173, 427/554, 178/18.05, 178/18.01, 356/400, 356/601, 355/53, 430/5
• US Class Current: 702/150
• CPC Class Codes: G01B 21/045 Correction of measurements G01B9/02055 takes precedence

Abstract

A method for allocating correction values of the degree of bending of a substrate (2) relative to a coordinate system (40) of a coordinate measuring machine (1) is disclosed. The positions of the at least two reference marks (32) on the substrate holder (27) are automatically determined relative to the coordinate system (40) of the coordinate measuring machine (1) for each substrate (2) currently placed in the substrate holder (27) in the coordinate measuring machine (1).

Claims

1. A method for determining correction values for positions of structures on a substrate, wherein the correction values are determined on the basis of a degree of bending of the substrate in a substrate holder relative to a coordinate system of a coordinate measuring machine, comprising the steps of:

calculating the degree of bending of the substrate for each type of substrate, wherein the correction values for the degree of bending of the substrate are known relative to a reference point, and wherein the substrate is supported on three support points in the substrate support;

determining the position of two reference marks on the substrate holder with respect to the reference point for each substrate holder used with coordinate measuring machine;

automatically determining a position of the at least two reference marks on the substrate holder relative to the coordinates system of the coordinate measuring machine for the substrate holder currently being used in the coordinate measuring machine, wherein the position of the reference point relative to the coordinate system of the coordinate measuring machine is calculated herefrom; and

determining on the basis of the measuring result for the position of the reference point, the allocation of correction values for calculation of the degree of bending of the substrate currently in the substrate holder relative to the coordinate system of the coordinate measuring machine, at each point of the substrate at which measurement of the position of a structure on the substrate was carried out.

2. The method according to claim 1, wherein the reference point is a support point of the substrate in the substrate holder.

3. The method according to claim 1, wherein a displacement of the substrate holder relative to the coordinate system of the coordinate measuring machine is determined.

4. The method according to claim 1, wherein a rotation of the substrate holder relative to the coordinate system of the coordinate measuring machine is determined.

5. The method according to claim 1, wherein a displacement and a rotation of the substrate holder are determined relative to the coordinate system of the coordinate measuring machine.

6. The method according to claim 1, wherein a calculation of the degree of bending of the substrate (2) is carried out with the finite-element method.