Wafer edge surface treatment with liquid meniscus

• US 7,584,761 B1
• Filed: 12/02/2005
• Issued: 09/08/2009
• Est. Priority Date: 06/30/2000
• Status: Expired due to Fees

• Current Assignee: Lam Research Corporation
• Original Assignee: Lam Research Corporation
• Inventors: de Larios, John M., Boyd, John M., Redeker, Fritz, Yun, Seokmin
• Primary Examiner(s): Barr; Michael
• Assistant Examiner(s): PATEL, RITA RAMESH
• Application Number:
  US11/292,465
• Time in Patent Office: 1,376 Days
• Field of Search: 134/1, 134/133, 134/94.1, 134/99.1, 134/166.R, 134/167.R, 134/198, 134/902
• US Class Current: 134/99.1
• CPC Class Codes: B08B 3/04 Cleaning involving contact with liquid
• CPC Class Codes: H01L 21/67028 for cleaning followed by drying, rinsing, stripping, blasting or the like
• CPC Class Codes: H01L 21/67034 for drying
• CPC Class Codes: H01L 21/67051 using mainly spraying means, e.g. nozzles

Abstract

A method for cleaning an edge surface of a semiconductor substrate is disclosed. The proximity head unit is positioned so that the flow head portion and the collection head portion of the proximity head unit are proximate to the edge surface of the semiconductor substrate. The semiconductor substrate is then rotated using one or more powered rollers. During the rotation of the semiconductor substrate, the flow head portion applies a fluid to the edge surface while the collection head portion collects fluid from the edge surface. Additional methods, an apparatuses, and a system for cleaning an edge surface of a semiconductor substrate are also described.

Claims

1. An apparatus used in the cleaning of an edge surface of a semiconductor substrate, the apparatus comprising:

a first portion configured to be disposed over a top edge surface of the semiconductor substrate, the first portion having a plurality of channels defined within the first portion, the plurality of channels extending from a top surface to a bottom surface of the first portion; and

a second portion configured to be disposed under a bottom edge surface of the semiconductor substrate, the second portion having a plurality of channels defined within the second portion, the plurality of channels extending from a top surface to a bottom surface of the second portion, the second portion substantially aligned with the first portion wherein a gap is defined between the top surface of the second portion and the bottom surface of the first portion, the gap enabling the semiconductor substrate to fit therein.

2. The apparatus used in the cleaning of an edge surface of a semiconductor substrate as recited in claim 1, wherein the top edge surface and the bottom edge surface extends radially over the semiconductor substrate about 5.0 millimeters (mm) from a bevel surface of the semiconductor substrate.

3. The apparatus used in the cleaning of an edge surface of a semiconductor substrate as recited in claim 1, wherein the first portion and the second portion define an annular ring having a top edge extending over a top edge surface of the semiconductor substrate and a bottom edge extending over a bottom edge surface of the semiconductor substrate.

4. The apparatus used in the cleaning of an edge surface of a semiconductor substrate as recited in claim 1, wherein the first portion and the second portion define a portion of an annular ring having a top edge extending over a top edge surface of the semiconductor substrate and a bottom edge extending over a bottom edge surface of the semiconductor substrate.

5. The apparatus used in the cleaning of an edge surface of a semiconductor substrate as recited in claim 1, wherein a manifold is attached to the first portion, the manifold distributing fluids to the plurality of channels defined in the first portion.

6. The apparatus used in the cleaning of an edge surface of a semiconductor substrate as recited in claim 1, wherein a manifold is attached to the second portion, the manifold distributing fluids to the plurality of channels defined in the second portion.

7. The apparatus used in the cleaning of an edge surface of a semiconductor substrate as recited in claim 1, wherein the first portion and second portion are connected to form an integrated portion, the integrated portion having a top edge extending over a top edge surface of the semiconductor substrate, a connecting section extending over a bevel surface of the semiconductor substrate, and a bottom edge extending over a bottom edge surface of the semiconductor substrate.

8. The apparatus used in the cleaning of an edge surface of a semiconductor substrate as recited in claim 1, wherein the first portion and the second portion are configured to move substantially parallel to an axis of rotation of the semiconductor substrate.